公开(公告)号：US5560534A

公开(公告)日：1996-10-01

申请号：US380579

申请日：1995-01-30

申请人： Toru Okada ,  Kenji Iketaki ,  Naoki Yamasaki

发明人： Toru Okada ,  Kenji Iketaki ,  Naoki Yamasaki

IPC分类号： B23K1/08 ,  H05K3/00 ,  H05K3/34

CPC分类号： B23K1/085 ,  H05K3/3447 ,  B23K2201/40 ,  H05K2203/0126 ,  H05K2203/0746 ,  H05K2203/111 ,  H05K3/0008 ,  H05K3/3468 ,  H05K3/3489

摘要： A soldering apparatus wherein lead pins of a part inserted from above in through-holes of a printed circuit board are soldered to the through-holes from below. The soldering apparatus comprises a solder supplying nozzle, a preliminary heating nozzle and a flux nozzle. Each of the nozzles has an opening and a pair of slits formed to extend downwardly from the opening. The nozzles are moved upwardly and downwardly in a Z direction by respective elevators and are moved and positioned in X and Y directions by a moving table. A printed circuit board to which a lead part to be soldered is temporarily fastened is disposed on the nozzles. As the moving table and the elevators are controlled so that the lead pins projecting to the rear face of the printed circuit board pass through the slits of the nozzles from sidewardly, application of flux to and preliminary heating of the lead pins are performed, and soldering of the lead pins is performed with molten solder supplied to the opening at the upper portion of the solder supplying nozzle.

摘要翻译： 焊接装置，其中从上方插入印刷电路板的通孔的部分的引脚从下方被焊接到通孔。 焊接装置包括焊料供给喷嘴，预热加热喷嘴和焊剂喷嘴。 每个喷嘴具有开口和形成为从开口向下延伸的一对狭缝。 喷嘴通过相应的电梯在Z方向上下移动，并通过移动台在X和Y方向上移动和定位。 将要焊接的引线部分暂时固定的印刷电路板设置在喷嘴上。 由于移动台和电梯被控制，使得突出到印刷电路板的背面的引线销从侧面穿过喷嘴的狭缝，进行焊剂的施加和引脚的预加热，并且焊接 引导引脚的供电通过供给到焊料供给喷嘴的上部的开口处的熔融焊料进行。

公开(公告)号：US06541898B2

公开(公告)日：2003-04-01

申请号：US09822636

申请日：2001-03-30

申请人： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

发明人： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

IPC分类号： H01L41047

CPC分类号： H01L41/29 ,  G11B5/5552 ,  G11B5/5556 ,  H01L41/0993 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01327 ,  Y10T29/42 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

公开(公告)号：US06744183B2

公开(公告)日：2004-06-01

申请号：US10347708

申请日：2003-01-21

申请人： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

发明人： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

IPC分类号： H01L41047

CPC分类号： H01L41/29 ,  G11B5/5552 ,  G11B5/5556 ,  H01L41/0993 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01327 ,  Y10T29/42 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

摘要翻译： 一种键合压电元件和电极的方法，包括以下步骤：在压电元件的接合表面上形成选自Au，Al，Zn，Cu和Sn的材料的第一涂层，并形成 在电极的接合表面上第二次涂覆选自Au，Al，Zn，Cu和Sn的材料。 第一和第二涂层的材料的组合优选为Au / Au，Au / Al，Zn / Cu或Sn / Cu。 该方法还包括使第一和第二涂层彼此紧密接触并在压力下加热它们以在第一和第二涂层之间形成金属键或金属间化合物，从而结合压电元件和电极的步骤。

公开(公告)号：US06467141B2

公开(公告)日：2002-10-22

申请号：US09820553

申请日：2001-03-29

申请人： Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

发明人： Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

IPC分类号： H04R1710

CPC分类号： G11B5/5552 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49025 ,  Y10T29/49055

摘要： A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.

