公开(公告)号：US20190198486A1

公开(公告)日：2019-06-27

申请号：US15969359

申请日：2018-05-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Chan KIM ,  Yong Ho BAEK ,  Moon Il KIM ,  Young Sik HUR ,  Tae Hee HAN

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L25/105 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/16 ,  H01L25/0652 ,  H01L27/108 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A fan-out semiconductor package includes first and second structures. The first structure includes a first semiconductor chip, a first encapsulant, and a connection member. The second structure includes a second semiconductor chip, a second encapsulant, and conductive bumps. The first and second structures are disposed so that active surfaces of the first and second semiconductor chips face each other. The conductive bumps are electrically connected to a redistribution layer, and connection pads of the first and second semiconductor chips are connected to each other through the redistribution layer in a signal manner. Signal transmission times between one point of the redistribution layer and connection pads of each of the first and second semiconductor chips are substantially the same as each other.

公开(公告)号：US20180076156A1

公开(公告)日：2018-03-15

申请号：US15468606

申请日：2017-03-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Chan KIM ,  Yong Ho BAEK

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L25/065

CPC classification number: H01L24/02 ,  H01L23/293 ,  H01L23/3178 ,  H01L24/17 ,  H01L25/0657 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/1712 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06582

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a processor chip disposed in the through-hole; a memory chip disposed in the through-hole and including a plurality of dies stacked on each other; an encapsulant encapsulating at least portions of the first interconnection member, the memory chip, and the processor chip; and a second interconnection member disposed on the first interconnection member, an active surface of the memory chip, and an active surface of the processor chip. The first interconnection member and the second interconnection member respectively include redistribution layers electrically connected to connection pads of the processor chip and connection pads of the memory chip, and the connection pads of the processor chip and the connection pads of the memory chip are electrically connected to each other by the redistribution layer of the second interconnection member.

公开(公告)号：US20190140011A1

公开(公告)日：2019-05-09

申请号：US15962512

申请日：2018-04-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Chan KIM ,  Yong Ho BAEK

IPC: H01L27/146 ,  H01L23/48 ,  H01L23/00

Abstract: The fan-out sensor package includes: a core member having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole and having a first surface having a sensor region and first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon vias (TSVs) penetrating between the first and second surfaces and electrically connecting the first and second connection pads to each other; an encapsulant covering the core member and the second surface of the IC for a sensor and filling at least portions of the through-hole; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.

公开(公告)号：US20180145033A1

公开(公告)日：2018-05-24

申请号：US15663042

申请日：2017-07-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Hee YI ,  Byoung Chan KIM ,  Yong Ho BAEK ,  Jung Hyun CHO

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/5389 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5384 ,  H01L24/02 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/13024 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/25171 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, at least one component-embedded substrate disposed adjacent the semiconductor chip in the through-hole and spaced apart from the semiconductor chip by a predetermined distance and having a plurality of passive components embedded therein, an encapsulant encapsulating at least portions of the first connection member, the at least one component-embedded substrate, and the semiconductor chip, and a second connection member disposed on the first connection member, the at least one component-embedded substrate, and the semiconductor chip. The first and second connection members each include redistribution layers electrically connected to the connection pads of the semiconductor chip, and the plurality of passive components embedded in the at least one component-embedded substrate are electrically connected to the connection pads of the semiconductor chip through the redistribution layer of the second connection member.

公开(公告)号：US20180102332A1

公开(公告)日：2018-04-12

申请号：US15837611

申请日：2017-12-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Chan KIM ,  Yong Ho BAEK

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/29

CPC classification number: H01L24/02 ,  H01L23/293 ,  H01L23/3178 ,  H01L24/17 ,  H01L25/0657 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/1712 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06582

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a processor chip disposed in the through-hole; a memory chip disposed in the through-hole and including a plurality of dies stacked on each other; an encapsulant encapsulating at least portions of the first interconnection member, the memory chip, and the processor chip; and a second interconnection member disposed on the first interconnection member, an active surface of the memory chip, and an active surface of the processor chip. The first interconnection member and the second interconnection member respectively include redistribution layers electrically connected to connection pads of the processor chip and connection pads of the memory chip, and the connection pads of the processor chip and the connection pads of the memory chip are electrically connected to each other by the redistribution layer of the second interconnection member.

公开(公告)号：US20180232556A1

公开(公告)日：2018-08-16

申请号：US15951677

申请日：2018-04-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Jung Hyun CHO ,  Byoung Chan KIM

IPC: G06K9/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/768

CPC classification number: G06K9/00053 ,  G06K9/0002 ,  H01L21/561 ,  H01L21/568 ,  H01L21/768 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L24/26 ,  H01L2224/0235 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05559 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/16238 ,  H01L2224/18 ,  H01L2224/20 ,  H01L2224/221 ,  H01L2224/24155 ,  H01L2224/244 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2924/15153

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member and the second connection member respectively include first redistribution layers and second redistribution layers electrically connected to the connection pads and formed of one or more layers, at least one of the first redistribution layers is disposed between a plurality of insulating layers of the first connection member, and at least one of the second redistribution layers includes sensor patterns recognizing a fingerprint.

公开(公告)号：US20180053036A1

公开(公告)日：2018-02-22

申请号：US15663304

申请日：2017-07-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Jung Hyun CHO ,  Byoung Chan KIM

IPC: G06K9/00 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31

CPC classification number: G06K9/00053 ,  G06K9/0002 ,  H01L21/561 ,  H01L21/568 ,  H01L21/768 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L24/26 ,  H01L2224/0235 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05559 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/16238 ,  H01L2224/18 ,  H01L2224/20 ,  H01L2224/221 ,  H01L2224/24155 ,  H01L2224/244 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2924/15153

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member and the second connection member respectively include first redistribution layers and second redistribution layers electrically connected to the connection pads and formed of one or more layers, at least one of the first redistribution layers is disposed between a plurality of insulating layers of the first connection member, and at least one of the second redistribution layers includes sensor patterns recognizing a fingerprint.