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公开(公告)号：US20230263018A1
公开(公告)日：2023-08-17
申请号：US18138866
申请日：2023-04-25
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shunpei Yamazaki , Masakatsu Ohno , Hiroki Adachi , Satoru Idojiri , Koichi Takeshima
IPC: H10K59/126 , H01L27/12 , H10K50/844 , H10K50/842 , H10K59/38 , H10K59/124 , H10K59/121 , H10K71/00 , H10K71/50 , H10K71/80 , H10K71/40 , H10K77/10 , H01L29/24 , H01L29/66 , H01L29/786 , B23K26/0622 , B23K26/04 , B23K26/06 , B23K26/08
CPC classification number: H10K59/126 , H01L27/1225 , H01L27/1266 , H10K50/844 , H10K50/8426 , H10K59/38 , H10K59/124 , H10K59/1213 , H10K71/00 , H10K71/50 , H10K71/80 , H10K71/421 , H10K77/111 , H01L29/24 , H01L29/66969 , H01L29/78603 , H01L29/7869 , B23K26/0622 , B23K26/04 , B23K26/0617 , B23K26/0643 , B23K26/0648 , B23K26/083 , Y02E10/549 , Y02P70/50 , H10K50/18
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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公开(公告)号：US12033987B2
公开(公告)日：2024-07-09
申请号：US17270722
申请日：2019-08-26
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Kazunori Watanabe , Koji Kusunoki , Taiki Nonaka , Hiroki Adachi , Koichi Takeshima
IPC: H01L25/075 , H01L27/12 , H01L29/786 , H01L33/62
CPC classification number: H01L25/0753 , H01L27/1207 , H01L27/1225 , H01L29/78648 , H01L29/7869 , H01L33/62
Abstract: A display device with high display quality and low power consumption is provided. In the display device, a first transistor, a second transistor, a first conductive layer, and a light-emitting diode package are included in a pixel, and then the light-emitting diode package includes a first light-emitting diode, a second light-emitting diode, a second conductive layer, a third conductive layer, and a fourth conductive layer. One of a source and a drain of the first transistor is electrically connected to the first light-emitting diode through the second conductive layer. One of a source and a drain of the second transistor is electrically connected to the second light-emitting diode through the third conductive layer. The first conductive layer supplied with a constant potential is electrically connected to the other electrodes of the first and second light-emitting diodes through the fourth conductive layer.
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公开(公告)号：US10763322B2
公开(公告)日：2020-09-01
申请号：US16509819
申请日：2019-07-12
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Masakatsu Ohno , Hiroki Adachi , Satoru Idojiri , Koichi Takeshima
IPC: H01L27/32 , H01L51/00 , H01L51/56 , H01L51/52 , H01L27/12 , H01L29/24 , H01L29/66 , H01L29/786 , B23K26/0622 , B23K26/04 , B23K26/06 , B23K26/08 , H01L51/50 , H01L41/314
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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公开(公告)号：US09559317B2
公开(公告)日：2017-01-31
申请号：US15145260
申请日：2016-05-03
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Masakatsu Ohno , Hiroki Adachi , Satoru Idojiri , Koichi Takeshima
IPC: H01L21/00 , H01L51/00 , H01L51/56 , H01L51/52 , H01L29/24 , H01L29/66 , H01L29/786 , B23K26/04 , B23K26/06 , B23K26/08 , H01L27/12 , H01L51/50 , H01L41/314 , H01L27/32
CPC classification number: H01L27/3272 , B23K26/04 , B23K26/0617 , B23K26/0622 , B23K26/0643 , B23K26/0648 , B23K26/083 , H01L27/1225 , H01L27/1266 , H01L27/322 , H01L27/3244 , H01L27/3258 , H01L27/3262 , H01L29/24 , H01L29/66969 , H01L29/78603 , H01L29/7869 , H01L41/314 , H01L51/0024 , H01L51/0027 , H01L51/003 , H01L51/0097 , H01L51/5096 , H01L51/5246 , H01L51/5253 , H01L51/5284 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/521
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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公开(公告)号：US11672148B2
公开(公告)日：2023-06-06
申请号：US17307088
申请日：2021-05-04
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shunpei Yamazaki , Masakatsu Ohno , Hiroki Adachi , Satoru Idojiri , Koichi Takeshima
IPC: H01L27/00 , H01L27/32 , H01L51/00 , H01L51/56 , H01L51/52 , H01L27/12 , H01L29/24 , H01L29/66 , H01L29/786 , B23K26/0622 , B23K26/04 , B23K26/06 , B23K26/08 , H01L51/50 , H01L41/314
