公开(公告)号：US20160218022A1

公开(公告)日：2016-07-28

申请号：US15006359

申请日：2016-01-26

Applicant: Semes Co., Ltd

Inventor： Yoon Jong JU ,  Kihoon CHOI ,  Hyeon Jun LEE

IPC: H01L21/67 ,  H01L41/09 ,  B08B3/10

CPC classification number: H01L21/67051 ,  B05B17/0607 ,  B08B3/02 ,  B08B3/12 ,  B08B2203/0288

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing having a space for treating a substrate in the interior thereof, a spin head which supports and rotates the substrate inside the housing, and an ejection unit having a first nozzle member for ejecting a first treatment liquid onto the substrate positioned on the spin head. The first nozzle member includes a body having an ejection passage, through which the first treatment liquid flows, therein and a first discharge hole communicated with the ejection passage to eject the first treatment liquid onto the substrate, and a vibrator installed in the body to provide vibration for the first treatment liquid flowing through the ejection passage. The vibrator has an interference preventing recess for preventing an interference by reflective waves therein.

Abstract translation: 公开了一种基板处理装置。 基板处理装置包括：壳体，其具有用于处理其内部的基板的空间;支撑并旋转基板在壳体内部的旋转头;以及喷射单元，其具有用于将第一处理液体喷射到基板上的第一喷嘴构件 位于旋转头上。 第一喷嘴构件包括具有喷射通道的主体，第一处理液体通过喷射通道流动，并且与喷射通道连通的第一排出孔将第一处理液喷射到基板上;以及振动器，安装在主体中以提供 用于流过喷射通道的第一处理液体的振动。 振动器具有防止其中的反射波干涉的防干扰凹部。

公开(公告)号：US20210023582A1

公开(公告)日：2021-01-28

申请号：US16936132

申请日：2020-07-22

Applicant: SEMES CO., LTD.

Inventor： Chan Young HEO ,  Kihoon CHOI ,  Ki-Moon KANG ,  Do Heon KIM ,  Jaeseong LEE

IPC: B05C5/02 ,  B05C11/10

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a fluid supply unit for supplying supercritical fluid to the treatment space, and a controller configured to control the fluid supply unit, wherein the fluid supply unit is configured to selectively supply the supercritical fluid at a first density or a second density higher than the first density into the treatment space. Thus, drying efficiency of the substrate when drying the substrate using the supercritical fluid may be improved.

公开(公告)号：US20160346795A1

公开(公告)日：2016-12-01

申请号：US15160136

申请日：2016-05-20

Applicant: Semes Co., Ltd.

Inventor： Kihoon CHOI ,  Yoon Jong Ju ,  Byung Man Kang

IPC: B05B1/08 ,  B08B3/02 ,  B08B3/08 ,  B05B1/18 ,  B08B3/10

CPC classification number: H01L21/68721 ,  H01L21/67051

Abstract: Disclosed is a nozzle for supplying a treatment liquid to a substrate, the nozzle including a body having a passage, through which the treatment liquid flows, in the interior thereof, and having a discharge hole communicated with the passage and through which the treatment liquid is discharged, and a piezoelectric element that pressurize the treatment liquid flowing through the body to discharge the treatment liquid through the discharge hole in a state of droplets, wherein an average diameter of the droplets discharged through the discharge hole is equal to or greater than 5 micrometers and is less than 15 micrometers.

Abstract translation: 公开了一种用于将处理液供给到基板的喷嘴，所述喷嘴包括具有通道的主体，处理液在其内部流动，并具有与通道连通的排出孔，处理液通过该通道 以及压电元件，其对流过身体的处理液体进行加压，以便以液滴的状态通过排出孔排出处理液，其中通过排出孔排出的液滴的平均直径等于或大于5微米 并且小于15微米。

公开(公告)号：US20210072644A1

公开(公告)日：2021-03-11

申请号：US17017786

申请日：2020-09-11

Applicant: SEMES CO., LTD. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

Inventor： Hae-Won CHOI ,  Yerim YEON ,  Anton KORIAKIN ,  Kihoon CHOI ,  Youngran KO ,  Jeong Ho CHO ,  Hyungseok KANG ,  Hong Gi MIN

IPC: G03F7/16 ,  H01L21/67

Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a first process chamber to apply an organic solvent to a substrate applied with a developer and introduced, and a second process chamber to treat the substrate applied with the organic solvent and introduced, through a supercritical fluid.

公开(公告)号：US20230037419A1

公开(公告)日：2023-02-09

申请号：US17815617

申请日：2022-07-28

Applicant: Semes Co., Ltd.

Inventor： Jangmi WOO ,  Kihoon CHOI ,  Younghoon JEONG ,  Myungjin KIM

IPC: B41J2/11 ,  B41J2/175 ,  B41J2/045 ,  B41J2/14

Abstract: An apparatus for supplying chemical liquid may include at least two ink jet heads, a reservoir for receiving a chemical liquid provided onto a substrate from each of the at least two ink jet heads, a chemical liquid for supplying member providing the chemical liquid to each of the at least two ink jet heads, and a chemical liquid collecting member for drawing and collecting a chemical liquid remained in each of the at least two ink jet heads. One path of the chemical liquid from the chemical liquid supplying member to the chemical liquid collecting member via one of the at least two ink jet heads may be substantially the same as a length of another path the of chemical liquid from the chemical liquid supplying member to the chemical liquid collecting member via the other of the at least two ink jet heads.

