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    PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
    1.
    发明申请
    PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD 审中-公开
    PREPREG，铜箔层压板和印刷电路板

    公开(公告)号：US20140060899A1

    公开(公告)日：2014-03-06

    申请号：US13681698

    申请日：2012-11-20

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jung Hwan Park ,  Keung Jin Sohn ,  Tae Eun Chang

    IPC: H05K1/03 ,  B32B15/08 ,  B32B15/09 ,  B32B15/098 ,  B32B7/02 ,  B32B15/088

    CPC classification number: H05K1/032 ,  B32B7/02 ,  B32B15/08 ,  B32B15/088 ,  B32B15/09 ,  B32B15/098 ,  B32B15/20 ,  B32B2262/00 ,  H05K1/0366 ,  H05K3/4673 ,  H05K2201/0141 ,  H05K2201/029 ,  Y10T428/24942

    Abstract: Disclosed herein are prepreg, a copper clad laminate (CCL), and a printed circuit board. When a reinforcing member formed of organic fiber including a liquid crystal polymer resin or a super engineering resin and a base resin having the same component as the reinforcing member are used, a coefficient of thermal expansion (CTE) and rigidity may be adjusted. In addition, during an operation of a semiconductor chip mounted on the printed circuit board, the semiconductor chip and the printed circuit board expand and contract due to heat by as much as similar degrees, and thus, the reliability of a solder joint may be enhanced. Moreover, fiber protrusion failure may be prevented compared with a case a via hole is processed by using a CO2 laser drill, thereby minimizing substrate failures.

    Abstract translation: 本文公开了预浸料，覆铜层压板（CCL）和印刷电路板。 当使用包含液晶聚合物树脂或超级工程树脂的有机纤维形成的加强件和具有与加强件相同成分的基础树脂时，可以调节热膨胀系数（CTE）和刚度。 此外，在安装在印刷电路板上的半导体芯片的操作期间，半导体芯片和印刷电路板由于热量而扩张和收缩程度相同，因此可以提高焊点的可靠性 。 此外，与通过使用CO 2激光钻头处理通孔的情况相比，可以防止纤维突出失效，从而最小化基板故障。

    METHOD FOR MEASURING COEFFICIENT OF THERMAL EXPANSION AND THERMAL MECHANICAL ANALYZER
    3.
    发明申请
    METHOD FOR MEASURING COEFFICIENT OF THERMAL EXPANSION AND THERMAL MECHANICAL ANALYZER 审中-公开
    测量热膨胀系数和热机械分析仪的方法

    公开(公告)号：US20160139068A1

    公开(公告)日：2016-05-19

    申请号：US14542366

    申请日：2014-11-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Youn Gyu Han ,  Jung Hwan Park ,  Dong Keun Lee ,  Keung Jin Sohn ,  Dong Hoon Kim ,  Cheol Ho Choi

    IPC: G01N25/16

    CPC classification number: G01N25/16

    Abstract: There is provided a method for measuring a coefficient of thermal expansion including: a step (S100) of providing two or more samples; a step (S200) of obtaining measured coefficients of thermal expansion of the two or more samples by means of a thermal mechanical analyzer; and a step (S300) of deriving a correction expression of an estimated coefficient of thermal expansion that is to be applied to the thermal mechanical analyzer through the two or more measured coefficients of thermal expansion obtained in the step (S200) and a linear regression analysis.

    Abstract translation: 提供了一种用于测量热膨胀系数的方法，包括：提供两个或更多个样品的步骤（S100） 通过热机械分析仪获得所述两个以上样品的测定的热膨胀系数的步骤（S200） 以及步骤（S300），通过步骤（S200）中获得的两个或更多个测量的热膨胀系数和线性回归分析得出将要施加到热机械分析器的估计的热膨胀系数的校正表达式 。

    CARRIER AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME
    5.
    发明申请
    CARRIER AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME 审中-公开
    使用其制造印刷电路板的载体和方法

    公开(公告)号：US20150107760A1

    公开(公告)日：2015-04-23

    申请号：US14160244

    申请日：2014-01-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Seok Moon ,  Dae Hui Jo ,  Keung Jin Sohn ,  Seong Hyun Yoo

    IPC: H05K3/46 ,  H05K1/03

    CPC classification number: H05K3/4682 ,  H05K3/007 ,  Y10T428/12569

    Abstract: Disclosed herein are a carrier and a method of manufacturing a printed circuit board using the same. More specifically, in the carrier according to the present invention, the carrier has characteristics of a coefficient of thermal expansion (CTE), a glass transition temperature (Tg), and a storage modulus which are improved by an insulating layer including an epoxy resin and a liquid crystal oligomer. In addition, a first metal layer is formed on the insulating layer, such that the printed circuit board stacked on one surface or both surfaces of the carrier may be protected from deformation by physical impact and the warpage phenomenon may be minimized.

    Abstract translation: 这里公开了使用该印刷电路板的印刷电路板的载体和方法。 更具体地说，在本发明的载体中，载体具有由包含环氧树脂的绝缘层改善的热膨胀系数（CTE），玻璃化转变温度（Tg）和储能模量的特性， 液晶低聚物。 此外，在绝缘层上形成第一金属层，使得可以通过物理冲击保护堆叠在载体的一个表面或两个表面上的印刷电路板免受变形，并且可以使翘曲现象最小化。

    MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    7.
    发明申请
    MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    多层无机基材及其制造方法

    公开(公告)号：US20140027156A1

    公开(公告)日：2014-01-30

    申请号：US13664091

    申请日：2012-10-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD

    Inventor： Ki Hwan Kim ,  Myung Sam Kang ,  Keung Jin Sohn ,  Yoong Oh ,  Da Hee Kim ,  Ki Young Yoo ,  Han Ui Lee ,  Sang Hyuck Oh

    IPC: H05K3/46 ,  H05K3/14 ,  H05K3/10 ,  H05K3/40 ,  H05K1/11 ,  H05K1/09

    CPC classification number: H05K3/4682 ,  H05K3/0097 ,  H05K3/4647 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/49155 ,  Y10T29/49156

    Abstract: Disclosed herein is a method of manufacturing a multilayer type coreless substrate, the method including: (A) preparing a carrier substrate including at least one copper foil formed on one surface or both surfaces of an insulating surface; (B) forming a coreless printed circuit precursor on one surface or both surfaces of the carrier substrate; (C) separating the carrier substrate; (D) performing a polishing cutting process on the coreless printed circuit precursor; and (E) laminating a plurality of other insulating layers on a flat outer surface of the coreless printed circuit precursor, the plurality of other insulating layers sequentially including other circuit layers and other pillars.

    Abstract translation: 本发明公开了一种制造多层型无芯基板的方法，该方法包括：（A）制备载体基板，其包括在绝缘表面的一个表面或两个表面上形成的至少一个铜箔; （B）在载体基板的一个表面或两个表面上形成无芯无印刷电路前体; （C）分离载体基板; （D）对无芯印刷电路前体进行抛光切割处理; 以及（E）在所述无芯印刷电路前体的平坦外表面上层叠多个其它绝缘层，所述多个其它绝缘层依次包括其它电路层和其他柱。

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