Abstract:
A resistive memory device may include first and second resistive memory cells, a reference current generator, and first and second bitline sense amplifiers. The reference current generator may be configured to apply the first and second reference currents to a first common node. A total reference current of the first reference current and the second reference current provided to the first common node may be divided into a first sensing current and a second sensing current by the first common node. The first and second sensing currents may be provided to the first and second bitline sense amplifiers by the first common node, respectively. The first and second bitline sense amplifiers may be configured to sense first data of the first resistive memory cell and second data of the second resistive memory cell based on the first and second sensing currents, respectively.
Abstract:
A memory module includes a memory device, a command/address buffering device, and a processing data buffer. The memory device includes a memory cell array, a first set of input/output terminals, each terminal configured to receive first command/address bits, and a second set of input/output terminals, each terminal configured to receive both data bits and second command/address bits. The command/address buffering device is configured to output the first command/address bits to the first set of input/output terminals. The processing data buffer is configured to output the data bits and second command/address bits to the second set of input/output terminals. The memory device is configured such that the first command/address bits, second command/address bits, and data bits are all used to access the memory cell array.
Abstract:
A method and a memory device therefor for reconfiguring a DQ pad organization of the memory device on-the-fly. A DQ organization reconfiguration control unit generates a control signal for reconfiguring the DQ pad organization into a desired mode based on a user command. A DQ organization reconfiguration unit is provided between P DQ pads and memory cell arrays and reconfigures organization P DQ pads on-the-fly in any one among Xi DQ pad modes, where i=1, 2, 4, 8, 16, 32, 64, and 128, based on the control signal. For the reconfiguration of the organization of the DQ pads, a plurality of bus lines for data transfer, being switchable by a control signal, are provided. The bus lines are implemented utilizing at least one of the M3 and M4 metal layers of the memory device.
Abstract:
A resistive memory device may include a resistive cell array and an on-chip resistance measurement circuit. The resistive cell array may include a plurality of resistive memory cells. The on-chip resistance measurement circuit may be configured to generate a first current and a second current greater or less than the first current based on a cell current corresponding to a cell resistance of a first memory cell of the resistive memory cells, and to generate first and second digital signals based on the first and second current, respectively.
Abstract:
Provided is a memory device that includes a memory bank including a plurality of memory cells arranged in a region where a plurality of word lines and a plurality of bit lines of the memory device intersect each other, a sense amplifier configured to amplify a signal transmitted through selected bit lines among the plurality of bit lines, and an arithmetic circuit configured to receive a first operand from the sense amplifier, receive a second operand from outside the memory device, and perform an arithmetic operation by using the first operand and the second operand, based on an internal arithmetic control signal generated in the memory device.
Abstract:
A memory device includes a memory cell array formed in a semiconductor die, the memory cell array including a plurality of memory cells to store data and a calculation circuit formed in the semiconductor die. The calculation circuit performs calculations based on broadcast data and internal data and omits the calculations with respect to invalid data and performs the calculations with respect to valid data based on index data in a skip calculation mode, where the broadcast data are provided from outside the semiconductor die, the internal data are read from the memory cell array, and the index data indicates whether the internal data are the valid data or the invalid data. Power consumption is reduced by omitting the calculations and the read operation with respect to the invalid data through the skip calculation mode based on the index data.
Abstract:
A memory module includes a memory device, a command/address buffering device, and a processing data buffer. The memory device includes a memory cell array, a first set of input/output terminals, each terminal configured to receive first command/address bits, and a second set of input/output terminals, each terminal configured to receive both data bits and second command/address bits. The command/address buffering device is configured to output the first command/address bits to the first set of input/output terminals. The processing data buffer is configured to output the data bits and second command/address bits to the second set of input/output terminals. The memory device is configured such that the first command/address bits, second command/address bits, and data bits are all used to access the memory cell array.
Abstract:
A memory device includes a cell array and a common source line compensation circuit. The cell array includes a plurality of normal cell units connected between a plurality of bit lines and one common source line, respectively. The common source line compensation circuit supplies a plurality of compensation write currents to the common source line to compensate for a plurality of write currents concurrently input into or output from the common source line through the normal cell units.