摘要:
A polyurethane foam is obtained by reacting raw materials containing a polyisocyanate, a polyol, a water-absorbency-imparting agent, a catalyst, and a blowing agent, foaming the reaction mixture, and curing the foamed product. The polyol is a polyester polyol. The water-absorbency-imparting agent is a polyoxyalkylene compound having a molecular weight of 100 to 1000 and having a hydroxy group at an end of the molecular chain, or an alcohol with 1 to 8 carbon atoms. The amount of the water-absorbency-imparting agent is from 0.5 to 8 parts by mass per 100 parts by mass of the polyester polyol. The polyisocyanate is an aliphatic polyisocyanate, an alicyclic polyisocyanate, or an aromatic polyisocyanate in which the isocyanate groups are not directly attached to an aromatic ring. The foam has a water absorption ratio of 10 to 30 and a color difference ΔYI of 7 or less. The time required until water dropped onto a surface of the foam is completely absorbed into the foam is 20 seconds or less.
摘要:
A polyurethane foam is obtained by reacting, foaming, and curing raw material that includes a polyol, a polyisocyanate, a blowing agent, a catalyst, and an inorganic compound hydrate. The raw material includes, as the polyol, a polymeric polyol obtained by graft polymerization of a vinyl monomer onto a polyether polyol and a polyether polyol obtained by addition polymerization of an alkylene oxide to a polyhydric alcohol and having a mass average molecular weight of 400 to 1,000. The blending quantity of the inorganic compound hydrate is 10 to 80 parts by mass per 100 parts by mass of the polyol. Preferably, the raw material further includes, as the polyol, a polyether polyol obtained by addition polymerization of an alkylene oxide to a polyhydric alcohol and has a molecular weight of 2,000 to 4,000.
摘要:
A polyurethane foam is obtained by reacting, foaming, and curing raw material that includes a polyol, a polyisocyanate, a blowing agent, a catalyst, and an inorganic compound hydrate. The raw material includes, as the polyol, a polymeric polyol obtained by graft polymerization of a vinyl monomer onto a polyether polyol and a polyether polyol obtained by addition polymerization of an alkylene oxide to a polyhydric alcohol and having a mass average molecular weight of 400 to 1,000. The blending quantity of the inorganic compound hydrate is 10 to 80 parts by mass per 100 parts by mass of the polyol. Preferably, the raw material further includes, as the polyol, a polyether polyol obtained by addition polymerization of an alkylene oxide to a polyhydric alcohol and has a molecular weight of 2,000 to 4,000.
摘要:
An LED lamp 100 includes: an LED chip 10; a phosphor resin portion 12 that covers the LED chip 10; and a light-transmissive member 20 that covers the phosphor resin portion 12. The phosphor resin portion 12 includes: a phosphor for converting the emission of the LED chip 10 into light that has a longer wavelength than the emission; and a resin in which the phosphor is dispersed. The surface of the light-transmissive member 20 includes an upper surface portion 22 located over the LED chip 10 and a side surface portion 24 located around and below the upper surface portion 22. At least a part (low-transmittance part 26) of the side surface portion 24 of the light-transmissive member 20 has lower transmittance than the upper surface portion 22.
摘要:
In a light emitting apparatus that includes a plurality of semiconductor light emitting devices 2 each having a light emitting face covered with a phosphor layer 3, a semiconductor assembly obtained by assembling a submount and the semiconductor light emitting devices is mounted on the substrate. Accordingly, chromaticity characteristics of the semiconductor assembly can be measured before the semiconductor assembly is mounted on the substrate. Therefore, even if using a plurality of semiconductor light emitting devices, a semiconductor assembly can be prepared on which the semiconductor light emitting devices each having uniform chromaticity characteristics are mounted before the semiconductor assembly is mounted on the substrate. And, a light emitting apparatus having suppressed dispersion of chromaticity can be manufactured.
摘要:
An LED lamp includes at least one LED chip mounted on the principal surface of a substrate and an optical wavelength converting portion, which includes a phosphor for converting the emission of the LED chip into light having a longer wavelength than that of the emission and which covers at least a portion of the LED chip. The side surface of the optical wavelength converting portion has at least one concave curved surface portion.
摘要:
An LED illumination source comprises a heat dissipating substrate which includes a metal plate and at least two insulating layers thereon. LEI) bare chips are mounted on a surface of the substrate. An optical reflector with holes surrounds the LED bare chips. The optical reflector is provided on the surface of the substrate on which the LED bare chips are mounted. A resin encapsulates the entire optical reflector on the substrate, the resin molding each of the LED bare chips and functioning as an optical lens for each of the LED bare chips.
摘要:
According to the present invention, a substrate 11, a cluster of LED chips, which are arranged two-dimensionally on the substrate 11, and a plurality of phosphor resin portions 13a, 13b that cover the respective LED chips are provided. The phosphor resin portion 13a, 13b includes a phosphor for transforming the emission of its associated LED chip into a light ray having a longer wavelength than that of the emission. A size of the phosphor resin portions 13b, which cover the LED chips located in an outer region of the cluster, is set bigger than that of the other phosphor resin portions 13a, which cover the LED chips located in the remaining non-outer region.
摘要:
An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.
摘要:
A cover layer 21 made of a first transparent resin is formed on outer peripheries of bulbs 25 of plural fluorescent lamps 20 of a backlight 10 for liquid crystal display. The fluorescent lamps 20 are enclosed in the holder member 22 made of a second transparent resin so as to be juxtaposed with each other. The first transparent resin has lower hardness than that of the second transparent resin so as to absorb stresses applied to the fluorescent lamp 20. The first transparent resin has greater heat resistance than that of the second transparent resin so as to suppress alternation such as yellowing due to heat generated by the fluorescent lamps 22.