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公开(公告)号：US5844347A
公开(公告)日：1998-12-01
申请号：US704209
申请日：1996-08-29
CPC分类号： H03H9/6483 , H03H3/08 , H03H9/02897 , H03H9/02929 , H03H9/14538
摘要： A SAW device comprising an inter-digital electrode capable of withstanding application of excessive electric power, while preventing an increase of insertion loss. The SAW device has an inter-digital electrode formed by alternating layers of aluminum films and conductive films, where the conductive films have an elastic constant greater than that of the aluminum films.
摘要翻译： 一种SAW器件，其包括能够耐受过大电力施加的数字间电极，同时防止插入损耗的增加。 SAW器件具有通过铝膜和导电膜的交替层形成的数字间电极，其中导电膜的弹性常数大于铝膜的弹性常数。
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公开(公告)号：US07423222B2
公开(公告)日：2008-09-09
申请号：US10203970
申请日：2002-01-11
申请人： Toshio Sugawa , Satoshi Murakawa , Masaaki Hayama , Takeo Yasuho
发明人： Toshio Sugawa , Satoshi Murakawa , Masaaki Hayama , Takeo Yasuho
CPC分类号： H05K3/4069 , H05K1/095 , H05K2201/0305 , H05K2201/0317 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T428/24917
摘要： A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.
摘要翻译： 通过用导电材料填充形成在绝缘基板中的通孔来制造电路板，在绝缘基板的两侧设置导电层，以及将导电材料的组分材料的合金与导电层的成分材料形成。 因此，在电路板中，填充在形成于绝缘基板上的通路孔中的导电材料与绝缘基板两侧的导电层电连接并且机械地牢固地连接在一起，具有高可靠性。
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公开(公告)号：US06565954B2
公开(公告)日：2003-05-20
申请号：US09728286
申请日：2000-12-01
IPC分类号： B32B300
CPC分类号： H05K3/20 , H05K3/007 , H05K3/205 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K3/4658 , H05K3/4688 , H05K2201/0116 , H05K2201/0195 , H05K2201/10378 , H05K2203/0152 , H05K2203/0384 , H05K2203/061 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/2804
摘要： Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate, which are then heated and pressurized. After that, the supporting bases are removed, thus obtaining a circuit board in which the wiring layers have been embedded in the adhesive layers. The conductor within the through holes are compressed sufficiently, thus forming minute via holes with high reliability.
摘要翻译： 形成在其两面具有粘合层的电绝缘基板中的通孔填充有导体。 然后，将具有预定图案的布线层的支撑基板层压在电绝缘基板的两个表面上，然后被加热和加压。 之后，除去支撑基底，从而获得其中布线层已经嵌入粘合剂层中的电路板。 通孔内的导体被充分压缩，从而形成具有高可靠性的微通孔。
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公开(公告)号：US4185291A
公开(公告)日：1980-01-22
申请号：US916818
申请日：1978-06-16
IPC分类号： H01L29/80 , H01L21/265 , H01L21/337 , H01L29/808
CPC分类号： H01L29/808
摘要： A junction-type FET comprising a semiconductor substrate 21 of a first conductivity type, and island region 22 of a second conductivity type which comprises a channel region and is selectively formed in the semiconductor substrate 21, and a buried isolating region 27 which is selected from the group consisting of an intrinsic layer, a low impurity concentration layer of the second conductivity type and a layer of first conductivity type, the buried isolating layer being formed by ion implantation of impurities of the first conductivity type in the island region 22 while keeping the impurity concentration at the surface thereof relatively high, and the buried isolating layer substantially isolating the channel region from the surface.
