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公开(公告)号：US06620512B2
公开(公告)日：2003-09-16
申请号：US10028393
申请日：2001-12-21
IPC分类号： B32B2738
CPC分类号： C08L35/06 , C08G59/4261 , C08L63/00 , C09D135/06 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01029 , H01L2924/10253 , H01L2924/14 , Y10T428/31511 , Y10T428/31515 , C08L2666/02 , C08L2666/14 , C08L2666/04 , H01L2924/00
摘要： An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
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2.发明授权Anhydride polymers for use as curing agents in epoxy resin-based underfill material 有权用作基于环氧树脂的底层填充材料中的固化剂的酐聚合物公开(公告)号：US07202304B2
公开(公告)日：2007-04-10
申请号：US11370465
申请日：2006-03-08
CPC分类号： C08L35/06 , C08G59/4261 , C08L63/00 , C09D135/06 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01029 , H01L2924/10253 , H01L2924/14 , Y10T428/31511 , Y10T428/31515 , C08L2666/02 , C08L2666/14 , C08L2666/04 , H01L2924/00
摘要： An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
摘要翻译： 提出了可以在电气部件和基板之间使用的底部填充材料。 底部填充材料可以是包含液体或半固体环氧树脂和多官能酐聚合物和/或低聚物固化剂的固化环氧树脂组合物。 酸酐聚合物和/或低聚物的使用降低了组合物的挥发，从而降低了底部填充材料的孔隙率。 通过改变酸酐聚合物和/或低聚物的取代基，可以设计底部填充材料以改变粘度，降低吸湿性，挥发和模量，改善机械性能和增强附着力。
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公开(公告)号：US20060154080A1
公开(公告)日：2006-07-13
申请号：US11370465
申请日：2006-03-08
CPC分类号： C08L35/06 , C08G59/4261 , C08L63/00 , C09D135/06 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01029 , H01L2924/10253 , H01L2924/14 , Y10T428/31511 , Y10T428/31515 , C08L2666/02 , C08L2666/14 , C08L2666/04 , H01L2924/00
摘要： An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
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公开(公告)号：US07041736B2
公开(公告)日：2006-05-09
申请号：US10616085
申请日：2003-07-08
CPC分类号： C08L35/06 , C08G59/4261 , C08L63/00 , C09D135/06 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01029 , H01L2924/10253 , H01L2924/14 , Y10T428/31511 , Y10T428/31515 , C08L2666/02 , C08L2666/14 , C08L2666/04 , H01L2924/00
摘要： An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
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5.发明授权Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die 有权用于微电子器件的涂层，包括其的处理以及管理微电子管芯的热分布的方法公开(公告)号：US08287996B2
公开(公告)日：2012-10-16
申请号：US12653791
申请日：2009-12-21
申请人： Dingying Xu , Leonel R. Arana , Nachiket R. Raravikar , Mohit Mamodia , Rajasekaran Swaminathan , Rahul Manepalli
发明人： Dingying Xu , Leonel R. Arana , Nachiket R. Raravikar , Mohit Mamodia , Rajasekaran Swaminathan , Rahul Manepalli
IPC分类号： B32B27/32
CPC分类号： H01L23/3737 , H01L24/81 , H01L2924/12042 , Y10T428/24942 , Y10T428/2495 , Y10T428/265 , Y10T428/3154 , H01L2924/00
摘要： A coating for a microelectronic device comprises a polymer film (131) containing a filler material (232). The polymer film has a thermal conductivity greater than 3 W/m·K and a thickness (133) that does not exceed 10 micrometers. The polymer film may be combined with a dicing tape (310) to form a treatment (300) that simplifies a manufacturing process for a microelectronic package (100) and may be used in order to manage a thermal profile of the microelectronic device.
摘要翻译： 用于微电子器件的涂层包括含有填料（232）的聚合物膜（131）。 聚合物膜的热导率大于3W / m·K，厚度（133）不超过10微米。 聚合物膜可以与切割带（310）组合以形成简化微电子封装（100）的制造工艺的处理（300），并且可以使用该处理（300）来管理微电子器件的热分布。
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公开(公告)号：US20110159228A1
公开(公告)日：2011-06-30
申请号：US12655366
申请日：2009-12-29
CPC分类号： H01L23/293 , C08L63/00 , H01L21/563 , H01L24/29 , H01L2224/13099 , H01L2224/16225 , H01L2224/2929 , H01L2224/29386 , H01L2224/32225 , H01L2224/73204 , H01L2224/81911 , H01L2924/14 , Y10T428/23 , Y10T428/25 , Y10T428/259 , Y10T428/31529 , Y10T428/31678 , H01L2924/00014 , H01L2924/00 , H01L2924/05442 , H01L2924/0665
摘要： Methods and associated structures of forming underfill material are described. Those methods may include applying an underfill to an interconnect structure comprising residue from a no clean flux, wherein the underfill comprises at least one of a functionalized nanofiller and a micron-sized filler.
