Abstract:
A multilayer capacitor includes a connecting electrode provided on a surface opposite to a surface on which the capacitor body is mounted, and a third external electrode and a fourth external electrode extend to cover opposing ends of the connecting electrode across a width of the capacitor body. The third and fourth external electrodes are disposed on respective side surfaces of the capacitor body opposite each other across the width, and contact respective first and second pluralities of internal electrodes disposed in the capacitor body.
Abstract:
A capacitor component includes a body having a first surface and a second surface opposing each other and including a multilayer structure in which a plurality of dielectric layers are stacked and first and second internal electrodes are alternately disposed with respective dielectric layers interposed therebetween and exposed to the first surface and the second surface, respectively, first and second metal layers covering the first surface and the second surface and connected to the first and second internal electrodes, respectively, first and second ceramic layers covering the first and second metal layers, and first and second external electrodes covering the first and second ceramic layers and connected to the first and second metal layers to be electrically connected to the first and second internal electrodes, respectively.
Abstract:
A multilayer ceramic electronic component includes: a ceramic body including: an active part with dielectric layers interposed with a plurality of first and second internal electrodes; an upper cover part above the active part; a lower cover part below the active part and having a thickness greater than that of the upper cover part; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, wherein the first and second external electrodes are disposed on respective end surfaces of the ceramic body in a length direction and on a lower surface of the ceramic body in a thickness direction and are not disposed on an upper surface of the ceramic body in the thickness direction.
Abstract:
A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.
Abstract:
A coil component includes a substrate and a coil part disposed on the substrate. The coil part includes an insulating layer having an opening, and one or more coil patterns disposed in the opening. The coil patterns include first seed layers disposed on a portion of a side surface and a portion of a bottom surface of an interior of the opening, a second seed layer disposed to cover the first seed layers, and a metal layer disposed on the second seed layer.
Abstract:
A multilayer ceramic electronic component includes: a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; with external electrodes disposed on the capacitor body and electrically connected to the internal electrodes, wherein the capacitor body includes an active region in which internal electrodes having different polarities from each other overlap each other to form capacitance, and a margin part defined as region except for the active region. A concentration of an additive element in the margin part is higher than the concentration of the additive element in the active region, and the margin part has a concentration gradient of the additive element from a surface of the capacitor body toward the active region.
Abstract:
A multilayer ceramic capacitor includes a ceramic body including an active portion including dielectric layers and internal electrodes that are alternately stacked and a margin portion disposed on outer surfaces of the active portion; and external electrodes disposed on outer surfaces of the ceramic body. The margin portion includes an inner half adjacent to the active portion and an outer half adjacent to the edge of the ceramic body, and a porosity of the inner half is greater than a porosity of the outer half.
Abstract:
A coil component assembly includes a support member, a plurality of processed spaces penetrating through the support member, a plurality of coils disposed in the plurality of processed spaces, respectively, and a magnetic material covering the support member and the plurality of coils. The coil component assembly can be diced to form individually coil components.
Abstract:
An electronic component and a board having the same are provided. The electronic component includes a multilayer body including a plurality of insulating layers with a bottom surface provided as a mounting surface and a top surface opposing the bottom surface; and external electrodes disposed on opposite end surfaces of the multilayer body in a length direction of the multilayer body. The multilayer body further includes a first protrusion portion disposed on the top surface, and second and third protrusion portions disposed on opposite side surfaces of the multilayer body in a width direction of the multilayer body, and a length of the first protrusion portion in the length direction is shorter than a length of the second and third protrusion portions in the length direction.
Abstract:
There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer disposed in the ceramic body and including first internal electrodes each having a first lead part exposed to at least one of the first and second side surfaces, and second internal electrodes each having a second lead part exposed to the at least one of the first and second side surfaces, thereby forming capacitance; an upper cover layer formed on an upper portion of the active layer in the thickness direction; a lower cover layer formed on a lower portion of the active layer in the thickness direction and having a thickness greater than that of the upper cover layer; a first external; and a second external electrode.