公开(公告)号：US06930395B2

公开(公告)日：2005-08-16

申请号：US09998327

申请日：2001-12-03

申请人： Satoru Tomekawa ,  Yoshihisa Yamashita ,  Takeshi Suzuki ,  Yoshihiro Kawakita ,  Tadashi Nakamura

发明人： Satoru Tomekawa ,  Yoshihisa Yamashita ,  Takeshi Suzuki ,  Yoshihiro Kawakita ,  Tadashi Nakamura

IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/4069 ,  H05K1/0271 ,  H05K3/0035 ,  H05K3/20 ,  H05K3/384 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0355 ,  H05K2201/09109 ,  H05K2203/0361 ,  H05K2203/1461 ,  Y10T428/24

摘要： A connecting strength at a bonding site between a wiring layer 1c and a conductor 1d is enhanced by comparing a bonding strength between a wiring layer 14 provided by covering the conductor 1d on an insulating base 1a and the conductor 1d with a bonding strength between the wiring layer 1c and the insulating base 1a in an adjacency of the conductor to set the latter relatively lower.

摘要翻译： 通过将在绝缘基体1a上覆盖导体1d的导体层14与导体1d之间的接合强度与导体1d之间的接合强度进行比较来提高布线层1c和导体1d之间的接合位置的连接强度 在布线层1c和绝缘基底1a之间的接合强度在导体的邻近处，以使后者相对较低。

公开(公告)号：US07047629B2

公开(公告)日：2006-05-23

申请号：US10686576

申请日：2003-10-17

申请人： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

发明人： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

IPC分类号： H05K3/20

CPC分类号： H05K3/4069 ,  H05K3/282 ,  H05K3/389 ,  H05K3/4614 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T428/24917

摘要： A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a protective agent on an adhesion surface of a conductor foil so as to include adhesion surface regions where the protective agent does not exist; sticking the conductor foil to the insulator layer; and abutting a plurality of conductive powders constituting the conductive paste and the conductor foil to each other through the adhesion surface regions by means of heating and pressurizing the insulator layer and conductor foil.

摘要翻译： 一种电路板制造方法，包括以下步骤：在绝缘体层上形成通孔，然后用导电浆料填充所述通孔; 在导体箔的粘合表面上分散形成保护剂，以包括不存在保护剂的粘合表面区域; 将导体箔粘附到绝缘体层上; 并且通过加热和加压绝缘体层和导体箔，通过粘合表面区域将构成导电浆料和导体箔的多个导电粉末彼此邻接。

公开(公告)号：US06713688B2

公开(公告)日：2004-03-30

申请号：US09986453

申请日：2001-11-08

申请人： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

发明人： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

IPC分类号： H05K1204

CPC分类号： H05K3/4069 ,  H05K3/282 ,  H05K3/389 ,  H05K3/4614 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T428/24917

摘要： A protective agent 6 for protecting a wiring 1 is dispersed and placed in mottle-like on an interface between a via 3 and a wiring layer 2. Then, each dimension of interface regions 7 where the protective agent 6 does not exist is set to such a size that a plurality of conductive powders 4 constituting the via 3 can abutted on the wiring layer 2. Therefore, the plurality of conductive powders 4 and the wiring layer 2 are abutted each other in each interface region 7 where the protective agent 6 does not exist to electrically connect, thereby stabilizing the connection resistance for a prolonged period of time.

摘要翻译： 用于保护布线1的保护剂6在通孔3和布线层2之间的界面上分散并放置成斑驳状。然后，将不存在保护剂6的界面区域7的每个尺寸设定为 构成通孔3的多个导电粉末4可以与布线层2抵接的尺寸。因此，在保护剂6不是的各界面区域7中，多个导电粉末4和布线层2彼此抵接 存在电连接，从而稳定连接电阻长时间。

公开(公告)号：US06596381B2

公开(公告)日：2003-07-22

申请号：US09962245

申请日：2001-09-26

申请人： Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

IPC分类号： B32B300

CPC分类号： H05K1/024 ,  H05K1/036 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31511

摘要： A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.

