公开(公告)号：US20150262926A1

公开(公告)日：2015-09-17

申请号：US14724665

申请日：2015-05-28

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Minoru UESHIMA ,  Minoru TOYODA

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49582 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/08501 ,  H01L2224/29026 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29447 ,  H01L2224/32245 ,  H01L2224/32501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2203/047 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/32145 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material. The surface-mount component formed using (Sn—Sb)-based solder material having high melting point as the solder material for die pad, the (Sn—Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. The melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.

Abstract translation: 即使使用安装焊料将使用芯片焊接焊料形成的表面安装部件焊接在印刷电路板上也可防止芯片焊接焊料的熔化。 使用具有高熔点的（Sn-Sb）基焊料作为芯片焊盘用焊料形成的表面安装部件，（Sn-Sb）系焊料，含有不超过规定量Cu成分的Cu， 其主要成分为Sn，使用（Sn-Ag-Cu-Bi）基焊料作为安装焊料材料焊接在电路板的基板端子部分上，焊料材料被施加在端子部分上。 即使在回流炉的加热温度（240℃以下）下也能够防止芯片焊接材料的熔融。

公开(公告)号：US20150314396A1

公开(公告)日：2015-11-05

申请号：US14648031

申请日：2013-11-18

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Koji WATANABE ,  Minoru TOYODA ,  Satoshi TOMITA ,  Tsutomu SUGINO ,  Daichi KIKUCHI ,  Hiroki OSHIMA

IPC: B23K35/02 ,  B23K35/28 ,  B23K1/00 ,  B23K1/19 ,  B32B15/01 ,  C22C13/00 ,  C22C13/02 ,  C22C12/00 ,  C22C11/06 ,  B23K35/26 ,  H05K3/34

CPC classification number: B23K35/0238 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/26 ,  B23K35/262 ,  B23K35/268 ,  B23K35/28 ,  B23K35/40 ,  B23K2101/42 ,  B32B15/01 ,  B32B15/018 ,  C22C1/00 ,  C22C11/06 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  C22C21/14 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/0405 ,  H05K2203/12 ,  Y10T428/12986

Abstract: When soldering a package having an electrode on which Ni/Au or Ag—Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn—Ag—Cu series or Sn—Sb series and a solder material of Sn—Ag—Cu—Ni series or Sn—Pb series. The electrode on which Ni/Au or Ag—Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn—Ag—Cu series or Sn—Sb series being attached to the Cu electrode and the solder material of Sn—Ag—Cu—Ni series or Sn—Cu series being attached to the electrode on which Ni/Au or Ag—Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability.

Abstract translation: 当将具有Ni / Au或Ag-Pd合金的电极的封装焊接到具有Cu电极的印刷电路板或其上镀有Cu的电极时，在层状焊料内形成固相扩散层 用于粘合不同种类电极的材料。 层状焊料由Sn-Ag-Cu系或Sn-Sb系焊料，Sn-Ag-Cu-Ni系或Sn-Pb系焊料构成。 在其上镀有Ni / Au或Ag-Pd合金的电极和Cu电极或其上镀有Cu的电极与Sn-Ag-Cu系列或Sn-Sb系列的焊料材料焊接到Cu电极上 并且将Sn-Ag-Cu-Ni系或Sn-Cu系的焊料附着在镀Ni / Au或Ag-Pd合金的电极上。 这抑制了金属间化合物的形成，并提供了高粘结可靠性。