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    Method for automatically setting injection molding speed condition in injection molding machine
    1.
    发明授权
    Method for automatically setting injection molding speed condition in injection molding machine 失效
    注塑机自动设定注塑速度的方法

    公开(公告)号：US5595693A

    公开(公告)日：1997-01-21

    申请号：US363907

    申请日：1994-12-27

    申请人： Shigeru Fujita ,  Hiroshi Okuyama ,  Kazuhiro Tashiro ,  Shogo Ishibashi ,  Atsuhiro Suzuki ,  Motoyuki Hirata

    发明人： Shigeru Fujita ,  Hiroshi Okuyama ,  Kazuhiro Tashiro ,  Shogo Ishibashi ,  Atsuhiro Suzuki ,  Motoyuki Hirata

    IPC分类号： B29C45/50 ,  B29C45/76 ,  B29C45/77

    CPC分类号： B29C45/77 ,  B29C45/766

    摘要： A reference pressure of melted material injected to a mold cavity of a mold is set as a function of injection passing time from a start of an injecting process or a function of a distance of movement of an injection plunger, and the movement of the plunger is started at a temporarily constant injection speed. A correction value of the injection speed is obtained to eliminate a difference between a sensed pressure of the melted material injected to the mold cavity of the mold and the reference pressure in a range that the sensed pressure of the melted material exceeds the reference pressure during the injection passing time from the start of the injection process wherein the plunger is started to move or during the movement of the plunger, and the injection speed is corrected in accordance with the corrected value. The corrected value of the injection speed, and the injection passing time from the start of the injection process or the distance of the movement of the plunger, those of which corresponding to the range, are memorized in a memory unit, and are characterized to a desired injection speed pattern, and the pattern is read out from the memory unit as an injection molding speed condition.

    摘要翻译： 喷射到模具的模腔中的熔融材料的参考压力被设定为从注射过程开始或注射柱塞的移动距离的函数的注射通过时间的函数，并且柱塞的移动是 以暂时恒定的注射速度启动。 获得注射速度的校正值，以消除在模具的模腔中注入的熔融材料的感测压力与参考压力之间的差异，在所测量的熔融材料的压力超过参考压力的范围内 从注射开始开始的喷射通过时间，其中柱塞开始移动或在柱塞运动期间，并且根据校正值校正喷射速度。 喷射速度的校正值以及从喷射处理开始的喷射通过时间或与柱塞的移动距离相应的柱塞的移动距离存储在存储单元中，并且其特征在于： 期望的注射速度模式，并且作为注射成型速度条件从存储器单元读出图案。

    Barrel temperature control system for injection molding machine
    2.
    发明授权
    Barrel temperature control system for injection molding machine 失效
    桶注塑机温控系统

    公开(公告)号：US5597588A

    公开(公告)日：1997-01-28

    申请号：US413157

    申请日：1995-03-29

    申请人： Tsuginobu Totani ,  Kazuhiro Tashiro ,  Shogo Ishibashi ,  Kiyoshi Sasaki

    发明人： Tsuginobu Totani ,  Kazuhiro Tashiro ,  Shogo Ishibashi ,  Kiyoshi Sasaki

    IPC分类号： B29C45/74 ,  B29C45/78

    CPC分类号： B29C45/78

    摘要： The barrel temperature control apparatus for an injection molding machine can execute the barrel temperature control in such a way as to optimize the disturbance suppression characteristics. The temperature control section 7 comprises the manipulated variable addition and subtraction section 14 at the rear stage of the PiD control section 12 in such a way that the barrel temperature of the injection molding machine 1 can be controlled under both feedback and feed-forward. Further, when the same products are molded continuously, the barrel temperature is feed-forward controlled on the basis of the learned change manipulated variable.

    摘要翻译： 用于注射成型机的桶式温度控制装置可以以优化干扰抑制特性的方式执行机筒温度控制。 温度控制部7包括在PiD控制部12的后级的操作量可变加减部14，使得可以在反馈和前馈两者下控制注塑机1的机筒温度。 此外，当相同的产品连续模制时，基于学习的变化操作变量来控制机筒温度是前馈的。

    Tray in combination with electronic component attaching tool attached to the tray
    3.
    发明授权
    Tray in combination with electronic component attaching tool attached to the tray 失效
    托盘与附在托盘上的电子元件连接工具组合

    公开(公告)号：US08671557B2

    公开(公告)日：2014-03-18

    申请号：US13242647

    申请日：2011-09-23

    申请人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

    发明人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

    IPC分类号： B23P19/00

    CPC分类号： B25B27/14 ,  H05K7/1061 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53943

    摘要： A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.

