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公开(公告)号：US20220005790A1
公开(公告)日：2022-01-06
申请号：US17270722
申请日：2019-08-26
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Kazunori WATANABE , Koji KUSUNOKI , Taiki NONAKA , Hiroki ADACHI , Koichi TAKESHIMA
IPC: H01L25/075 , H01L27/12 , H01L29/786 , H01L33/62
Abstract: A display device with high display quality is provided. A display device with low power consumption is provided. In the display device, a first transistor, a second transistor, a first conductive layer, and a light-emitting diode package are included in a pixel. The light-emitting diode package includes a first light-emitting diode, a second light-emitting diode, a second conductive layer, a third conductive layer, and a fourth conductive layer. The first light-emitting diode includes a first electrode and a second electrode. The second light-emitting diode includes a third electrode and a fourth electrode. One of a source and a drain of the first transistor is electrically connected to the first electrode through the second conductive layer. One of a source and a drain of the second transistor is electrically connected to the third electrode through the third conductive layer. The first conductive layer is electrically connected to each of the second electrode and the fourth electrode through the fourth conductive layer. A constant potential is supplied to the first conductive layer.
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2.发明申请公开(公告)号：US20180081465A1
公开(公告)日：2018-03-22
申请号：US15697738
申请日：2017-09-07
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yoshiharu HIRAKATA , Koichi TAKESHIMA , Takayuki OHIDE , Kenji SHINOZAKI , Kanpei KOJIMA
Abstract: A display panel and the like with a novel structure are provided. In the display panel, a first functional layer includes a pixel circuit and a first insulating film. A second functional layer includes a coloring film and a second insulating film. The first insulating film and the second insulating film each have a thickness of 0.5 μm to 3 μm and a Young's modulus of 3 GPa to 12 GPa. A sealing material is provided between a first base and a second base. A structure body is provided between the first base and the second base, and keeps a predetermined gap between the first and second bases. A pixel is surrounded by the first base, the second base, and the sealing material. A display element in the pixel is electrically connected to a pixel circuit and overlaps with a coloring film and a liquid crystal material.
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公开(公告)号：US20170210115A1
公开(公告)日：2017-07-27
申请号：US15413696
申请日：2017-01-24
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu OHNO , Koichi TAKESHIMA
IPC: B32B43/00 , H01L27/12 , H01L51/00 , H01L21/683
CPC classification number: B32B43/006 , B32B37/02 , B32B37/025 , B32B37/1284 , B32B37/18 , B32B38/10 , B32B2310/0843 , H01L21/6835 , H01L27/1266 , H01L27/3244 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68381 , H01L2227/326 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1184 , Y10T156/1933 , Y10T156/1944 , Y10T156/1967
Abstract: A starting point for separating a separation layer and a layer to be separated is formed in a process member. A first step of irradiating a first portion of the process member with first laser light in a frame-like shape and a second step of irradiating at least part of a region which is irradiated with the first laser light with second laser light are performed. The process member includes a first substrate, the separation layer, the layer to be separated, and an adhesive layer which are stacked in this order. In the first portion, the adhesive layer overlaps with the first substrate with the separation layer and the layer to be separated provided therebetween. In the first step, the first laser light is absorbed by at least the layer to be separated and the adhesive layer. In the second step, the second laser light is absorbed by at least the separation layer.
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公开(公告)号：US20240413130A1
公开(公告)日：2024-12-12
申请号：US18679945
申请日：2024-05-31
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Kazunori WATANABE , Koji KUSUNOKI , Taiki NONAKA , Hiroki ADACHI , Koichi TAKESHIMA
IPC: H01L25/075 , H01L27/12 , H01L29/786 , H01L33/62
Abstract: A display device with high display quality is provided. A display device with low power consumption is provided. In the display device, a first transistor, a second transistor, a first conductive layer, and a light-emitting diode package are included in a pixel. The light-emitting diode package includes a first light-emitting diode, a second light-emitting diode, a second conductive layer, a third conductive layer, and a fourth conductive layer. The first light-emitting diode includes a first electrode and a second electrode. The second light-emitting diode includes a third electrode and a fourth electrode. One of a source and a drain of the first transistor is electrically connected to the first electrode through the second conductive layer.
