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    THERMAL MEASURMENTS OF ELECTRONIC DEVICES DURING OPERATION
    1.
    发明申请
    THERMAL MEASURMENTS OF ELECTRONIC DEVICES DURING OPERATION 失效
    电子设备在运行期间的热量测量

    公开(公告)号：US20050114068A1

    公开(公告)日：2005-05-26

    申请号：US10699123

    申请日：2003-10-30

    申请人： S. Chey ,  Hendrik Hamann ,  James Lacey ,  James Vichiconti ,  Robert von Gutfeld

    发明人： S. Chey ,  Hendrik Hamann ,  James Lacey ,  James Vichiconti ,  Robert von Gutfeld

    IPC分类号： G01K1/02 ,  G01K1/00

    CPC分类号： G01K1/026

    摘要： A system and method for measuring thermal distributions of an electronic device during operation is disclosed. The system includes an electronic device, a heat sink adjacent to the electronic device and an electrical-insulating layer disposed on the electronic device so as to separate the electronic device and the heat sink. The system further includes a plurality of thermal sensors located on the electrical-insulating layer, each of the plurality of thermal sensors in a different location. The plurality of thermal sensors is located within one or more thin film circuit layers disposed adjacent to the electrical insulating layer. The system further includes a module for receiving thermal information from the plurality of thermal sensors during operation of the electronic device. The system further includes a processor coupled to the module for generating a thermal distribution of the electronic device based on the thermal information received from the plurality of thermal sensors.

    摘要翻译： 公开了一种用于测量操作期间电子设备的热分布的系统和方法。 该系统包括电子设备，与电子设备相邻的散热器以及设置在电子设备上以分离电子设备和散热器的电绝缘层。 该系统还包括位于电绝缘层上的多个热传感器，多个热传感器中的每一个处于不同的位置。 多个热传感器位于邻近电绝缘层设置的一个或多个薄膜电路层内。 该系统还包括用于在电子设备的操作期间从多个热传感器接收热信息的模块。 该系统还包括耦合到模块的处理器，用于基于从多个热传感器接收的热信息产生电子设备的热分布。

    Method and system for measuring temperature and power distributions of a device in a package
    2.
    发明申请
    Method and system for measuring temperature and power distributions of a device in a package 失效
    用于测量包装中的装置的温度和功率分布的方法和系统

    公开(公告)号：US20060039114A1

    公开(公告)日：2006-02-23

    申请号：US10919692

    申请日：2004-08-17

    申请人： Hendrik Hamann ,  James Lacey ,  Martin O'Boyle ,  Robert von Gutfeld ,  Jamil Wakil ,  Alan Weger

    发明人： Hendrik Hamann ,  James Lacey ,  Martin O'Boyle ,  Robert von Gutfeld ,  Jamil Wakil ,  Alan Weger

    IPC分类号： H05K7/20

    CPC分类号： H01L22/34 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.

    摘要翻译： 本发明提供了完全操作的电子设备的实时温度和功率映射。 该方法利用红外（IR）温度成像，而IR透明冷却剂直接通过电子设备流经专门设计的单元。 为了确定芯片功率分布，在相同的冷却条件下测量芯片上给定功率和尺寸（通过扫描聚焦激光束实现）的每个热源的各个温度场。 然后，测量的芯片温度分布被表示为这些单个热源的温度场的叠加，并且用一组线性方程计算相应的功率分布。

    Transparent cooling duct
    3.
    发明申请
    Transparent cooling duct 审中-公开
    透明冷却管道

    公开(公告)号：US20050094706A1

    公开(公告)日：2005-05-05

    申请号：US10699399

    申请日：2003-10-30

    申请人： Supratik Guha ,  Hendrik Hamann ,  James Lacey ,  Maurice McGlashan-Powell ,  Martin O'Boyle ,  Robert von Gutfeld

    发明人： Supratik Guha ,  Hendrik Hamann ,  James Lacey ,  Maurice McGlashan-Powell ,  Martin O'Boyle ,  Robert von Gutfeld

    IPC分类号： G01J5/00 ,  G01K3/00

    CPC分类号： G01J5/00 ,  G01J5/0096 ,  G01J2005/0077

    摘要： A system and method for measuring the thermal distributions of an electronic device during operation is described. In an embodiment of the present invention, the system includes a duct adapted to be coupled with an electronic device and a coolant flowing through the duct so as to cool the electronic device. The duct and the coolant are at least partially transparent to photons with wavelengths between about 0.1 micron to 20 microns. The system further includes a photon detector located adjacent to the duct for detecting photons. The photon detector captures thermal information from the electronic device during operation of the electronic device, wherein the electronic device is operating under conditions for which the electronic device is designed. The system further includes a processor coupled to the photon detector for generating a thermal distribution of the electronic device based on information received from the photon detector.

    摘要翻译： 描述了用于测量操作期间电子设备的热分布的系统和方法。 在本发明的一个实施例中，系统包括适于与电子设备耦合的管道和流过管道的冷却剂以冷却电子设备。 管道和冷却剂对波长在约0.1微米至20微米之间的光子至少部分透明。 该系统还包括位于与用于检测光子的管道相邻的光子检测器。 光子检测器在电子设备的操作期间捕获来自电子设备的热信息，其中电子设备在设计电子设备的条件下操作。 该系统还包括耦合到光子检测器的处理器，用于基于从光子检测器接收的信息产生电子设备的热分布。

    METHOD AND APPARATUS FOR DETECTING LEAKS IN A FLUID COOLING SYSTEM
    5.
    发明申请
    METHOD AND APPARATUS FOR DETECTING LEAKS IN A FLUID COOLING SYSTEM 失效
    用于检测流体冷却系统中的泄漏的方法和装置

    公开(公告)号：US20060042358A1

    公开(公告)日：2006-03-02

    申请号：US10928396

    申请日：2004-08-27

    申请人： Robert Von Gutfeld ,  Hendrik Hamann ,  Jeffrey Gelorme

    发明人： Robert Von Gutfeld ,  Hendrik Hamann ,  Jeffrey Gelorme

    IPC分类号： G01M3/04

    CPC分类号： G01M3/04 ,  G01M3/188

    摘要： One embodiment of the present method and apparatus for detecting leaks in a fluid cooling system enables a user to rapidly detect fluid leaks in the vicinity of a microprocessor chip or other delicate item. In one embodiment, the invention comprises a detector and a border coupled to the detector and disposed peripherally about a protected item (e.g., the microprocessor chip or other delicate item). In one embodiment, the border is a layered structure that is adapted to complete an electrical circuit with the detector when the border comes into contact with fluid.

    摘要翻译： 用于检测流体冷却系统中的泄漏的本方法和装置的一个实施例使得用户能够快速检测微处理器芯片附近或其它微妙物品的流体泄漏。 在一个实施例中，本发明包括检测器和耦合到检测器的边界，并围绕受保护物品（例如，微处理器芯片或其它精细物品）周边设置。 在一个实施例中，边界是分层结构，其适于在边界与流体接触时与检测器完成电路。