CPC classification number: H01L27/3272 , B23K26/04 , B23K26/0617 , B23K26/0622 , B23K26/0643 , B23K26/0648 , B23K26/083 , H01L27/1225 , H01L27/1266 , H01L27/322 , H01L27/3258 , H01L27/3262 , H01L29/24 , H01L29/66969 , H01L29/7869 , H01L29/78603 , H01L51/003 , H01L51/0024 , H01L51/0027 , H01L51/0097 , H01L51/5246 , H01L51/5253 , H01L51/56 , H01L27/3244 , H01L41/314 , H01L51/5096 , H01L51/5284 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/50
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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Patent Agency Ranking
公开(公告)号：US10854697B2
公开(公告)日：2020-12-01
申请号：US16204102
申请日：2018-11-29
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Masakatsu Ohno , Hiroki Adachi , Satoru Idojiri , Koichi Takeshima
IPC: H01L27/32 , H01L51/00 , H01L51/56 , H01L51/52 , H01L27/12 , H01L29/24 , H01L29/66 , H01L29/786 , B23K26/0622 , B23K26/04 , B23K26/06 , B23K26/08 , H01L51/50 , H01L41/314
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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公开(公告)号：US09849660B2
公开(公告)日：2017-12-26
申请号：US15165099
申请日：2016-05-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Saki Eguchi , Koichi Takeshima , Hiroki Adachi
CPC classification number: B32B43/006 , B32B37/003 , B32B37/22 , B32B38/10 , B32B2457/14 , B32B2457/20 , H01L21/67132 , H01L21/6836 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68381 , H01L2221/68386 , H01L2221/6839 , H01L2221/68395
Abstract: A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.
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公开(公告)号：US09770894B2
公开(公告)日：2017-09-26
申请号：US15248579
申请日：2016-08-26
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Masakatsu Ohno , Hiroki Adachi , Satoru Idojiri , Koichi Takeshima
IPC: B32B43/00 , B32B38/10 , B32B37/12 , H01L51/56 , H01L27/32 , H01L51/52 , B32B37/00 , B32B37/26 , H01L51/00
CPC classification number: B32B43/006 , B32B37/0053 , B32B37/025 , B32B37/12 , B32B37/1207 , B32B38/10 , B32B2037/1253 , B32B2037/268 , B32B2457/20 , B32B2457/208 , H01L27/322 , H01L27/323 , H01L27/3262 , H01L51/0013 , H01L51/003 , H01L51/524 , H01L51/5253 , H01L51/5284 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/5315 , H01L2251/5338 , Y10T156/1111 , Y10T156/1174 , Y10T156/1928 , Y10T156/195
Abstract: The yield of a peeling process is improved. A peeling apparatus includes a structure body with a convex surface and a stage with a supporting surface which faces the convex surface. The structure body can hold a first member of a process member between the convex surface and the supporting surface. The stage can hold a second member of the process member. The radius of curvature of the convex surface is less than the radius of curvature of the supporting surface. The linear velocity of the convex surface is greater than or equal to the speed of a rotation center of the structure body passing the stage. The first member is wound along the convex surface to be separated from the second member.
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公开(公告)号：US11004925B2
公开(公告)日：2021-05-11
申请号：US16872806
申请日：2020-05-12
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Masakatsu Ohno , Hiroki Adachi , Satoru Idojiri , Koichi Takeshima
IPC: H01L27/32 , H01L51/00 , H01L51/56 , H01L51/52 , H01L27/12 , H01L29/24 , H01L29/66 , H01L29/786 , B23K26/0622 , B23K26/04 , B23K26/06 , B23K26/08 , H01L51/50 , H01L41/314
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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公开(公告)号：US10312315B2
公开(公告)日：2019-06-04
申请号：US15416166
申请日：2017-01-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Masakatsu Ohno , Hiroki Adachi , Satoru Idojiri , Koichi Takeshima
IPC: H01L21/00 , H01L27/32 , B23K26/06 , B23K26/0622 , B23K26/08 , H01L27/12 , H01L29/24 , H01L29/66 , H01L29/786 , H01L51/00 , H01L51/52 , H01L51/56 , B23K26/04 , H01L41/314 , H01L51/50
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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