公开(公告)号：US20140225139A1

公开(公告)日：2014-08-14

申请号：US14079249

申请日：2013-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myoung Bo PARK ,  Ho Young SONG

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L33/0008 ,  H01L33/0033 ,  H01L33/0041 ,  H01L33/005 ,  H01L33/382 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0008 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: A light emitting device package includes a frame unit including at least two lead frames spaced apart from one another and a light emitting region defined by a distance between the two lead frames; a light emitting device mounted on a surface of the frame unit such that the light emitting device is positioned across the light emitting region, and electrically connected to the lead frames; a wavelength conversion unit provided in the light emitting region, and configured to convert a wavelength of light emitted from the light emitting device and emit the light having the converted wavelength; and a reflective molding unit formed on the surface of the frame unit to cover the light emitting device.

Abstract translation: 发光器件封装包括框架单元，其包括彼此间隔开的至少两个引线框架和由两个引线框架之间的距离限定的发光区域; 安装在所述框架单元的表面上的发光器件，使得所述发光器件位于所述发光区域的两侧，并且电连接到所述引线框架; 波长转换单元，设置在所述发光区域中，并且被配置为转换从所述发光器件发射的光的波长并发射具有所述转换波长的光; 以及形成在框架单元的表面上以覆盖发光器件的反射模制单元。

公开(公告)号：US20150109803A1

公开(公告)日：2015-04-23

申请号：US14490475

申请日：2014-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoung Bo PARK ,  Kyung Seok OH ,  Ho Young SONG

IPC: H01L33/38 ,  F21K99/00 ,  F21V23/00 ,  H01L33/40 ,  H01L33/42

CPC classification number: H01L33/38 ,  H01L33/405 ,  H01L33/42 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor LED package includes a package body having first and second electrode structures and an LED chip connected to at least one of the first and second electrode structures using a wire. The LED chip includes a light emitting structure and first and second electrode parts. At least one of the first and second electrode parts includes a bonding electrode layer made of a material having the same composition as a material of the wire and bonded to the wire, and an uneven electrode layer disposed on the bonding electrode layer and having at least one through hole filled with the wire. The at least one through hole allows a top surface of the bonding electrode layer to be exposed therebelow.

Abstract translation: 半导体LED封装包括具有第一和第二电极结构的封装体和使用导线连接到第一和第二电极结构中的至少一个的LED芯片。 LED芯片包括发光结构和第一和第二电极部分。 第一电极部分和第二电极部分中的至少一个包括由与导线的材料组成相同的材料制成的接合电极层，并且接合到导线上，以及不平坦电极层，设置在接合电极层上并且至少具有 一个充满电线的通孔。 至少一个通孔允许接合电极层的顶表面暴露在其下面。