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公开(公告)号：US08928139B2
公开(公告)日：2015-01-06
申请号：US13249885
申请日：2011-09-30
IPC分类号： H01L23/34 , H01L23/552 , H05K1/00 , H01L23/498 , H01L23/48
CPC分类号： H05K1/00 , H01L23/48 , H01L23/49805 , H01L23/552 , H01L23/66 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2223/6677 , H01L2224/0401 , H01L2224/05568 , H01L2224/131 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2924/14 , H01L2924/15311 , H01L2924/3025 , H01L2924/014 , H01L2924/00
摘要： Embodiments described herein provide enhanced integrated circuit (IC) devices. In an embodiment, an IC device includes a substrate, an IC die coupled to a surface of the substrate, a first wirelessly enabled functional block located, on the IC die, the first wirelessly enabled functional block being configured to wirelessly communicate with a second wirelessly enabled functional block located on the substrate, and a ground ring configured to provide electromagnetic shielding for the first and second wirelessly enabled functional blocks.
摘要翻译： 本文描述的实施例提供增强型集成电路（IC）装置。 在一个实施例中，IC器件包括衬底，耦合到衬底的表面的IC裸片，位于IC裸片上的第一无线功能功能块，第一无线功能功能块被配置为与第二无线地无线通信 位于所述基板上的功能块以及被配置为为所述第一和第二无线功能块提供电磁屏蔽的接地环。
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2.发明授权Test board for use with devices having wirelessly enabled functional blocks and method of using same 有权与具有无线功能块的设备一起使用的测试板及其使用方法公开(公告)号：US08901945B2
公开(公告)日：2014-12-02
申请号：US13149315
申请日：2011-05-31
IPC分类号： G01R31/00 , G01R31/302 , G01R31/28
CPC分类号： G01R31/3025 , G01R31/2889 , H01L2224/48227 , H01L2924/15311
摘要： A test board is provided. The test board includes a test module configured to accommodate an integrated circuit (IC) device and first wirelessly enabled functional blocks located in the test module and configured to communicate with second wirelessly enabled functional blocks of the IC device.
摘要翻译： 提供测试板。 测试板包括测试模块，该测试模块被配置为容纳集成电路（IC）设备和位于测试模块中的第一无线功能功能块，并被配置为与IC设备的第二无线功能块通信。
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公开(公告)号：US08884428B2
公开(公告)日：2014-11-11
申请号：US13249885
申请日：2011-09-30
IPC分类号： H01L23/34 , H01L23/552 , H05K1/00 , H01L23/498 , H01L23/48
摘要： Embodiments described herein provide enhanced integrated circuit (IC) devices. In an embodiment, an IC device includes a substrate, an IC die coupled to a surface of the substrate, a first wirelessly enabled functional block located, on the IC die, the first wirelessly enabled functional block being configured to wirelessly communicate with a second wirelessly enabled functional block located on the substrate, and a ground ring configured to provide electromagnetic shielding for the first and second wirelessly enabled functional blocks.
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公开(公告)号：US09209508B2
公开(公告)日：2015-12-08
申请号：US13248787
申请日：2011-09-29
申请人： Ahmadreza Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
发明人： Ahmadreza Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
IPC分类号： H01P1/18 , H01P1/06 , H01P3/00 , H01L23/522 , H01L23/66 , H01L25/065 , B81B7/00 , H01L41/09 , H01H59/00
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
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公开(公告)号：US20110313710A1
公开(公告)日：2011-12-22
申请号：US13025657
申请日：2011-02-11
申请人： Arya Reza BEHZAD , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
发明人： Arya Reza BEHZAD , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
CPC分类号： G01R31/2834 , G01R31/3025 , G01R31/311
摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
摘要翻译： 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。
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公开(公告)号：US20110309851A1
公开(公告)日：2011-12-22
申请号：US13025665
申请日：2011-02-11
申请人： Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
发明人： Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
IPC分类号： G01R31/36
CPC分类号： G01R31/319 , G01R31/2834 , G01R31/3025 , G01R31/311 , H01L23/544 , H01L2223/54433 , H01L2924/0002 , Y10T29/49121 , H01L2924/00
摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
摘要翻译： 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。
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公开(公告)号：US08952712B2
公开(公告)日：2015-02-10
申请号：US13025665
申请日：2011-02-11
申请人： Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
发明人： Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
IPC分类号： G01R31/36 , G01R31/319 , G01R31/302 , G01R31/311 , H01L23/544 , G01R31/28
CPC分类号： G01R31/319 , G01R31/2834 , G01R31/3025 , G01R31/311 , H01L23/544 , H01L2223/54433 , H01L2924/0002 , Y10T29/49121 , H01L2924/00
摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
摘要翻译： 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。
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公开(公告)号：US20130082800A1
公开(公告)日：2013-04-04
申请号：US13248787
申请日：2011-09-29
申请人： Ahmadreza Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
发明人： Ahmadreza Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
IPC分类号： H01P3/00
CPC分类号： H01P3/00 , B81B7/008 , B81B2201/018 , B81B2203/0118 , B81B2207/03 , H01H59/0009 , H01L23/5222 , H01L23/66 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L41/0986 , H01L2224/16225 , H01L2225/06517 , H01L2225/06531 , H01L2225/06572 , H01L2924/1461 , H01P1/06 , H01P1/18 , H01P1/182 , H01P3/121 , H01Q13/20 , H01L2924/00
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要翻译： 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。
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9.发明申请Wirelessly Communicating Among Vertically Arranged Integrated Circuits (ICs) in a Semiconductor Package 有权在半导体封装中的垂直布置集成电路（IC）之间无线通信公开(公告)号：US20130082403A1
公开(公告)日：2013-04-04
申请号：US13248745
申请日：2011-09-29
申请人： Jesus Alfonso Castaneda , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Michael Boers
发明人： Jesus Alfonso Castaneda , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Michael Boers
IPC分类号： H01L23/522
CPC分类号： H01L25/0657 , G02B6/12002 , G02B6/43 , H01L23/5222 , H01L23/66 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L2223/6627 , H01L2223/6677 , H01L2224/16225 , H01L2225/06517 , H01L2225/06531 , H01L2225/06572 , H01L2225/1005 , H01L2924/1461 , H01P3/00 , H01P3/12 , H01P3/121 , H04L7/0091 , H01L2924/00
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要翻译： 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。
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10.发明申请Identifying Defective Semiconductor Components on a Wafer Using Component Triangulation 审中-公开使用组件三角测量在晶圆上识别缺陷半导体组件公开(公告)号：US20110313711A1
公开(公告)日：2011-12-22
申请号：US13025683
申请日：2011-02-11
申请人： Arya Reza BEHZAD , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
发明人： Arya Reza BEHZAD , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
IPC分类号： G06F19/00 , G01R31/3187
CPC分类号： G01R31/319 , G01R31/2834 , G01R31/3025 , G01R31/311 , H01L23/544 , H01L2223/54433 , H01L2924/0002 , Y10T29/49121 , H01L2924/00
摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
摘要翻译： 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。
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