摘要:
An optical interconnection system, particularly useful in a backplane arrangement in an electronic assembly. The interconnection system includes “dual-use” protective covers for protection from damage and/or cleaning within backplane and daughter card style connectors. The protective covers are modular for easy use. Some versions contain adhesive members that can remove contaminates from various portions of the connector assembly. The protective covers can be inserted into a backplane connector of an electronic assembly using a tool or as part of a “dummy board.”
摘要:
An optical connector system joining waveguides in two printed circuit boards. A flexible optical conductor is connected at one end to one of the boards. The flexible conductor includes at its free end an alignment structure that provides a separable, low loss interface to an alignment structure coupled to the waveguide on the other board. The ends of the waveguides are enclosed in housings that protect the waveguides from abrasion and contaminates, but expose the waveguides when the connectors mate.
摘要:
An optical connector system assembled from modular components. These components include connector modules that position ferrules for mating and providing fine alignment to fibers. The modules are assembled to support members to form connectors of various sizes. Mounting modules are attached to the support members. Various shaped mounting modules are provided, allowing connectors to be assembled for various configurations, such as a matrix configuration, a parallel board-to-board configuration or a panel mount configuration.
摘要:
An optical connector system joining waveguides in two printed circuit boards. A flexible optical conductor is connected at one end to one of the boards. The flexible conductor includes at its free end an alignment structure that provides a separable, low loss interface to an alignment structure coupled to the waveguide on the other board. The ends of the waveguides are enclosed in housings that protect the waveguides from abrasion and contaminates, but expose the waveguides when the connectors mate.
摘要:
This invention releases to systems and methods for detecting the presence and quantity of a target nucleic acid in a sample using dPCR and PIP encapsulated monodisperse droplets.
摘要:
The present invention generally pertains to methods and kits for managing the variation in spectroscopic intensity measurements through the use of a reference component. The reference component may comprise a reference spectroscopic substance and may be contained together with a sample of interest in a sample to be tested, wherein the sample of interest may comprise a sample spectroscopic substance. Each sample to be tested may be uniquely identified and, hence, “barcoded” by combinations of different colors and concentrations of spectroscopic substances, contained therein.
摘要:
A liquid storage apparatus provides a safe and easy to use device for efficiently managing liquid reagents used in a variety of laboratory equipment. The liquid storage apparatus helps reduce the likelihood of accidental sticks to laboratory personnel, allows for flexibility of experimental design, and helps maximize the use of chemical regents to prevent waste. The apparatus includes a plurality of containers of liquid with a pierceable septum interface at each end. The apparatus also includes a lower array of needles with each of the lower needles in the lower array of needles arranged to penetrate the bottom pierceable septum of a different one of the containers. Each of the needles includes a passage so the liquid can flow out of the pierced container. The apparatus further includes an upper array of needles with each of the upper needles in the upper array of needles arranged to penetrate the top pierceable septum of a different one of the containers. Each of the needles include a passage so gas can flow into the pierced container to occupy the space created as the liquid flows out of the container.
摘要:
An optical interconnection system, particularly useful in a backplane arrangement in an electronic assembly. The interconnection system includes “dual-use” protective covers for protection from damage and/or cleaning within backplane and daughter card style connectors. The protective covers are modular for easy use. Some versions contain adhesive members that can remove contaminates from various portions of the connector assembly. The protective covers can be inserted into a backplane connector of an electronic assembly using a tool or as part of a “dummy board.”
摘要:
An optical backplane assembly made from a backplane and daughter cards attached to the backplane. The backplane includes optical vias coupled to optical signal traces in the backplane. Reflective elements are positioned in the vias to direct the optical signals to optical traces on the daughter cards. The required precision to position the reflective elements is achieved by determining the centers of the optical signal traces. Light emitting elements within the backplane are used to determine the locations of the optical signal traces.
摘要:
An interconnection circuit includes a plated through hole having a plurality of electrically isolated segments with at least one of the plurality of electrically isolated segments coupled to a signal path and at least one of the electrically isolated segments coupled to ground. With this arrangement, the circuit provides a signal path between a first and a second different layers of a multilayer. By providing one segment as a signal segment and another segment as a ground segment the size and shape of the electrically isolated segments can be selected to provide the interconnection circuit having a predetermined impedance characteristic. The interconnection circuit can thus be impedance matched to circuit board circuits, devices and transmission lines, such as striplines, microstrips and co-planar waveguides. This results in an interconnection circuit which maintains the integrity of relatively high-frequency signals propagating through the interconnection circuit from the first layer to the second layer. The interconnect circuits can be formed by creating distinct conductor paths within the cylindrical plated through-holes using variety of manufacturing techniques including, but not limited to, broaching techniques, electrical discharge milling (EDM) techniques and laser etching techniques.