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    ELECTRONIC DEVICE
    2.
    发明申请
    ELECTRONIC DEVICE 有权
    电子设备

    公开(公告)号：US20090085707A1

    公开(公告)日：2009-04-02

    申请号：US12237826

    申请日：2008-09-25

    申请人： Xiaoyu MI ,  Takeo Takahashi ,  Tsuyoshi Matsumoto ,  Satoshi Ueda

    发明人： Xiaoyu MI ,  Takeo Takahashi ,  Tsuyoshi Matsumoto ,  Satoshi Ueda

    IPC分类号： H01F5/00

    CPC分类号： H01F17/0013 ,  H01F27/29 ,  H01F2017/002 ,  H01F2017/0073

    摘要： An electronic device includes a substrate, a first coil that has a spiral shape and is provided on the substrate, a second coil that has a spiral shape, is provided above the first coil, and is spaced from the first coil, a first connection portion that electrically couples the first coil and the second coil, a wire that is provided on the substrate and connects one of the first coil and the second coil to outside, and a second connection portion that is mechanically connected to an outer side face of outermost circumference of the second coil and is mechanically connected on the substrate where one of the wire and the first coil is not provided.

    摘要翻译： 一种电子设备包括基板，具有螺旋形状并设置在基板上的第一线圈，具有螺旋形状的第二线圈，设置在第一线圈上方，并与第一线圈间隔开，第一连接部分 将第一线圈和第二线圈电耦合的线路，设置在基板上并将第一线圈和第二线圈中的一个连接到外部的线，以及机械地连接到最外侧的外侧面的第二连接部 并且机械连接在不设置线和第一线圈中的一个的基板上。

    Integrated electronic device and method of making the same
    8.
    发明申请
    Integrated electronic device and method of making the same 有权
    集成电子设备及其制作方法

    公开(公告)号：US20070045773A1

    公开(公告)日：2007-03-01

    申请号：US11509577

    申请日：2006-08-25

    申请人： Xiaoyu Mi ,  Yoshihiro Mizuno ,  Tsuyoshi Matsumoto ,  Hisao Okuda ,  Satoshi Ueda

    发明人： Xiaoyu Mi ,  Yoshihiro Mizuno ,  Tsuyoshi Matsumoto ,  Hisao Okuda ,  Satoshi Ueda

    IPC分类号： H01L29/00 ,  H01L23/52 ,  H01F27/28 ,  H01F5/00

    CPC分类号： H01L27/0688 ,  H01F17/0006 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

    摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.

    摘要翻译： 集成电子设备包括基板，无源部件，用于外部连接的焊盘和三维布线。 无源部件包括设置在基板上的多级线圈电感器。 多级线圈电感器具有多个以多层布置的线圈。 相互相邻的线圈线彼此间隔开。 三维布线包括在基板上延伸的第一布线部分，从基板延伸而沿着基板延伸的第二布线部分和与第一布线部分和第二布线部分连接的第三布线部分。

    Electronic component
    9.
    发明申请
    Electronic component 有权
    电子元器件

    公开(公告)号：US20070102784A1

    公开(公告)日：2007-05-10

    申请号：US11582506

    申请日：2006-10-18

    申请人： Tsuyoshi Matsumoto ,  Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Satoshi Ueda

    发明人： Tsuyoshi Matsumoto ,  Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Satoshi Ueda

    IPC分类号： H01L29/00

    CPC分类号： H01G4/252 ,  H01G4/33 ,  H01L28/60 ,  H03H1/0007

    摘要： An electronic component includes a substrate, a capacitor, and a wiring. The capacitor has a multilayer structure including a first electrode film provided on the substrate, a second electrode film of 2 to 4 μm in thickness disposed to face the first electrode film, and a dielectric film interposed between the first and the second electrode film. The wiring includes a joint portion connected to the second electrode film, on the opposite side of the dielectric film.

    摘要翻译： 电子部件包括基板，电容器和布线。 电容器具有多层结构，其包括设置在基板上的第一电极膜，设置为面对第一电极膜的厚度为2至4μm的第二电极膜，以及介于第一和第二电极膜之间的电介质膜。 所述布线包括在所述电介质膜的相对侧上与所述第二电极膜连接的接合部。

    Electronic component
    10.
    发明申请
    Electronic component 有权
    电子元器件

    公开(公告)号：US20070158848A1

    公开(公告)日：2007-07-12

    申请号：US11585877

    申请日：2006-10-25

    申请人： Tsuyoshi Matsumoto ,  Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Satoshi Ueda

    发明人： Tsuyoshi Matsumoto ,  Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Satoshi Ueda

    IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

    CPC分类号： H01G4/008 ,  H01G4/232 ,  H01G4/33 ,  H01L24/18 ,  H01L28/10 ,  H01L28/75

    摘要： An electronic component includes a substrate, and a capacitor unit on the substrate. The capacitor unit has a laminate structure including a first electrode layer provided on the substrate, a second electrode layer opposed to the first electrode layer, and a dielectric layer disposed between the first and the second electrode layers. The first electrode layer has a multilayer structure including an adhesion metal layer joined to the dielectric layer. The adhesion metal layer is provided with an oxide coating on a side of the dielectric layer.

    摘要翻译： 电子部件包括基板和基板上的电容器单元。 电容器单元具有包括设置在基板上的第一电极层，与第一电极层相对的第二电极层和设置在第一和第二电极层之间的电介质层的层压结构。 第一电极层具有包含与电介质层接合的粘附金属层的多层结构。 附着金属层在电介质层一侧设置有氧化物涂层。