摘要翻译： 包括第一导电类型的半导体衬底21和包括沟道区并且选择性地形成在半导体衬底21中的第二导电类型的岛状区域22的结型FET，以及选自 由第二导电类型的本征层，低杂质浓度层和第一导电类型的层组成的组，所述掩埋隔离层通过在岛状区域22中离子注入第一导电类型的杂质而形成，同时保持 表面上的杂质浓度相对较高，并且掩埋隔离层基本上使沟道区域与表面隔离。
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公开(公告)号：US20100025099A1
公开(公告)日：2010-02-04
申请号：US12461320
申请日：2009-08-07
申请人： Toshio Sugawa , Satoshi Murakawa , Masaaki Hayama , Takeo Yasuho
发明人： Toshio Sugawa , Satoshi Murakawa , Masaaki Hayama , Takeo Yasuho
CPC分类号： H05K3/4069 , H05K1/095 , H05K2201/0305 , H05K2201/0317 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T428/24917
摘要： A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.
摘要翻译： 通过用导电材料填充形成在绝缘基板中的通孔来制造电路板，在绝缘基板的两侧设置导电层，以及将导电材料的组分材料的合金与导电层的成分材料形成。 因此，在电路板中，填充在形成于绝缘基板上的通路孔中的导电材料与绝缘基板两侧的导电层电连接并且机械地牢固地连接在一起，具有高可靠性。
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公开(公告)号：US07197820B2
公开(公告)日：2007-04-03
申请号：US10250871
申请日：2002-10-30
申请人： Toshio Sugawa , Yoshihisa Takase
发明人： Toshio Sugawa , Yoshihisa Takase
CPC分类号： H05K3/108 , H05K3/062 , H05K3/384 , H05K3/4069 , H05K3/4614 , H05K2201/0355 , H05K2203/0307 , H05K2203/0353 , H05K2203/0361 , H05K2203/072 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156
摘要： A circuit board is provided in which peeling strength is prevented from decreasing and a connection resistance to a conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has a metal film for covering a through hole on at least one surface of an insulating substrate having the through hole filled with the conductive material. An uneven layer with a thickness of 5 μm or more is formed on a surface of the metal film, and a metal layer is formed on the opposite surface to the uneven layer.
摘要翻译： 尽管当电路板具有铜箔时接触面积减小，但是提供了一种电路板，其中防止剥离强度降低并且防止对导电材料的连接电阻增加。 该电路板具有金属膜，用于在绝缘基板的至少一个表面上覆盖具有填充有导电材料的通孔的通孔。 在金属膜的表面上形成厚度5μm以上的不均匀层，在与凹凸层相反的面上形成金属层。
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公开(公告)号：US20060054350A1
公开(公告)日：2006-03-16
申请号：US11203124
申请日：2005-08-15
申请人： Toshio Sugawa , Hideki Higashitani , Takumi Misaki
发明人： Toshio Sugawa , Hideki Higashitani , Takumi Misaki
IPC分类号： H05K1/03
CPC分类号： H05K1/0242 , H05K1/0237 , H05K3/108 , H05K3/181 , H05K3/24 , H05K3/381 , H05K3/383 , H05K3/384 , H05K3/4069 , H05K2201/0338 , H05K2201/0355 , H05K2201/098 , H05K2203/0307 , H05K2203/0392 , Y10T29/49126 , Y10T29/49128 , Y10T29/49133
摘要： A circuit board includes an insulating substrate, a first conductive layer on the insulating substrate, a second conductive layer on the first conductive layer, and a third conductive layer covering the first conductive layer and the second conductive layer. The first conductive layer has a surface provided on the surface of the insulating substrate, and a surface having a width smaller than a width of the above surface. In this circuit board, the conductive layers have small impedances even if a high-frequency signal flows in the conductive layers.