摘要翻译： 描述形成底部填充材料的方法和相关结构。 这些方法可以包括将底部填充物施加到包含来自不干净焊剂的残余物的互连结构，其中底部填充物包括官能化纳米填料和微米级填料中的至少一种。
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7.发明申请Integrated circuit devices including compliant material under bond pads and methods of fabrication 有权集成电路器件包括接合焊盘下的柔性材料和制造方法公开(公告)号：US20070132086A1
公开(公告)日：2007-06-14
申请号：US11301557
申请日：2005-12-13
申请人： Sairam Agraharam , Rahul Manepalli
发明人： Sairam Agraharam , Rahul Manepalli
IPC分类号： H01L23/48
CPC分类号： H01L23/522 , H01L23/562 , H01L24/02 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/0401 , H01L2224/04042 , H01L2224/16 , H01L2224/45147 , H01L2224/48463 , H01L2224/85 , H01L2924/00014 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/00 , H01L2224/05599
摘要： An integrated circuit device includes a die having an interconnect structure formed over a surface thereof. A volume of compliant material located within the interconnect structure underlies one or more bond pads disposed on an uppermost layer of the interconnect structure. The compliant material may absorb stresses exerted on the interconnect structure during assembly, testing, or subsequent operation. Other embodiments are described and claimed.
摘要翻译： 集成电路器件包括在其表面上形成有互连结构的管芯。 位于互连结构内的柔性材料的体积位于布置在互连结构的最上层上的一个或多个接合焊盘的下方。 顺应性材料可以在组装，测试或随后的操作期间吸收施加在互连结构上的应力。 描述和要求保护其他实施例。
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公开(公告)号：US20050224993A1
公开(公告)日：2005-10-13
申请号：US10815540
申请日：2004-03-31
IPC分类号： H01L23/28 , H01L23/538 , H01L25/065
CPC分类号： H01L25/0657 , H01L23/5387 , H01L24/45 , H01L24/48 , H01L2224/32145 , H01L2224/45147 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06572 , H01L2225/06579 , H01L2225/06586 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/05599 , H01L2924/00012 , H01L2924/00
摘要： A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.
摘要翻译： 封装包括具有第一区域和第二区域的柔性基板，由第一区域支撑的封装模具以及引入封装管芯和柔性基板之间的适形折叠粘合剂。 柔性基底的第二区域折叠在封装的模具的表面上。
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9.发明申请Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same 有权用于芯片级封装的芯片附着膜，由其制成的封装及其组装方法公开(公告)号：US20060073624A1
公开(公告)日：2006-04-06
申请号：US10956624
申请日：2004-09-30
CPC分类号： H01L24/83 , H01L23/3128 , H01L23/49816 , H01L23/5387 , H01L24/29 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29386 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48472 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/83855 , H01L2224/83856 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/05442 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： A die-attach composition includes a resin such as a thermosetting resin, a hardener, and a low molecular weight oligomer diluent. A die-attach composition includes a polyimide in a major amount and a resin such as a thermosetting resin in a minor amount. The die-attach composition also includes a reactive polymer diluent. Combinations of the low molecular weight oligomer diluent and the reactive polymer diluent are included. The die-attach composition is applied to surface mount technology such as wire-bond dice. A computing system is also included that uses the die-attach composition.
摘要翻译： 模具附着组合物包括树脂如热固性树脂，硬化剂和低分子量低聚物稀释剂。 模具附着组合物包括主要量的聚酰亚胺和少量的热固性树脂等树脂。 模片附着组合物还包括反应性聚合物稀释剂。 包括低分子量低聚物稀释剂和反应性聚合物稀释剂的组合。 将芯片附着组合物应用于诸如引线键合芯片的表面贴装技术。 还包括使用芯片附着组合物的计算系统。
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10.发明授权Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die 有权用于微电子器件的涂层，包括其的处理以及管理微电子管芯的热分布的方法公开(公告)号：US08569108B2
公开(公告)日：2013-10-29
申请号：US13613650
申请日：2012-09-13
申请人： Dingying Xu , Leonel R. Arana , Nachiket R. Raravikar , Mohit Mamodia , Rajasekaran Swaminathan , Rahul Manepalli
发明人： Dingying Xu , Leonel R. Arana , Nachiket R. Raravikar , Mohit Mamodia , Rajasekaran Swaminathan , Rahul Manepalli
CPC分类号： H01L23/3737 , H01L24/81 , H01L2924/12042 , Y10T428/24942 , Y10T428/2495 , Y10T428/265 , Y10T428/3154 , H01L2924/00
摘要： A coating for a microelectronic device comprises a polymer film (131) containing a filler material (232). The polymer film has a thermal conductivity greater than 3 W/m·K and a thickness (133) that does not exceed 10 micrometers. The polymer film may be combined with a dicing tape (310) to form a treatment (300) that simplifies a manufacturing process for a microelectronic package (100) and may be used in order to manage a thermal profile of the microelectronic device.
摘要翻译： 用于微电子器件的涂层包括含有填料（232）的聚合物膜（131）。 聚合物膜的热导率大于3W / m·K，厚度（133）不超过10微米。 聚合物膜可以与切割带（310）组合以形成简化微电子封装（100）的制造工艺的处理（300），并且可以使用该处理（300）来管理微电子器件的热分布。
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