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公开(公告)号：US08259459B2
公开(公告)日：2012-09-04
申请号：US12239202
申请日：2008-09-26
CPC分类号： H05K1/0269 , H01F17/0013 , H01L23/544 , H01L23/645 , H01L27/016 , H01L28/10 , H01L2223/54426 , H01L2924/0002 , H01L2924/09701 , H01L2924/19105 , H01L2924/3011 , H05K1/165 , H05K2201/0391 , H05K2201/09663 , H05K2201/09781 , H05K2201/2054 , H01L2924/00
摘要： An electronic device includes a substrate, a coil that has a spiral shape and is provided on the substrate, and a conductive pattern that is provided inside of the coil, has optical reflectivity higher than that of a surface of the coil, and is divided into pieces.
摘要翻译： 电子设备包括基板，具有螺旋形状并设置在基板上的线圈和设置在线圈内部的导电图案，其光学反射率高于线圈表面的光学反射率，并且被划分为 件
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公开(公告)号：US08766103B2
公开(公告)日：2014-07-01
申请号：US12343784
申请日：2008-12-24
IPC分类号： H05K1/02
CPC分类号： H05K1/16 , H01L2224/16 , H05K1/0306 , H05K1/113 , H05K3/246 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/0195 , H05K2201/0347 , H05K2201/09436
摘要： An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that is provided on the insulating film so as to cover the opening, and is electrically connected to the penetration electrode; and a second connecting terminal that is provided on a region of the insulating film other than the opening region.
摘要翻译： 电子部件包括：多层陶瓷基板，其具有形成在其中的穿透电极，并且在其上表面上设置无源元件; 绝缘膜，设置在所述多层陶瓷基板上，并且在所述贯通电极的上方具有开口部; 第一连接端子，设置在绝缘膜上以覆盖开口，并且电连接到穿透电极; 以及第二连接端子，其设置在除了开口区域之外的绝缘膜的区域上。
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公开(公告)号：US20090166068A1
公开(公告)日：2009-07-02
申请号：US12343784
申请日：2008-12-24
CPC分类号： H05K1/16 , H01L2224/16 , H05K1/0306 , H05K1/113 , H05K3/246 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/0195 , H05K2201/0347 , H05K2201/09436
摘要： An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that is provided on the insulating film so as to cover the opening, and is electrically connected to the penetration electrode; and a second connecting terminal that is provided on a region of the insulating film other than the opening region.
摘要翻译： 电子部件包括：多层陶瓷基板，其具有形成在其中的穿透电极，并且在其上表面上设置无源元件; 绝缘膜，设置在所述多层陶瓷基板上，并且在所述贯通电极的上方具有开口部; 第一连接端子，设置在绝缘膜上以覆盖开口，并且电连接到穿透电极; 以及第二连接端子，其设置在除了开口区域之外的绝缘膜的区域上。
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公开(公告)号：US08221962B2
公开(公告)日：2012-07-17
申请号：US12343935
申请日：2008-12-24
申请人： Takeo Takahashi , Xiaoyu Mi , Tsuyoshi Yokoyama , Satoshi Ueda
发明人： Takeo Takahashi , Xiaoyu Mi , Tsuyoshi Yokoyama , Satoshi Ueda
IPC分类号： G03F7/26
CPC分类号： H05K1/16 , H01F41/041 , H01L25/16 , H01L2224/11 , H01L2224/16225 , H01L2924/0002 , H01L2924/19015 , H05K1/0306 , H05K1/162 , H05K1/165 , H05K3/0023 , H05K3/108 , H05K3/388 , H05K3/4611 , H05K3/4629 , H05K3/4688 , H01L2924/00
摘要： A method of manufacturing an electronic device includes forming a photosensitive SOG oxide layer on a multi-layer ceramics substrate having a penetrating electrode, forming an opening by subjecting the photosensitive SOG oxide layer to an exposure treatment and developing treatment so that an upper face of the penetrating electrode is exposed, and forming a passive element on the photosensitive SOG oxide layer, the passive element being connected to the penetrating electrode through the opening.
摘要翻译： 一种制造电子器件的方法包括在具有穿透电极的多层陶瓷衬底上形成感光性SOG氧化物层，通过使感光性SOG氧化物层进行曝光处理和显影处理，形成开口，从而使 暴露穿透电极，并在感光SOG氧化物层上形成无源元件，无源元件通过开口连接到穿透电极。
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公开(公告)号：US20090085707A1
公开(公告)日：2009-04-02
申请号：US12237826
申请日：2008-09-25
申请人： Xiaoyu MI , Takeo Takahashi , Tsuyoshi Matsumoto , Satoshi Ueda
发明人： Xiaoyu MI , Takeo Takahashi , Tsuyoshi Matsumoto , Satoshi Ueda
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F27/29 , H01F2017/002 , H01F2017/0073
摘要： An electronic device includes a substrate, a first coil that has a spiral shape and is provided on the substrate, a second coil that has a spiral shape, is provided above the first coil, and is spaced from the first coil, a first connection portion that electrically couples the first coil and the second coil, a wire that is provided on the substrate and connects one of the first coil and the second coil to outside, and a second connection portion that is mechanically connected to an outer side face of outermost circumference of the second coil and is mechanically connected on the substrate where one of the wire and the first coil is not provided.
