公开(公告)号：US20070123320A1

公开(公告)日：2007-05-31

申请号：US11432066

申请日：2006-05-11

申请人： Seung-Woo Han ,  Kyu-Sub Kwak ,  Kyung Park

发明人： Seung-Woo Han ,  Kyu-Sub Kwak ,  Kyung Park

IPC分类号： H04M1/00

CPC分类号： H04M1/23 ,  G06F3/0213 ,  G06F3/0362 ,  H04M1/0218 ,  H04M1/233

摘要： A key input device for a portable terminal includes wheel keys capable of rotating in multiple directions and performing a switch function. The key input device including a plurality of keys having at least one wheel keys provided in a main body and rotating in multiple directions, at least one rotating units allowing the wheel keys to rotate in respective directions, and at least one switching units provided under the wheel keys to sense the rotation directions of the wheel keys and to sense a pressure generated by the activation of the rotated wheel keys.

摘要翻译： 用于便携式终端的键输入装置包括能够在多个方向上旋转并执行开关功能的轮键。 所述键输入装置包括多个按键，所述多个按键具有设置在主体中并沿多个方向旋转的至少一个轮键，至少一个允许所述轮键在各个方向上旋转的旋转单元，以及设置在所述主键下方的至少一个切换单元 轮键来感测轮键的旋转方向，并且感测由旋转的轮键的启动而产生的压力。

公开(公告)号：US20110228490A1

公开(公告)日：2011-09-22

申请号：US13050378

申请日：2011-03-17

申请人： Yu-Su KIM ,  Kyu-Sub Kwak ,  Young-Min LEE ,  Shi-Yun Cho ,  Jea-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

发明人： Yu-Su KIM ,  Kyu-Sub Kwak ,  Young-Min LEE ,  Shi-Yun Cho ,  Jea-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

IPC分类号： H05K1/18

CPC分类号： H05K3/323 ,  H05K1/189 ,  H05K2201/10159

摘要： A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.

摘要翻译： 提供了一种在便携式终端中使用的大容量存储模块安装装置，包括：大容量存储模块，包括多个第一接触焊盘; 以及柔性电路板，包括多个第二接触焊盘，并且在第一和第二接触焊盘以面对面的方式定位之后，通过在加热过程中形成焊盘而电连接到大容量存储器模块。 因此，大容量存储器模块可以有利地安装到便携式终端，并且可以有效地屏蔽电磁场。

公开(公告)号：US08630096B2

公开(公告)日：2014-01-14

申请号：US13050378

申请日：2011-03-17

申请人： Yu-Su Kim ,  Kyu-Sub Kwak ,  Young-Min Lee ,  Shi-Yun Cho ,  Jae-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

发明人： Yu-Su Kim ,  Kyu-Sub Kwak ,  Young-Min Lee ,  Shi-Yun Cho ,  Jae-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

IPC分类号： H05K1/00 ,  H05K3/32

CPC分类号： H05K3/323 ,  H05K1/189 ,  H05K2201/10159

摘要： A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.

摘要翻译： 提供了一种在便携式终端中使用的大容量存储模块安装装置，包括：大容量存储模块，包括多个第一接触焊盘; 以及柔性电路板，包括多个第二接触焊盘，并且在第一和第二接触焊盘以面对面的方式定位之后，通过在加热过程中形成焊盘而电连接到大容量存储器模块。 因此，大容量存储器模块可以有利地安装到便携式终端，并且可以有效地屏蔽电磁场。

公开(公告)号：US20080192449A1

公开(公告)日：2008-08-14

申请号：US12028864

申请日：2008-02-11

申请人： Dong-Churl Kim ,  Shi-Yun Cho ,  Hong-Kweun Kim ,  Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

发明人： Dong-Churl Kim ,  Shi-Yun Cho ,  Hong-Kweun Kim ,  Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

IPC分类号： H05K7/00

CPC分类号： H05K9/0022 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/10318 ,  H05K2203/1316 ,  H01L2224/0401

摘要： An electric circuit package includes: a printed circuit substrate having an insulating layer and conductive pattern layers formed on an upper surface of the insulating layer; at least one of electronic parts disposed on an upper surface of the printed circuit substrate; at least one of conductive pins electrically connected to an conductive pattern layer providing grounding among the conductive pattern layers; and a molding member formed on the insulating layer in such a manner that the conductive pins and the electric parts are buried in the molding member, wherein each conductive pin has an upper surface exposed to an upper part of the molding member.

