公开(公告)号：US20160368937A1

公开(公告)日：2016-12-22

申请号：US15189057

申请日：2016-06-22

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Dong Hwan LEE ,  Min Gyum KIM ,  So Yoon KIM ,  Woo Chul NA ,  Yoon Man LEE ,  Ji Yoon CHO ,  Ki Hyeok KWON ,  KyoungChul BAE ,  Eun Jung LEE ,  Joo Young CHUNG ,  Jin Min CHEON ,  Jin Woo CHOI ,  Seung HAN

IPC: C07F9/54 ,  H01L23/29 ,  C07C235/56 ,  C09D163/00 ,  C09D7/12

CPC classification number: C07F9/5442 ,  C07C235/64 ,  C08G59/621 ,  C08G59/688 ,  C09D163/00 ,  H01L23/295 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:

公开(公告)号：US20190292363A1

公开(公告)日：2019-09-26

申请号：US16301509

申请日：2017-02-15

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Yoon Man LEE ,  Jae Hyun KIM ,  Tae Shin EOM ,  Eun Jung LEE ,  Su Mi IM

IPC: C08L63/00 ,  C08K3/36 ,  H01L23/29

Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.

公开(公告)号：US20160351461A1

公开(公告)日：2016-12-01

申请号：US15162647

申请日：2016-05-24

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Yoon Man LEE ,  So Yoon KIM

IPC: H01L23/29 ,  C08K3/34 ,  C08K3/30 ,  C08K3/22 ,  C08K3/18 ,  H01L23/31 ,  C08K13/02 ,  H01L23/34 ,  H01L21/56 ,  H01L23/544 ,  H01L23/00 ,  C08K3/36 ,  C08K5/3417

CPC classification number: H01L23/295 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/544 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/3315 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/83101 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01003 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01043 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01071 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0108 ,  H01L2924/01081 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/06 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/186 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated by the epoxy resin composition, the composition including a base resin; a filler; a colorant; and a thermochromic pigment, wherein a color of the thermochromic pigment is irreversibly changed when a temperature thereof exceeds a predetermined temperature.

Abstract translation: 一种用于封装半导体器件的环氧树脂组合物和由环氧树脂组合物包封的半导体器件，该组合物包括基础树脂; 填料; 着色剂 和热变色颜料，其中当其变温超过预定温度时，热变色颜料的颜色不可逆地改变。