Abstract:
A data alignment circuit of a semiconductor memory device including: a data sampling circuit configured to receive a data sequence and an internal data strobe signal, wherein the data sampling circuit samples the data sequence based on the internal data strobe signal to generate first and second data sequences; a division circuit configured to receive a clock signal and the internal data strobe signal, divide the clock signal to produce a divided clock signal and output an alignment control signal by sampling the divided clock signal based on the internal data strobe signal; and a data alignment block configured to receive the first and second data sequences, and the alignment control signal, and align the first and second data sequences in parallel to output internal data.
Abstract:
A memory device includes: a first clock receiver configured to receive a first clock signal; a second clock receiver configured to receive a second clock signal when data is input or output, wherein the second clock signal has a first clock frequency in a preamble period, and has a second clock frequency different from the first clock frequency after the preamble period; a command decoder configured to receive a clock synchronization command synchronized with the first clock signal and generate a clock synchronization signal, wherein the clock synchronization signal is generated during the preamble period; and a clock synchronizing circuit configured to generate a plurality of division clock signals in response to the second clock signal, latch the clock synchronization signal during the preamble period, and selectively provide the plurality of division clock signals as internal data clock signals according to a result of the latching.
Abstract:
A memory device includes: a first clock receiver configured to receive a first clock signal; a second clock receiver configured to receive a second clock signal when data is input or output, wherein the second clock signal has a first clock frequency in a preamble period, and has a second clock frequency different from the first clock frequency after the preamble period; a command decoder configured to receive a clock synchronization command synchronized with the first clock signal and generate a clock synchronization signal, wherein the clock synchronization signal is generated during the preamble period; and a clock synchronizing circuit configured to generate a plurality of division clock signals in response to the second clock signal, latch the clock synchronization signal during the preamble period, and selectively provide the plurality of division clock signals as internal data clock signals according to a result of the latching.
Abstract:
A method of operating a semiconductor memory device including a plurality of pins configured to transfer data and signals from/to an outside of the semiconductor memory device, a memory cell array and a control logic circuit to control access to the memory cell array. A write command synchronized with a main clock signal and data synchronized with a data clock signal are received from outside of the semiconductor memory device, the data is stored in the memory cell array based on a frequency-divided data clock signal, data is read from the memory cell array in response to a read command and a target address received from the outside of the semiconductor memory device, and the read data is transmitted to the outside of the semiconductor memory device selectively with a strobe signal generated based on a frequency of the main clock signal.
Abstract:
A memory device includes: a first clock receiver configured to receive a first clock signal; a second clock receiver configured to receive a second clock signal when data is input or output, wherein the second clock signal has a first clock frequency in a preamble period, and has a second clock frequency different from the first clock frequency after the preamble period; a command decoder configured to receive a clock synchronization command synchronized with the first clock signal and generate a clock synchronization signal, wherein the clock synchronization signal is generated during the preamble period; and a clock synchronizing circuit configured to generate a plurality of division clock signals in response to the second clock signal, latch the clock synchronization signal during the preamble period, and selectively provide the plurality of division clock signals as internal data clock signals according to a result of the latching.
Abstract:
A semiconductor memory device that includes a command decoder, a refresh controller, an oscillator and a delay unit. The command decoder generates a self refresh command, and the oscillator generates an oscillation signal. The refresh controller generates a refresh control signal and a recovery signal in response to the self refresh command and the oscillation signal. The delay unit transitions internal nodes included in the delay unit that are not transitioned during a refresh period in response to the refresh control signal and the recovery signal.
Abstract:
A memory device includes: a first clock receiver configured to receive a first clock signal; a second clock receiver configured to receive a second clock signal when data is input or output, wherein the second clock signal has a first clock frequency in a preamble period, and has a second clock frequency different from the first clock frequency after the preamble period; a command decoder configured to receive a clock synchronization command synchronized with the first clock signal and generate a clock synchronization signal, wherein the clock synchronization signal is generated during the preamble period; and a clock synchronizing circuit configured to generate a plurality of division clock signals in response to the second clock signal, latch the clock synchronization signal during the preamble period, and selectively provide the plurality of division clock signals as internal data clock signals according to a result of the latching.
Abstract:
In a method of operating a semiconductor memory device including a memory cell array and a control logic circuit configured to control access to the memory cell array, data synchronized with a differential data clock signal is received from an external memory controller, the data is stored in the memory cell array based on a frequency-divided data clock signal from which the differential data clock signal is divided, data is read from the memory cell array in response to a read command and a target address from the memory controller, and the read data is transmitted to the memory controller with one of a single strobe signal and a differential strobe signal according to a strobe mode of the semiconductor memory device.
Abstract:
A clock synchronization circuit includes a delay-locked loop (DLL) and a delay-locked control unit. The DLL is configured to generate an output clock signal by delaying an input clock signal by a delay time, and to execute a delay-locking operation in which the delay time is adjusted to a locked state according to a comparison between the output clock signal and the input clock signal. The delay-locked control unit configured to detect the locked state of the DLL, and to control the DLL based on the determined locked state.
Abstract:
A memory device includes: a first clock receiver configured to receive a first clock signal; a second clock receiver configured to receive a second clock signal when data is input or output, wherein the second clock signal has a first clock frequency in a preamble period, and has a second clock frequency different from the first clock frequency after the preamble period; a command decoder configured to receive a clock synchronization command synchronized with the first clock signal and generate a clock synchronization signal, wherein the clock synchronization signal is generated during the preamble period; and a clock synchronizing circuit configured to generate a plurality of division clock signals in response to the second clock signal, latch the clock synchronization signal during the preamble period, and selectively provide the plurality of division clock signals as internal data clock signals according to a result of the latching.