摘要翻译： 电路封装包括：印刷电路基板，其具有绝缘层和形成在所述绝缘层的上表面上的导电图案层; 设置在印刷电路基板的上表面上的电子部件中的至少一个; 至少一个导电引脚与导电图案层电连接，在导电图案层之间提供接地; 以及模制构件，其形成在所述绝缘层上，使得所述导电销和所述电气部件被埋在所述模制构件中，其中每个导电销具有暴露于所述模制构件的上部的上表面。

公开(公告)号：US20110165734A1

公开(公告)日：2011-07-07

申请号：US12985900

申请日：2011-01-06

申请人： Seung-Woo Han ,  Jea-Hyuck Lee ,  Kyu-Sub Kwak ,  Kang-Ho Byun ,  Joon-II Kim ,  Duck-Hwan Kim ,  Kyung-Ho Park ,  Se-Mi Park

发明人： Seung-Woo Han ,  Jea-Hyuck Lee ,  Kyu-Sub Kwak ,  Kang-Ho Byun ,  Joon-II Kim ,  Duck-Hwan Kim ,  Kyung-Ho Park ,  Se-Mi Park

IPC分类号： H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor chip package includes molding a semiconductor chip and a number of passive devices after arranging on a film the semiconductor chip and the passive devices located in a vacant space around the periphery of the semiconductor chip; removing the film, forming an adhesive layer in a film-removed area, and attaching a conductive layer to the adhesive layer; etching a conductive layer to thereby form a conductive circuit pattern; and providing one or more conductive pads, which electrically connect the conductive circuit pattern to the semiconductor chip and to the passive devices.

摘要翻译： 半导体芯片封装的制造方法包括在半导体芯片和位于半导体芯片周围的空白空间中的无源器件的膜上配置半导体芯片和多个无源器件之后， 去除膜，在除膜区域中形成粘合剂层，并将导电层附着到粘合剂层上; 蚀刻导电层从而形成导电电路图案; 以及提供将导电电路图案电连接到半导体芯片和无源器件的一个或多个导电焊盘。

公开(公告)号：US20070152315A1

公开(公告)日：2007-07-05

申请号：US11521038

申请日：2006-09-14

申请人： Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

发明人： Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/45 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-die package and a method of fabrication is discloses. The multi-die package includes a package substrate, a first semiconductor die bonded directly on the package substrate and connected electrically with the package substrate, and a second semiconductor die having a groove providing a receiving space, bonded directly on the package substrate so that the first semiconductor die is covered by the groove, and connected electrically with the package substrate.

摘要翻译： 公开了一种多管芯封装及其制造方法。 多管芯封装包括封装基板，直接结合在封装基板上并与封装基板电连接的第一半导体管芯，以及具有提供容纳空间的沟槽的第二半导体管芯，其直接粘合在封装基板上， 第一半导体管芯被沟槽覆盖，并与封装基板电连接。

公开(公告)号：US20100047882A1

公开(公告)日：2010-02-25

申请号：US12516278

申请日：2007-11-27

申请人： Gyu-Nam Cho ,  Won-Seop Choi ,  Yong-Bum Seo ,  Seung-Woo Han ,  Yoo-Shin Kim ,  Moung-Ki Shin ,  Hee-Sung Park ,  Soon-Won Hong

发明人： Gyu-Nam Cho ,  Won-Seop Choi ,  Yong-Bum Seo ,  Seung-Woo Han ,  Yoo-Shin Kim ,  Moung-Ki Shin ,  Hee-Sung Park ,  Soon-Won Hong

IPC分类号： C12P13/08

CPC分类号： C12P13/08 ,  C12N1/02

摘要： Provided are a method of recovering L-threonine from the fermentation broth of an L-threonine producing microorganism, comprising: separating microbial bodies from the L-threonine containing fermentation broth obtained by culturing an L-threonine producing microorganism and filtering the separated fermentation broth to obtain a filtrate; concentrating the filtrate; and reacting the concentrated filtrate with a nonsolvent to obtain crystalline L-threonine, crystalline L-threonine recovered by the method, and a feed additive containing the crystalline L-threonine recovered by the method.

摘要翻译： 本发明提供从L-苏氨酸生成微生物的发酵液中回收L-苏氨酸的方法，其特征在于：将通过培养L-苏氨酸生成微生物而得到的含有L-苏氨酸的发酵液的微生物体分离，并将分离的发酵液过滤 得到滤液; 浓缩滤液; 并使浓缩的滤液与非溶剂反应，得到结晶L-苏氨酸，通过该方法回收的结晶L-苏氨酸和含有通过该方法回收的结晶L-苏氨酸的饲料添加剂。

公开(公告)号：US09281230B2

公开(公告)日：2016-03-08

申请号：US13122240

申请日：2009-09-28

申请人： Jae-Hyun Kim ,  Hak-Joo Lee ,  Seung-Min Hyun ,  Seung-Woo Han ,  Byung-Ik Choi

发明人： Jae-Hyun Kim ,  Hak-Joo Lee ,  Seung-Min Hyun ,  Seung-Woo Han ,  Byung-Ik Choi