公开(公告)号：US06866892B2

公开(公告)日：2005-03-15

申请号：US10607306

申请日：2003-06-27

申请人： Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

IPC分类号： H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  B05D3/12

CPC分类号： H05K1/024 ,  H05K1/036 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31511

摘要： A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.

公开(公告)号：US20060283626A1

公开(公告)日：2006-12-21

申请号：US11511416

申请日：2006-08-29

申请人： Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

IPC分类号： H05K1/03

CPC分类号： H05K1/024 ,  H05K1/036 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31511

摘要： A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.

公开(公告)号：US07103971B2

公开(公告)日：2006-09-12

申请号：US11060314

申请日：2005-02-18

申请人： Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

IPC分类号： H01K3/10

CPC分类号： H05K1/024 ,  H05K1/036 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31511

摘要： A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.

摘要翻译： 压缩功能层60设置在至少一个板表面上。 压缩功能层60通过将板厚度方向的压力接收到包括该层的树脂板10而增加被压缩的功能。 由此，向导体14施加足够的压力。

公开(公告)号：US20050139384A1

公开(公告)日：2005-06-30

申请号：US11060314

申请日：2005-02-18

申请人： Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

IPC分类号： H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00 ,  H05K1/03 ,  H05K3/02

CPC分类号： H05K1/024 ,  H05K1/036 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31511

摘要： A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.

摘要翻译： 压缩功能层60设置在至少一个板表面上。 压缩功能层60通过将板厚度方向的压力接收到包括该层的树脂板10而增加被压缩的功能。 由此，向导体14施加足够的压力。

公开(公告)号：US07174632B2

公开(公告)日：2007-02-13

申请号：US10754416

申请日：2004-01-09

申请人： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

发明人： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

IPC分类号： H01K3/10

CPC分类号： H05K3/4626 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle. Thereby, it is possible to make the insulating layer of the circuit board securing the interlayer electrically connection by an inner via hole including a conductive paste to be homogenized and ultra-thin and improve the reliability of the connection of the inner via hole.

摘要翻译： 包括所需数量的电绝缘层和交替层叠的布线层的电路板，以及用于通过压缩和硬化包括导电颗粒和树脂的导电膏来固定布线层之间的电连接的内通孔。 在电绝缘层中，多孔片材至少在一个表面上设置有树脂片，多孔片材至少在中心部分不浸渍树脂。 在电绝缘层的厚度方向贯通电绝缘层的贯通孔填充有包含导电性粒子和树脂的导电性糊剂，并且在多孔质片材内存在的孔填充有层叠树脂。 多孔片内的孔的平均孔径可以小于导电性粒子的平均粒径。 由此，可以使电路基板的绝缘层通过包括导电浆料的内部通孔来确保层间电连接，从而均匀化并且超薄，并提高内部通孔连接的可靠性。

公开(公告)号：US06734375B2

公开(公告)日：2004-05-11

申请号：US09956205

申请日：2001-09-18

申请人： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

发明人： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

IPC分类号： H05K111

CPC分类号： H05K3/4626 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle. Thereby, it is possible to make the insulating layer of the circuit board securing the interlayer electrically connection by an inner via hole including a conductive paste to be homogenized and ultra-thin and improve the reliability of the connection of the inner via hole.

摘要翻译： 包括所需数量的电绝缘层和交替层叠的布线层的电路板，以及用于通过压缩和硬化包括导电颗粒和树脂的导电膏来固定布线层之间的电连接的内通孔。 在电绝缘层中，多孔片材至少在一个表面上设置有树脂片，多孔片材至少在中心部分不浸渍树脂。 在电绝缘层的厚度方向贯通电绝缘层的贯通孔填充有包含导电性粒子和树脂的导电性糊剂，并且在多孔质片材内存在的孔填充有层叠树脂。 多孔片内的孔的平均孔径可以小于导电性粒子的平均粒径。 由此，可以使电路基板的绝缘层通过包含导电性糊剂的内部通路孔进行层间电连接，使其均匀化，超薄化，提高内部通孔连接的可靠性。