公开(公告)号：US20160081234A1

公开(公告)日：2016-03-17

申请号：US14607743

申请日：2015-01-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Chia-Yang Chen ,  Chao-Ya Yang ,  Yude Chu ,  Chih-Ming Cheng

IPC: H05K9/00

CPC classification number: H01L23/552 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package structure is provided, including an electronic element with a low frequency, a shielding member connected to the electrosnic element, and an encapsulant covering the electronic element and the shielding member, such that the electronic element is shielded from erroneous signals.

Abstract translation: 提供一种封装结构，包括低频电子元件，连接到电气元件的屏蔽构件，以及覆盖电子元件和屏蔽构件的密封剂，使得电子元件被屏蔽而不会发生错误信号。

公开(公告)号：US20130320513A1

公开(公告)日：2013-12-05

申请号：US13660277

申请日：2012-10-25

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chien-Cheng Lin ,  Tsung-Hsien Hsu ,  Heng-Cheng Chu ,  Chao-Ya Yang ,  Chih-Ming Cheng

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2924/00

Abstract: A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element.

Abstract translation: 提供一种半导体封装，包括：具有至少导电焊盘的衬底; 设置在所述基板上的半导体元件; 形成在半导体元件的顶表面和侧表面上并延伸到导电焊盘的导电粘合剂; 以及设置在导电粘合剂上的电子元件。 导电粘合剂和导电垫形成屏蔽结构，以防止在半导体元件和电子元件之间发生电磁干扰。

公开(公告)号：US09502377B2

公开(公告)日：2016-11-22

申请号：US13971189

申请日：2013-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen ,  Chih-Ming Cheng ,  Yude Chu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/433 ,  H01L25/065 ,  H01L23/31 ,  H01L23/552 ,  H01L23/66

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/552 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.

Abstract translation: 公开了一种半导体封装，其包括：电路板; 布置在电路板上的载体; 布置在载体上的RF芯片; 电连接RF芯片的电极焊盘和电路板的多个高级焊接线; 以及形成在电路板上用于封装载体，高电平接合线和RF芯片的密封剂。 本发明将RF芯片定位在高水平，以便于电路板上的元件布置和高频布线，从而实现高度集成的无线SiP（系统级封装）模块。

公开(公告)号：US08963299B2

公开(公告)日：2015-02-24

申请号：US13660277

申请日：2012-10-25

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chien-Cheng Lin ,  Tsung-Hsien Hsu ,  Heng-Cheng Chu ,  Chao-Ya Yang ,  Chih-Ming Cheng

IPC: H01L23/552 ,  H01L21/00

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2924/00

Abstract: A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element.

Abstract translation: 提供一种半导体封装，包括：具有至少导电焊盘的衬底; 设置在所述基板上的半导体元件; 形成在半导体元件的顶表面和侧表面上并延伸到导电焊盘的导电粘合剂; 以及设置在导电粘合剂上的电子元件。 导电粘合剂和导电垫形成屏蔽结构，以防止在半导体元件和电子元件之间发生电磁干扰。

公开(公告)号：US20140353850A1

公开(公告)日：2014-12-04

申请号：US13971189

申请日：2013-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen ,  Chih-Ming Cheng ,  Yude Chu

IPC: H01L23/52 ,  H01L21/56 ,  H01L23/28 ,  H01L23/12 ,  H01L23/00

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/552 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.

Abstract translation: 公开了一种半导体封装，其包括：电路板; 布置在电路板上的载体; 布置在载体上的RF芯片; 电连接RF芯片的电极焊盘和电路板的多个高级焊接线; 以及形成在电路板上用于封装载体，高电平接合线和RF芯片的密封剂。 本发明将RF芯片定位在高水平，以便于电路板上的元件布置和高频布线，从而实现高度集成的无线SiP（系统级封装）模块。

公开(公告)号：US20150263421A1

公开(公告)日：2015-09-17

申请号：US14290121

申请日：2014-05-29

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chi-Pin Tsai ,  Chih-Ming Cheng

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/526 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01Q1/42 ,  H01Q9/42 ,  H01Q23/00 ,  Y10T29/49018 ,  H01L2924/00014

Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure provided on the substrate, wherein the antenna structure has at least a supporting portion and an extending portion supported by the supporting portion over the substrate and surrounding the electronic element; and a shielding structure provided on the substrate and overlapping with the antenna structure, thereby saving the surface area of the substrate so as to meet the miniaturization requirement of the electronic package.

Abstract translation: 提供电子封装，其包括：基板; 至少设置在所述基板上的电子元件; 设置在所述基板上的天线结构，其中所述天线结构至少具有支撑部分和由所述支撑部分支撑在所述基板上并围绕所述电子元件的延伸部分; 以及设置在基板上并与天线结构重叠的屏蔽结构，从而节省了基板的表面积，以满足电子封装的小型化要求。