MOLECULAR RESIST COMPOSITION AND PATTERNING PROCESS

    公开(公告)号:US20240345480A1

    公开(公告)日:2024-10-17

    申请号:US18625950

    申请日:2024-04-03

    IPC分类号: G03F7/029 G03F7/32

    CPC分类号: G03F7/029 G03F7/325

    摘要: The negative-tone molecular resist composition comprises an onium salt containing a cation having a cyclic ether site and an organic solvent has a high sensitivity and forms a resist film with improved resolution and LWR when processed by photolithography using high-energy radiation. The molecular resist composition of the invention meets both high sensitivity and high resolution and is improved in LWR when processed by photolithography using high-energy radiation, especially EB or EUV lithography. The resist composition is quite useful for precise micropatterning.

    Composition For Forming Silicon-Containing Resist Underlayer Film And Patterning Process

    公开(公告)号:US20240319598A1

    公开(公告)日:2024-09-26

    申请号:US18594575

    申请日:2024-03-04

    摘要: The present invention is a composition for forming a silicon-containing resist underlayer film, containing a condensation reaction-type thermosetting silicon-containing material (Sx), being a polysiloxane resin, where the material has a non-condensation reactive organic group that reacts with a radical chemical species, the resin includes more than 0 and 70 mol % or less of one or more of a repeating unit represented by the following general formula (Sx-4) and a repeating unit represented by the general formula (Sx-5), and the organic group remains unreacted after a heat-curing reaction of the polysiloxane resin. This provides: a composition for forming a resist underlayer film containing a thermosetting silicon-containing material in photolithography using a high-energy beam, the material improving sensitivity, LWR, and resolution of an upper layer resist and further contributing to the prevention of pattern collapse; and a patterning process using the composition for forming a resist underlayer film.