摘要翻译： 一种电子设备包括基板，具有螺旋形状并设置在基板上的第一线圈，具有螺旋形状的第二线圈，设置在第一线圈上方，并与第一线圈间隔开，第一连接部分 将第一线圈和第二线圈电耦合的线路，设置在基板上并将第一线圈和第二线圈中的一个连接到外部的线，以及机械地连接到最外侧的外侧面的第二连接部 并且机械连接在不设置线和第一线圈中的一个的基板上。
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公开(公告)号：US20110171806A1
公开(公告)日：2011-07-14
申请号：US13064347
申请日：2011-03-21
申请人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
发明人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
IPC分类号： H01L21/02
CPC分类号： H01L27/0688 , H01F17/0006 , H01L23/5227 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.
摘要翻译： 集成电子设备包括基板，无源部件，用于外部连接的焊盘和三维布线。 无源部件包括设置在基板上的多级线圈电感器。 多级线圈电感器具有多个以多层布置的线圈。 相互相邻的线圈线彼此间隔开。 三维布线包括在基板上延伸的第一布线部分，从基板延伸而沿着基板延伸的第二布线部分和与第一布线部分和第二布线部分连接的第三布线部分。
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公开(公告)号：US08518789B2
公开(公告)日：2013-08-27
申请号：US13064347
申请日：2011-03-21
申请人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
发明人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
IPC分类号： H01L21/20
CPC分类号： H01L27/0688 , H01F17/0006 , H01L23/5227 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.
摘要翻译： 集成电子设备包括基板，无源部件，用于外部连接的焊盘和三维布线。 无源部件包括设置在基板上的多级线圈电感器。 多级线圈电感器具有多个以多层布置的线圈。 相互相邻的线圈线彼此间隔开。 三维布线包括在基板上延伸的第一布线部分，从基板延伸而沿着基板延伸的第二布线部分和与第一布线部分和第二布线部分连接的第三布线部分。
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公开(公告)号：US07948056B2
公开(公告)日：2011-05-24
申请号：US11509577
申请日：2006-08-25
申请人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
发明人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
IPC分类号： H01L29/00
CPC分类号： H01L27/0688 , H01F17/0006 , H01L23/5227 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.
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公开(公告)号：US20090085708A1
公开(公告)日：2009-04-02
申请号：US12238764
申请日：2008-09-26
申请人： Tsuyoshi MATSUMOTO , Xiaoyu Mi , Takeo Takahashi , Satoshi Ueda
发明人： Tsuyoshi MATSUMOTO , Xiaoyu Mi , Takeo Takahashi , Satoshi Ueda
IPC分类号： H01F5/00
CPC分类号： H01F17/0013
摘要： An electronic device includes a substrate, two ellipse spiral coils that are provided on the substrate, are spaced from each other in a longitudinal direction thereof, and are electrically connected to each other, two wires that are electrically connected to outermost circumference of the two coils respectively and extract the two coils to outside, and a connection portion that electrically connects each end of innermost circumference of the two coils. A ratio of inner diameter against outer diameter of the two coils in a long axis direction and in a short axis direction thereof is respectively 0.5 to 0.8.
摘要翻译： 电子设备包括基板，设置在基板上的两个椭圆螺旋线圈沿其纵向方向彼此间隔开，并且彼此电连接，两条电线与两个线圈的最外周电连接 分别将两个线圈提取到外部，以及连接部，其将两个线圈的最内周的各端电连接。 两个线圈的内径与外径的长轴方向和短轴方向的比分别为0.5〜0.8。
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公开(公告)号：US08209829B2
公开(公告)日：2012-07-03
申请号：US12394995
申请日：2009-02-27
申请人： Takeo Takahashi , Xiaoyu Mi , Satoshi Ueda
发明人： Takeo Takahashi , Xiaoyu Mi , Satoshi Ueda
IPC分类号： H01G7/00
CPC分类号： H01G4/06 , H01G13/00 , H01L27/016 , H01L28/10 , H01L28/40 , H05K1/0306 , H05K1/162 , H05K3/4007 , H05K3/4611 , H05K3/4629 , H05K3/4644 , H05K2201/09763 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T29/49126
摘要： A method of fabricating an electronic device includes selectively forming a glass layer on a ceramic substrate by printing, baking the glass layer, and forming a capacitor on the glass layer, the capacitor including metal electrodes and a dielectric layer interposed between the metal electrodes.
摘要翻译： 一种制造电子器件的方法包括通过印刷，烘烤玻璃层和在玻璃层上形成电容器，在陶瓷基片上选择性地形成玻璃层，电容器包括金属电极和置于金属电极之间的电介质层。
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