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    LIGHT EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    LIGHT EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    发光装置模块及其制造方法

    公开(公告)号：US20140299898A1

    公开(公告)日：2014-10-09

    申请号：US14310885

    申请日：2014-06-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hak Hwan KIM ,  Kyung Mi MOON ,  Ho Sun PAEK ,  Young Hee SONG

    IPC: H01L33/50 ,  H01L33/58 ,  H01L27/15

    CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

    Abstract: A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.

    Abstract translation: 提供了可应用于各种应用的发光器件（LED）模块及其制造方法。 通过将LED和透镜单元直接安装在基板上，LED模块可以小型化，并且通过降低LED模块的不合格率和增加的产量，可以提高价格竞争力。 在制造LED模块的方法中，通过直接安装LED和具有各种形状的多个透镜单元，共同形成多个透镜单元，以及通过在晶片级上执行操作，可以最小化和简化操作。 可以通过使用金属材料作为基板和凸块来增强散热特性。

    ELECTRONIC DEVICE PACKAGE AND PACKAGE SUBSTRATE FOR THE SAME
    2.
    发明申请
    ELECTRONIC DEVICE PACKAGE AND PACKAGE SUBSTRATE FOR THE SAME 有权
    电子设备包装和包装基材

    公开(公告)号：US20140306261A1

    公开(公告)日：2014-10-16

    申请号：US14251170

    申请日：2014-04-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sung Jun IM ,  Min Young SON ,  Yong Min KWON ,  Hak Hwan KIM

    IPC: H01L33/62

    CPC classification number: H01L33/62 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/5384 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/0557 ,  H01L2224/13 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2933/0033

    Abstract: There is provided an electronic device package including an electronic device including a first electrode and a second electrode disposed on a surface thereof, a package substrate having a first surface having the electronic device mounted thereon and a second surface opposed to the first surface. The package substrate includes a first electrode pattern and a second electrode pattern electrically connected to the first electrode and the second electrode on the first surface, respectively. The package substrate further includes at least one via hole disposed outside of a region for mounting the electronic device and an irregular portion disposed on the first surface to be adjacent to the via hole.

    Abstract translation: 提供了一种电子器件封装，其包括电子器件，其包括设置在其表面上的第一电极和第二电极，具有安装在其上的电子器件的第一表面和与第一表面相对的第二表面的封装衬底。 封装衬底包括分别电连接到第一电极和第一表面上的第二电极的第一电极图案和第二电极图案。 封装基板还包括设置在用于安装电子器件的区域的外侧的至少一个通孔和设置在与通孔相邻的第一表面上的不规则部分。

    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    发光装置及其制造方法

    公开(公告)号：US20150060925A1

    公开(公告)日：2015-03-05

    申请号：US14532866

    申请日：2014-11-04

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hak Hwan KIM ,  Ho Sun PAEK ,  Hyung Kun KIM ,  Sung Kyong OH ,  Jong In YANG

    IPC: H01L33/58

    CPC classification number: H01L33/58 ,  H01L33/0095 ,  H01L33/382 ,  H01L33/385

    Abstract: Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.

    Abstract translation: 公开了一种发光器件及其制造方法。 发光装置包括：基板; 发光结构，其设置在所述基板上，并具有其中层叠有第一导电类型半导体层，有源层和第二导电类型半导体层的堆叠结构; 设置在所述发光结构上的透镜; 以及分别电连接到第一导电类型半导体层和第二导电类型半导体层的第一端子部分和第二端子部分。 第一和第二端子部分中的至少一个从发光结构的顶表面沿着发光结构和基板的相应侧表面延伸。

    METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE
    5.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE 审中-公开
    制造半导体发光器件封装的方法

    公开(公告)号：US20140377894A1

    公开(公告)日：2014-12-25

    申请号：US14297199

    申请日：2014-06-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yong Min KWON ,  Jung Jin KIM ,  Hak Hwan KIM ,  Sung Jun IM

    IPC: H01L33/56 ,  H01L33/60

    CPC classification number: H01L33/56 ,  H01L27/153 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/32 ,  H01L33/382 ,  H01L33/60 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

    Abstract: A method of manufacturing a semiconductor light emitting device package includes providing a wafer and forming, on the wafer, a semiconductor laminate comprising a plurality of light emitting devices. Electrodes are formed in respective light emitting device regions of the semiconductor laminate. A curable resin is applied to a surface of the semiconductor laminate on which the electrodes are formed. A support structure is formed for supporting the semiconductor laminate by curing the curable resin. Through holes are formed in the support structure to expose the electrodes therethrough. Connection electrodes are formed in the support structure to be connected to the exposed electrodes.

    Abstract translation: 制造半导体发光器件封装的方法包括提供晶片并在晶片上形成包括多个发光器件的半导体层叠体。 电极形成在半导体层叠体的各个发光器件区域中。 将可固化树脂施加到其上形成有电极的半导体层叠体的表面上。 形成用于通过固化可固化树脂来支撑半导体层压体的支撑结构。 在支撑结构中形成通孔以使电极暴露于其中。 在支撑结构中形成连接电极以连接到暴露的电极。

    FLIP CHIP LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    FLIP CHIP LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
    FLIP芯片发光器件封装及其制造方法

    公开(公告)号：US20140120641A1

    公开(公告)日：2014-05-01

    申请号：US14148365

    申请日：2014-01-06

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kwon Joong KIM ,  Ho Sun PAEK ,  Hak Hwan KIM

    IPC: H01L33/48

    CPC classification number: H01L33/486 ,  H01L33/36 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2933/0016

    Abstract: A flip chip light emitting device (LED) package and a manufacturing method thereof are provided. The flip chip LED package includes a package substrate including a cavity that exposes a circuit pattern, and a chip mounting portion disposed on a bottom surface of the cavity; a solder layer disposed on the circuit pattern; a bonding tape layer disposed on the chip mounting portion; and an LED including a bonding object region and a plurality of electrode pads disposed on one surface, being mounted on the package substrate such that the plurality of electrode pads are bonded to the solder layer and the bonding object region is bonded to the bonding tape layer

    Abstract translation: 提供了一种倒装芯片发光器件（LED）封装及其制造方法。 倒装芯片LED封装包括包括暴露电路图案的空腔的封装基板和设置在空腔的底表面上的芯片安装部分; 设置在电路图案上的焊料层; 粘合带层，设置在所述芯片安装部分上; 以及包括粘合对象区域和设置在一个表面上的多个电极焊盘的LED，安装在封装基板上，使得多个电极焊盘接合到焊料层，并且焊接对象区域接合到接合带层

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