Abstract:
A semiconductor memory device includes an error correction code (ECC) engine, a memory cell array, an input/output (I/O) gating circuit and a control logic circuit. The memory cell array includes a normal cell region configured to store main data and a parity cell region configured to selectively store parity data which the ECC engine generates based on the main data, and sub data received from outside of the semiconductor memory device. The control logic circuit controls the ECC engine to selectively perform an ECC encoding and an ECC decoding on the main data and controls the I/O gating circuit to store the sub data in at least a portion of the parity cell region.
Abstract:
A method of communication to a semiconductor device includes: transmitting a sampling clock signal from a first semiconductor device to a second semiconductor device; transmitting a training signal from the first semiconductor device to the second semiconductor device while transmitting of the sampling clock signal, the training signal comprising plural test patterns sent sequentially to the second semiconductor device, phases of at least some of the test patterns being adjusted to be different from each other during transmitting of the training signal; receiving first information from the second semiconductor device over a first signal line, the first signal line separate from a data bus connected between the first semiconductor device and the second semiconductor device; and transmitting a data signal over the data bus while transmitting the sampling clock signal, the data signal sent at a timing with respect to the sampling clock signal responsive to the received first information.
Abstract:
A semiconductor memory device includes an error correction code (ECC) engine, a memory cell array, an input/output (I/O) gating circuit and a control logic circuit. The memory cell array includes a normal cell region configured to store main data and a parity cell region configured to selectively store parity data which the ECC engine generates based on the main data, and sub data received from outside of the semiconductor memory device. The control logic circuit controls the ECC engine to selectively perform an ECC encoding and an ECC decoding on the main data and controls the I/O gating circuit to store the sub data in at least a portion of the parity cell region.
Abstract:
An injection-locked phase-locked loop (ILPLL) circuit includes a delay-locked loop (DLL) and an ILPLL. The DLL is configured to generate a DLL clock by performing a delay-locked operation on a reference clock. The ILPLL includes a voltage-controlled oscillator (VCO), and is configured to generate an output clock by performing an injection synchronous phase-locked operation on the reference clock. The DLL clock is injected into the VCO as an injection clock of the VCO.
Abstract:
A method of training a memory device included in a memory system is provided. The method includes testing memory core parameters for a memory core of the memory device during a booting-up sequence of the memory system; determining trimmed memory core parameters based on the test results; storing the determined trimmed memory core parameters; and applying the trimmed memory core parameter to the memory device during a normal operation of the memory device.
Abstract:
An input buffer includes a first buffer, a feedback circuit and a second buffer circuit. The feedback circuit includes a feedback resistor and a feedback inverter. The first buffer may be configured to output an amplification signal to an output node of the first buffer based on an input signal. The feedback circuit connected to the output node of the first buffer may be configured to control the amplification signal. The second buffer circuit may be configured to output a buffer output signal by buffering the amplification signal. The feedback resistor may receive the amplification signal from the output node of the first buffer and provide a feedback signal to a feedback node. The feedback inverter is connected between the feedback node and the output node. The feedback inverter may be configured to control the amplification signal based on the feedback signal.
Abstract:
A duty cycle corrector includes a sensing unit, a pad unit, a fuse unit, and a driver unit. The sensing unit generates at least one sensing signal based on the sensed duty cycle ratio of an output signal. The pad unit outputs at least one decision signal based on the at least one sensing signal. The fuse unit generates a duty cycle control signal based on at least one received fuse control signal. The driver unit adjusts a duty cycle ratio of an input signal to generate the output signal based on the duty cycle control signal. The driver unit adjusts the duty cycle ratio of the input signal by adjusting a pull-up strength or a pull-down strength of the input signal based on the duty cycle control signal.
Abstract:
A semiconductor memory device storing memory characteristic information, a memory module including the semiconductor memory device, a memory system, and an operating method of the semiconductor memory device. The semiconductor memory device may include a cell array including a plurality of areas; a command decoder configured to decode a command and generate an internal command; and an information storage unit configured to store characteristic information of at least one of the plurality of areas. When a first command and a first row address accompanying the first command are received, characteristic information of an area corresponding to the first row address is provided to an outside.
Abstract:
An on-die termination (ODT) circuit includes a calibration unit, an offset-code generating unit, an adder, and an ODT unit. The calibration unit generates a pull-up code and a pull-down code. The offset-code generates a pull-up offset code and a pull-down offset code based on a mode-register-set signal, the pull-up code, and the pull-down code. The adder adds the pull-up offset code and the pull-down offset code to the pull-up code and the pull-down code, respectively, and generates a pull-up calibration code and a pull-down calibration code. The ODT unit changes ODT resistance in response to the pull-up calibration code and the pull-down calibration code.
Abstract:
Provided are an equalizer and a semiconductor memory device including the same. The equalizer includes a delay circuit and an inverting circuit. The delay circuit is configured to output, in response to a select signal, one of a delay signal delaying an input signal applied to an input/output node and an inverted signal inverting the input signal. The inverting circuit is configured to invert a signal provided from the delay circuit and output the inverted signal to the input/output node. The equalizer is configured such that when the delay circuit outputs the delay signal, the equalizer operates as an inductive bias circuit amplifying the input signal and outputting the amplified input signal, and when the delay circuit outputs the inverted signal, the equalizer operates as a latch circuit storing and outputting the input signal.