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    METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE
    2.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE 审中-公开
    制造半导体发光器件封装的方法

    公开(公告)号：US20140377894A1

    公开(公告)日：2014-12-25

    申请号：US14297199

    申请日：2014-06-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yong Min KWON ,  Jung Jin KIM ,  Hak Hwan KIM ,  Sung Jun IM

    IPC: H01L33/56 ,  H01L33/60

    CPC classification number: H01L33/56 ,  H01L27/153 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/32 ,  H01L33/382 ,  H01L33/60 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

    Abstract: A method of manufacturing a semiconductor light emitting device package includes providing a wafer and forming, on the wafer, a semiconductor laminate comprising a plurality of light emitting devices. Electrodes are formed in respective light emitting device regions of the semiconductor laminate. A curable resin is applied to a surface of the semiconductor laminate on which the electrodes are formed. A support structure is formed for supporting the semiconductor laminate by curing the curable resin. Through holes are formed in the support structure to expose the electrodes therethrough. Connection electrodes are formed in the support structure to be connected to the exposed electrodes.

    Abstract translation: 制造半导体发光器件封装的方法包括提供晶片并在晶片上形成包括多个发光器件的半导体层叠体。 电极形成在半导体层叠体的各个发光器件区域中。 将可固化树脂施加到其上形成有电极的半导体层叠体的表面上。 形成用于通过固化可固化树脂来支撑半导体层压体的支撑结构。 在支撑结构中形成通孔以使电极暴露于其中。 在支撑结构中形成连接电极以连接到暴露的电极。

    ELECTRONIC DEVICE PACKAGE AND PACKAGE SUBSTRATE FOR THE SAME
    3.
    发明申请
    ELECTRONIC DEVICE PACKAGE AND PACKAGE SUBSTRATE FOR THE SAME 有权
    电子设备包装和包装基材

    公开(公告)号：US20140306261A1

    公开(公告)日：2014-10-16

    申请号：US14251170

    申请日：2014-04-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sung Jun IM ,  Min Young SON ,  Yong Min KWON ,  Hak Hwan KIM

    IPC: H01L33/62

    CPC classification number: H01L33/62 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/5384 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/0557 ,  H01L2224/13 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2933/0033

    Abstract: There is provided an electronic device package including an electronic device including a first electrode and a second electrode disposed on a surface thereof, a package substrate having a first surface having the electronic device mounted thereon and a second surface opposed to the first surface. The package substrate includes a first electrode pattern and a second electrode pattern electrically connected to the first electrode and the second electrode on the first surface, respectively. The package substrate further includes at least one via hole disposed outside of a region for mounting the electronic device and an irregular portion disposed on the first surface to be adjacent to the via hole.

    Abstract translation: 提供了一种电子器件封装，其包括电子器件，其包括设置在其表面上的第一电极和第二电极，具有安装在其上的电子器件的第一表面和与第一表面相对的第二表面的封装衬底。 封装衬底包括分别电连接到第一电极和第一表面上的第二电极的第一电极图案和第二电极图案。 封装基板还包括设置在用于安装电子器件的区域的外侧的至少一个通孔和设置在与通孔相邻的第一表面上的不规则部分。

    ELECTRONIC DEVICE PACKAGE AND PACKAGING SUBSTRATE FOR THE SAME
    4.
    发明申请
    ELECTRONIC DEVICE PACKAGE AND PACKAGING SUBSTRATE FOR THE SAME 有权
    电子设备包装和包装基板

    公开(公告)号：US20140203451A1

    公开(公告)日：2014-07-24

    申请号：US14063806

    申请日：2013-10-25

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yong Min KWON ,  Seo Hyun MOON ,  Sung Jun IM ,  Min Young SON

    IPC: H01L23/48

    CPC classification number: H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L33/38 ,  H01L2924/0002 ,  Y02E10/50 ,  H01L2924/00

    Abstract: The present application provides an electronic device package. The package includes a packaging substrate having first and second surfaces opposing one another. First and second electrode patterns are formed on the first surface and first and second external terminals connected to the first and second electrode patterns. The second electrode pattern is electrically insulated from the first electrode pattern and surrounds the first electrode pattern An electronic device is mounted on the first surface of the packaging substrate and includes first and second electrodes disposed on a surface thereof facing the packaging substrate. The first and second electrodes are positioned on the first and second electrode patterns, respectively.

    Abstract translation: 本申请提供了一种电子设备包装。 该包装包括具有彼此相对的第一和第二表面的包装衬底。 第一和第二电极图案形成在第一表面上，第一和第二外部端子连接到第一和第二电极图案。 第二电极图案与第一电极图案电绝缘并且包围第一电极图案电子器件安装在封装基板的第一表面上，并且包括设置在面向封装基板的表面上的第一和第二电极。 第一和第二电极分别位于第一和第二电极图案上。

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