公开(公告)号：US20170028413A1

公开(公告)日：2017-02-02

申请号：US15223931

申请日：2016-07-29

Applicant: Semes Co., Ltd.

Inventor： Sehoon OH ,  Kihoon CHOI ,  Jinkyu KIM

IPC: B05B3/00

CPC classification number: B05B7/10 ,  B05B7/06 ,  B05B7/061 ,  B05B7/0815 ,  B05C5/0208 ,  H01L21/67051

Abstract: A nozzle for supplying a fluid to a substrate, the nozzle including a body having a liquid discharge line through which the liquid flows and a gas discharge line that surrounds the liquid discharge line and through which a gas flow, wherein the body includes a plurality of liquid discharge holes that discharge the liquid flowing through the liquid discharge line, and a gas discharge hole that discharges the gas flowing through the gas discharge line.

Abstract translation: 一种用于向衬底供应流体的喷嘴，所述喷嘴包括具有液体流过的液体排出管线的主体和围绕所述液体排出管线的气体排出管线，并且气体流过所述气体流体，其中所述主体包括多个 对流过液体排出管线的液体进行排出的液体排出孔以及排出通过气体排出管线的气体的气体排出孔。

公开(公告)号：US20160133456A1

公开(公告)日：2016-05-12

申请号：US14931004

申请日：2015-11-03

Applicant: Semes Co., Ltd.

Inventor： Kihoon CHOI ,  In-Il JUNG ,  Seong-Soo KIM ,  Yoon-Jong JU

IPC: H01L21/02 ,  B24C11/00 ,  B24C1/00 ,  H01L21/67 ,  B08B7/04

CPC classification number: H01L21/02057 ,  B24C1/003 ,  B24C11/005 ,  H01L21/02052 ,  H01L21/67051

Abstract: Disclosed is an apparatus and method for treating a substrate. The method includes supplying cleaning particles to the substrate to clean the substrate. The cleaning particles are solid particles. The solid particles provide a shock wave to the substrate.

Abstract translation: 公开了一种处理基板的装置和方法。 该方法包括将清洁颗粒供应到基底以清洁基底。 清洁颗粒是固体颗粒。 固体颗粒向基材提供冲击波。

公开(公告)号：US20220415680A1

公开(公告)日：2022-12-29

申请号：US17664243

申请日：2022-05-20

Applicant: Semes Co., Ltd. ,  Samsung Electronics Co., Ltd.

Inventor： Jaeseong LEE ,  Kihoon CHOI ,  Hae-Won CHOI ,  Jihoon JEONG ,  Seohyun KIM ,  Young-Hoo KIM ,  Sangjine PARK ,  Kuntack LEE

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus includes a chamber including an upper chamber and a lower chamber coupled to each other to provide a space for processing a substrate, a substrate support configured to support the substrate within the chamber, an upper supply port provided in the upper chamber and configured to supply a supercritical fluid on an upper surface of the substrate within the chamber, a recess provided in a lower surface of the upper chamber, the recess including a horizontal extension portion extending in a direction parallel with the upper surface of the substrate in a radial direction from an outlet of the upper supply port and an inclined extension portion extending obliquely at an angle from the horizontal extension portion, and a baffle member disposed within the recess between the upper supply port and the substrate.

公开(公告)号：US20210020430A1

公开(公告)日：2021-01-21

申请号：US16929190

申请日：2020-07-15

Applicant: SEMES CO., LTD.

Inventor： Do Heon KIM ,  Kihoon CHOI ,  Chan Young HEO ,  Ki-Moon KANG

IPC: H01L21/02 ,  B08B7/00 ,  B08B7/04 ,  B08B3/08

Abstract: Disclosed is a method of treating a substrate. In one embodiment, supercritical fluid is supplied to a treatment space in a chamber such that the substrate in the treatment space is treated. The supercritical fluid is supplied to the treatment space while exhausting the treatment space. A temperature of the supercritical fluid supplied when exhausting the treatment space is higher than a temperature of the supercritical fluid supplied to the treatment space for treating the substrate.

公开(公告)号：US20210001634A1

公开(公告)日：2021-01-07

申请号：US16920193

申请日：2020-07-02

Applicant: SEMES Co. Ltd.

Inventor： Donghwa LEE ,  Daigeon YOON ,  Jaeyong CHOI ,  Sanguk SON ,  Kihoon CHOI ,  Daesung KIM

IPC: B41J2/175 ,  G02F1/1335

Abstract: An ink tank for a liquid chemical discharging apparatus capable of preventing equipment failure and improving durability by preventing scattering and backflow of a liquid chemical. To this end, the present invention provides an ink tank for a liquid chemical discharging apparatus including: a liquid chemical receiving portion in which a liquid chemical is stored; a liquid chemical discharge port supplying the liquid chemical to an inkjet head; a pressure control port for controlling pressure of the liquid chemical receiving portion; and a partition wall which is provided in the liquid chemical receiving portion to partition the liquid chemical receiving portion. According to the present invention, it is possible to prevent contamination due to a liquid chemical by suppressing the liquid chemical from sloshing and improve durability of an ink tank by preventing the liquid chemical contained therein from flowing backward out of the ink tank.