    摘要翻译： 托盘与附接到托盘上的电子部件连接工具组合地提供，并且包括附接凹陷部分，该附件凹陷部分包括内壁并且附接有电子部件，其中，附接凹陷部分的内壁的形成基本上不 取决于电子部件的外部形状，以及形成在安装凹部的内壁中的标准部分，并与电子部件安装工具的第一结构部分接合，以将电子部件安装工具的位置对准到标准 当使用电子部件安装工具将电子部件的位置与托盘的第一位置对准时，标准部件具有基本上不依赖于电子部件的外形的形状。

    Semiconductor device packaging structure
    4.
    发明授权
    Semiconductor device packaging structure 有权
    半导体器件封装结构

    公开(公告)号：US08164181B2

    公开(公告)日：2012-04-24

    申请号：US12872131

    申请日：2010-08-31

    申请人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

    发明人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

    IPC分类号： H01L23/12

    CPC分类号： H01L21/67333 ,  H01L21/50 ,  H01L22/20 ,  H01L23/04 ,  H01L23/544 ,  H01L25/0655 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/1616 ,  H01L2924/166 ,  Y10T29/49826 ,  H01L2924/00

    摘要： A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

    摘要翻译： 公开了一种半导体器件封装结构，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。

    PROBER, TESTING APPARATUS, AND METHOD OF INSPECTING SEMICONDUCTOR CHIP
    5.
    发明申请
    PROBER, TESTING APPARATUS, AND METHOD OF INSPECTING SEMICONDUCTOR CHIP 有权
    探测器，测试装置和检查半导体芯片的方法

    公开(公告)号：US20110254574A1

    公开(公告)日：2011-10-20

    申请号：US13168719

    申请日：2011-06-24

    申请人： Kazuhiro Tashiro

    发明人： Kazuhiro Tashiro

    IPC分类号： G01R31/308 ,  G01R31/00 ,  G01N21/00 ,  G01R31/26

    CPC分类号： G01R31/2887 ,  G01R31/2891

    摘要： A prober includes a probe card provided with a support board and a probe attached to the support board, a stage on which a measurement wafer is mounted, a camera provided over the probe card to observe an electrode pad of a first semiconductor chip formed on the measurement wafer, and a stage moving unit for moving the position of the stage relative to the probe card.

    摘要翻译： 探针包括设置有支撑板的探针卡和附接到支撑板的探针，安装有测量晶片的台，设置在探针卡上方的照相机，以观察形成在第一半导体芯片上的第一半导体芯片的电极焊盘 测量晶片和用于相对于探针卡移动台的位置的台移动单元。

    Semiconductor testing device
    7.
    发明授权
    Semiconductor testing device 有权
    半导体测试装置

    公开(公告)号：US07161370B2

    公开(公告)日：2007-01-09

    申请号：US11046883

    申请日：2005-02-01

    申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

    发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

    IPC分类号： G01R31/26

    CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

    摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

    摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。

    Composition for hair treatment
    10.
    发明授权
    Composition for hair treatment 失效
    头发处理组成

    公开(公告)号：US5374421A

    公开(公告)日：1994-12-20

    申请号：US978192

    申请日：1992-11-18

    申请人： Kazuhiro Tashiro ,  Kazuyuki Yahagi

    发明人： Kazuhiro Tashiro ,  Kazuyuki Yahagi

    IPC分类号： A61K8/00 ,  A61K8/34 ,  A61K8/41 ,  A61K8/89 ,  A61K8/891 ,  A61K8/893 ,  A61K8/92 ,  A61Q5/00 ,  A61Q5/02 ,  A61Q5/12 ,  C08L83/04 ,  A61K7/09

    CPC分类号： A61K8/345 ,  A61K8/342 ,  A61K8/416 ,  A61K8/893 ,  A61Q5/02 ,  A61Q5/12

    摘要： A composition for hair treatment such as hair rinse, shampoo, or hair conditioner, contains (a) 0.1-10 wt. % of a modified silicone polymer having at least one alkoxy group in the molecule and a melting point of not lower than 30.degree. C., (b) 0.1-20 wt. % of a cationic surface active agent, (c) 0.1-30 wt. % of an oily or fatty material, (d) 0.1-90 wt. % of an organic liquid which is compatible with water and of which molecule has at least one hydroxy group, and (e) water.

    摘要翻译： 用于毛发处理的组合物如洗发剂，洗发剂或护发素包含（a）0.1-10重量％ ％的分子中具有至少一个烷氧基并且熔点不低于30℃的改性硅氧烷聚合物，（b）0.1-20重量％ ％的阳离子表面活性剂，（c）0.1-30重量％ ％的油性或脂肪材料，（d）0.1-90重量％ ％的与水相容的分子和至少一个羟基的有机液体，和（e）水。