IPC分类号： H01L21/683 ,  B29C43/46 ,  B29C43/48 ,  B29C47/06 ,  B32B27/00 ,  H01L23/02 ,  B29L9/00 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L21/6836 ,  B29C47/067 ,  B29C2043/463 ,  H01L24/80 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0652 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/27312 ,  H01L2224/7565 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/95145 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/1461 ,  Y10T156/1195 ,  Y10T156/1705 ,  Y10T156/1744 ,  H01L2924/00

摘要： The present invention relates to an apparatus for massive manufacturing a hierarchical structure that can hierarchically form high performance micro units one a flexible substrate. For this purpose, an apparatus for manufacturing a hierarchical structure according to the present invention is provided to layer micro units provided on a dummy substrate that is made of a hard material on a target substrate that is made of a flexible material by releasing the micro units from the dummy substrate. The apparatus includes: a transfer stage flat-transferring the dummy substrate by supporting the same and a main roller rolling the target substrate by winding the same as the transfer stage proceeds and layering the micro unit of the dummy substrate on the target substrate.

摘要翻译： 本发明涉及一种用于大规模制造分层结构的装置，其可以分层地形成柔性基板的高性能微单元。 为此，根据本发明的用于制造分级结构的装置被提供到通过释放微单元而将由柔性材料制成的目标基板上由硬质材料制成的虚拟基板上的微单元 从虚设基板。 该装置包括：通过支撑该平台来传送虚设基板的转印台和通过卷绕目标基板的主滚筒作为转印台进行卷绕而进行，并将该虚设基板的微单元分层在目标基板上。

公开(公告)号：US07246517B2

公开(公告)日：2007-07-24

申请号：US11455353

申请日：2006-06-19

申请人： Hak-Joo Lee ,  Jae-Hyun Kim ,  Chung-Seog Oh ,  Seung-Woo Han ,  Shin Hur ,  Soon-Gyu Ko ,  Byung-Ik Choi

发明人： Hak-Joo Lee ,  Jae-Hyun Kim ,  Chung-Seog Oh ,  Seung-Woo Han ,  Shin Hur ,  Soon-Gyu Ko ,  Byung-Ik Choi

IPC分类号： G01B5/28

CPC分类号： G01Q60/366 ,  G01N3/42 ,  G01N2203/0286

摘要： An atomic force microscope probe provides an indentation testing function in a direction along an axis. The probe has a tip and an arm structure holding the tip. The arm structure has one end mounted on a fixed stage, the other end coupled to the AFM tip, and a hollow frame having a shape symmetric with respect to a plane including an axis on which the two ends are positioned.

摘要翻译： 原子力显微镜探针在沿着轴的方向上提供压痕测试功能。 探针具有保持尖端的尖端和臂结构。 臂结构具有安装在固定台上的一端，另一端连接到AFM顶端，以及具有相对于包括其两端位于其上的轴线的平面对称的形状的中空框架。

公开(公告)号：US20050266951A1

公开(公告)日：2005-12-01

申请号：US11038013

申请日：2005-01-18

申请人： Seung-Woo Han

发明人： Seung-Woo Han

IPC分类号： B60K17/06 ,  B60K17/02 ,  B60K17/04 ,  B60K17/08 ,  B60K17/28 ,  B60T1/06 ,  F16D25/0638 ,  F16D55/40 ,  F16D63/00 ,  F16H3/14 ,  F16H37/00 ,  F16H37/08

CPC分类号： B60K17/046 ,  B60K17/02 ,  F16H48/08

摘要： A transmission for a vehicle. A rotation force generated in an engine is transmitted via a torque converter to an output shaft. Power of the output shaft is transmitted at a right angle at a bevel gear section that includes a bevel pinion gear and a bevel ring gear. The bevel ring gear transmits power to a clutch unit that includes forward and backward clutch sections to be connected to the bevel ring gear when a speed-change operation is implemented (for example, forward/backward gear shift operations). The clutch unit is connected to a differential gear case, which transmits power to a differential pinion gear and a drive shaft. The vehicle drivable through a reduction gear assembly that is mountable to an axle assembly.

摘要翻译： 用于车辆的变速器。 在发动机中产生的旋转力通过变矩器传递到输出轴。 输出轴的功率在包括斜齿轮小齿轮和斜齿轮的锥齿轮部分处以直角传递。 斜齿环齿轮在实施变速操作时（例如前进/后退换档操作）将动力传递到包括前进离合器部分和后退离合器部分的离合器单元，以连接到斜齿环齿轮。 离合器单元连接到差速齿轮箱，差速齿轮箱将动力传递到差动小齿轮和驱动轴。 车辆可通过可安装到车轴组件的减速齿轮组件驱动。