10 One of a source and a drain of the second transistor is electrically connected to the third electrode through the third conductive layer. The first conductive layer is electrically connected to each of the second electrode and the fourth electrode through the fourth conductive layer. A constant potential is supplied to the first conductive layer.-
公开(公告)号：US20200251547A1
公开(公告)日：2020-08-06
申请号：US16856139
申请日：2020-04-23
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei YAMAZAKI , Masakatsu OHNO , Hiroki ADACHI , Satoru IDOJIRI , Koichi TAKESHIMA
IPC: H01L27/32 , H01L51/00 , H01L51/56 , H01L51/52 , H01L27/12 , H01L29/24 , H01L29/66 , H01L29/786 , B23K26/0622 , B23K26/04 , B23K26/06 , B23K26/08
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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Patent Agency Ranking
公开(公告)号：US20170133450A1
公开(公告)日：2017-05-11
申请号：US15416166
申请日：2017-01-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei YAMAZAKI , Masakatsu OHNO , Hiroki ADACHI , Satoru IDOJIRI , Koichi TAKESHIMA
CPC classification number: H01L27/3272 , B23K26/04 , B23K26/0617 , B23K26/0622 , B23K26/0643 , B23K26/0648 , B23K26/083 , H01L27/1225 , H01L27/1266 , H01L27/322 , H01L27/3244 , H01L27/3258 , H01L27/3262 , H01L29/24 , H01L29/66969 , H01L29/78603 , H01L29/7869 , H01L41/314 , H01L51/0024 , H01L51/0027 , H01L51/003 , H01L51/0097 , H01L51/5096 , H01L51/5246 , H01L51/5253 , H01L51/5284 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/521
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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公开(公告)号：US20160347047A1
公开(公告)日：2016-12-01
申请号：US15165099
申请日：2016-05-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Saki Eguchi , Koichi TAKESHIMA , Hiroki ADACHI
IPC: B32B43/00 , H01L21/683
CPC classification number: B32B43/006 , B32B37/003 , B32B37/22 , B32B38/10 , B32B2457/14 , B32B2457/20 , H01L21/67132 , H01L21/6836 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68381 , H01L2221/68386 , H01L2221/6839 , H01L2221/68395
Abstract: A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.
Abstract translation: 提高分离过程中的产率。 提供了一种能够在大面积基板中容易分离的分离装置。 分离装置具有将处理构件分割成第一构件和第二构件的功能，并且包括支撑体供给单元，支撑体保持单元，转移机构，方向改变机构和结构体。 结构体将支撑体结合到第一构件的表面。 当处理构件的至少一部分位于方向改变机构和结构体或压力施加机构之间时，方向改变机构与包括第一构件的表面的第一平面之间的最短距离比最短距离 在第一平面和结构体或压力施加机构之间。
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公开(公告)号：US20150314424A1
公开(公告)日：2015-11-05
申请号：US14696515
申请日：2015-04-27
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Kayo KUMAKURA , Satoru IDOJIRI , Masakatsu OHNO , Koichi TAKESHIMA , Yoshiharu HIRAKATA , Kohei YOKOYAMA
CPC classification number: B25B11/005 , B29C53/18 , B29L2007/002 , H01L21/68742 , H01L21/6875
Abstract: A film-like member is supported in a flat shape by vacuum suction. A plurality of lift pins are arranged in a planar configuration and bear a film-like member placed on their upper ends. Tubular pads made of rubber for holding the film-like member by vacuum suction are attached to upper portions of the lift pins. The height of the lift pins can be adjusted by a screw fastening mechanism. The deformation of the film-like member can be corrected to a flat or concavely curved shape by suction from the pads. When the correction cannot be achieved by suction alone, the correction may be supplemented by ejection of air from a nozzle.
Abstract translation: 膜状构件通过真空抽吸被支撑为平坦的形状。 多个提升销布置成平面构造并且承载放置在其上端的薄膜状构件。 由橡胶制成的用于通过真空吸附保持膜状构件的管状垫被附接到提升销的上部。 提升销的高度可以通过螺钉固定机构进行调整。 膜状构件的变形可以通过从衬垫的抽吸来校正为平坦或凹形弯曲的形状。 当仅通过抽吸不能实现校正时，可以通过从喷嘴喷出空气来补充校正。
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公开(公告)号：US20200273936A1
公开(公告)日：2020-08-27
申请号：US16872819
申请日：2020-05-12
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei YAMAZAKI , Masakatsu OHNO , Hiroki ADACHI , Satoru IDOJIRI , Koichi TAKESHIMA
IPC: H01L27/32 , B23K26/04 , B23K26/08 , H01L51/00 , H01L29/786 , B23K26/06 , H01L27/12 , B23K26/0622 , H01L51/52 , H01L29/24 , H01L51/56 , H01L29/66
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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公开(公告)号：US20200273935A1
公开(公告)日：2020-08-27
申请号：US16872806
申请日：2020-05-12
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Masakatsu Ohno , Hiroki Adachi , Satoru Idojiri , Koichi TAKESHIMA
IPC: H01L27/32 , B23K26/04 , B23K26/08 , H01L51/00 , H01L29/786 , B23K26/06 , H01L27/12 , B23K26/0622 , H01L51/52 , H01L29/24 , H01L51/56 , H01L29/66
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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