摘要翻译： 电路板包括绝缘基板，绝缘基板上的第一导电层，第一导电层上的第二导电层和覆盖第一导电层和第二导电层的第三导电层。 第一导电层具有设置在绝缘基板的表面上的表面和宽度小于上述表面的宽度的表面。 在该电路板中，即使高频信号在导电层中流动，导电层也具有小的阻抗。
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公开(公告)号：US20090229862A1
公开(公告)日：2009-09-17
申请号：US11577957
申请日：2006-11-07
申请人： Tadashi Nakamura , Fumio Echigo , Shogo Hirai , Toshio Sugawa
发明人： Tadashi Nakamura , Fumio Echigo , Shogo Hirai , Toshio Sugawa
CPC分类号： H05K3/4614 , H01L23/49822 , H01L2924/0002 , H05K3/4069 , H05K3/4602 , H05K3/462 , H05K3/4623 , H05K3/4658 , H05K2201/10378 , H05K2203/061 , Y10T156/1092 , H01L2924/00
摘要： A plurality of double-sided boards using a film are attached to each other with a paste coupling layer sandwiched therebetween. In the paste coupling layer, a conductive paste is filled into a through hole formed in provisionally hardened resin, which is hardened. At the same time, second wirings are electrically coupled to each other by using the hardened conductive paste filled in the through holes that have been previously formed in the paste coupling layer. Thus, it is possible to provide a thinned multilayer printed wiring board without using an adhesive.
摘要翻译： 使用薄膜的多个双面板以夹在其间的糊状耦合层彼此附接。 在糊状偶联层中，将导电性糊剂填充到硬化树脂中形成的通孔中。 同时，第二布线通过使用填充在预先形成在糊状耦合层中的通孔中的硬化导电膏而彼此电耦合。 因此，可以在不使用粘合剂的情况下提供变薄的多层印刷线路板。
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公开(公告)号：US06197407B1
公开(公告)日：2001-03-06
申请号：US09304714
申请日：1999-05-04
IPC分类号： B32B300
CPC分类号： H05K3/20 , H05K3/007 , H05K3/205 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/4623 , H05K3/4658 , H05K3/4688 , H05K2201/0116 , H05K2201/0195 , H05K2201/10378 , H05K2203/0152 , H05K2203/0384 , H05K2203/061 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/2804
摘要： Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate, which are then heated and pressurized. After that, the supporting bases are removed, thus obtaining a circuit board in which the wiring layers have been embedded in the adhesive layers. The conductor within the through holes are compressed sufficiently, thus forming minute via holes with high reliability.
摘要翻译： 形成在其两面具有粘合层的电绝缘基板中的通孔填充有导体。 然后，将具有预定图案的布线层的支撑基板层压在电绝缘基板的两个表面上，然后被加热和加压。 之后，除去支撑基底，从而获得其中布线层已经嵌入粘合剂层中的电路板。 通孔内的导体被充分压缩，从而形成具有高可靠性的微通孔。
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公开(公告)号：US20080121416A1
公开(公告)日：2008-05-29
申请号：US11666607
申请日：2006-10-19
申请人： Shogo Hirai , Fumio Echigo , Tadashi Nakamura , Toshio Sugawa
发明人： Shogo Hirai , Fumio Echigo , Tadashi Nakamura , Toshio Sugawa
CPC分类号： H05K3/4614 , H05K3/4069 , H05K3/4602 , H05K3/462 , H05K3/4644 , H05K3/4658 , H05K2201/10378 , H05K2203/061 , Y10T29/49117
摘要： In a case of multilayer circuit boards where a plurality of conventional films are used as insulating layers, the films are connected with each other using an adhesive, and therefore, the adhesive sometimes negatively affects reduction in thickness. Therefore, a plurality of two-sided boards with films used therein are pasted together with a paste connection layer interposed therebetween, the paste connection layer being configured such that through holes formed in a prepreg are filled in with a conductive paste which is then cured, and second wires are electrically connected with each other through the conductive paste with which the through holes formed in the paste connection layer in advance are filled in, and thus, a multilayer board can be provided without using an adhesive, and the entirety of the multilayer circuit board can be reduced in thickness.
摘要翻译： 在使用多个常规膜作为绝缘层的多层电路板的情况下，使用粘合剂将膜彼此连接，因此粘合剂有时不利地影响厚度的减小。 因此，其中使用其中的膜的多个双面板被粘合在一起，其间插入有粘合剂连接层，糊状连接层被构造成使得形成在预浸料中的通孔用导电浆料填充，然后固化， 并且第二导线通过预先形成在糊状连接层中的通孔的导电膏彼此电连接，因此可以不使用粘合剂而提供多层板，并且整个多层 电路板的厚度可以减小。
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