Manufacturing method of semiconductor device
    10.
    发明授权
    Manufacturing method of semiconductor device 有权
    半导体器件的制造方法

    公开(公告)号:US08889496B2

    公开(公告)日:2014-11-18

    申请号:US13917012

    申请日:2013-06-13

    摘要: It is an object to provide a manufacturing method of a structure of a thin film transistor including an oxide semiconductor film, in which threshold voltage at which a channel is formed is positive and as close to 0 V as possible. A protective insulating layer is formed to cover a thin film transistor including an oxide semiconductor layer that is dehydrated or dehydrogenated by first heat treatment, and second heat treatment at a temperature that is lower than that of the first heat treatment, in which the increase and decrease in temperature are repeated plural times, is performed, whereby a thin film transistor including an oxide semiconductor layer, in which threshold voltage at which a channel is formed is positive and as close to 0 V as possible without depending on the channel length, can be manufactured.

    摘要翻译: 本发明的目的是提供一种包括氧化物半导体膜的薄膜晶体管的结构的制造方法,其中形成沟道的阈值电压为正且尽可能接近0V。 形成保护绝缘层以覆盖包括通过第一热处理脱水或脱氢的氧化物半导体层的薄膜晶体管,以及在比第一热处理低的温度下进行第二热处理,其中, 重复多次温度的降低,由此,在不影响通道长度的情况下,包含氧化物半导体层的薄膜晶体管,其中形成沟道的阈值电压为正且尽可能接近0V,可以 制造。