摘要翻译： 提供了一种组装微致动器的方法，其中具有多个致动器基座的基架被放置在台架上，第一粘合剂被施加到每个致动器基座，以及具有多个基极的基极框架 被放置在第一粘合剂上。 第一粘合剂通过加热和压制半固化。 将第二粘合剂施加到每个基底电极上，并且将多个压电元件放置在第二粘合剂上。 第二粘合剂通过加热和压制半固化。 将第三粘合剂施加到压电元件，并且具有多个可移动电极的可动电极框架放置在第三粘合剂上。 第三粘合剂通过加热和压制半固化。 接下来，将第四粘合剂施加到每个可移动电极，并且具有多个铰链板的铰链板框架放置在第四粘合剂上。 第四粘合剂通过加热和加压半固化。 最后，将如此获得的粘合层压材料放置在加热炉中，并在预定温度下加热预定的时间，从而使各种粘合剂完全固化。

公开(公告)号：US09360396B2

公开(公告)日：2016-06-07

申请号：US14349989

申请日：2012-06-22

申请人： Toru Okada ,  Masao Murakami ,  Yoshiaki Matsubara ,  Shinichirou Ikai

发明人： Toru Okada ,  Masao Murakami ,  Yoshiaki Matsubara ,  Shinichirou Ikai

IPC分类号： G01M17/02

CPC分类号： G01M17/022 ,  G01M17/02

摘要： In a tire uniformity measurement, accurate tire uniformity is obtained from a measurement waveform immediately after a rotation of a tire is switched from a normal rotation direction to a reverse rotation direction. A tire uniformity testing device of the present invention includes a measurement unit 108 that obtains a force variation from a uniformity waveform corrected by a correction unit 109 that corrects the uniformity waveform so as to eliminate a shift gradient α existing in the uniformity waveform measured after a rotation of a tire T1 is reversed, and further includes an air-outflow regulation member 220 that regulates an from flowing into a tire T2 when a drum 205 retreats or advances.

摘要翻译： 在轮胎均匀性测量中，从将轮胎的旋转从正常旋转方向切换到反向旋转方向之后的测量波形获得准确的轮胎均匀性。 本发明的轮胎均匀性测试装置包括测量单元108，其从由校正单元109校正的均匀性波形获得力变化，校正均匀性波形，以消除存在于a 轮胎T1的旋转被反转，并且还包括空气流出调节构件220，其在滚筒205退回或前进时调节流入轮胎T2。

公开(公告)号：US09089086B2

公开(公告)日：2015-07-21

申请号：US13225902

申请日：2011-09-06

申请人： Tohru Harada ,  Mitsuo Takeuchi ,  Hirokazu Yamanishi ,  Yoshiaki Yanagida ,  Toru Okada

发明人： Tohru Harada ,  Mitsuo Takeuchi ,  Hirokazu Yamanishi ,  Yoshiaki Yanagida ,  Toru Okada

IPC分类号： B23P19/00 ,  H05K13/04 ,  H01L23/00

CPC分类号： H05K13/0486 ,  H01L24/75 ,  H01L24/81 ,  Y10T29/49004 ,  Y10T29/53022

摘要： An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

摘要翻译： 一种用于安装电子部件的装置包括：相对于放置在印刷电路板上的电子部件移动的加热头，根据电子部件的倾斜倾斜与电子部件接触，并加热连接到电子部件的接合材料 印刷电路板和电子元器件; 测量加热头的位置和倾斜度的第一传感器; 测量印刷板的位置和倾斜度的第二传感器; 以及控制单元，其基于在所述加热头与所述电子部件接触的状态下的所述第一传感器的测量结果来计算所述电子部件的位置和倾斜度，并且基于所述接合材料的熔融状态来确定 关于第二传感器的测量结果以及电子部件的位置和倾斜度。

公开(公告)号：US20120327235A1

公开(公告)日：2012-12-27

申请号：US13530173

申请日：2012-06-22

申请人： Masaaki Wada ,  Toru Okada ,  Kazunori Chida ,  Hiroki Ishida

发明人： Masaaki Wada ,  Toru Okada ,  Kazunori Chida ,  Hiroki Ishida

IPC分类号： H04N7/18

CPC分类号： H04N7/183

摘要： Video from a backup camera (10) is displayed early on an LCD panel (16). During startup of a system, a display controller (14) performs settings according to preset data from a memory (20), a video signal directly supplied from the backup camera (10) is selected by a selector (54), subjected to resolution conversion and supplied to an LCD panel (16). On the other hand, after the system controller (12) has been started up, a video signal supplied from the system controller (12) is selected by the selector (54) and supplied to the LCD panel (16).

摘要翻译： 来自备用摄像机（10）的视频早期显示在LCD面板（16）上。 在系统启动期间，显示控制器（14）根据来自存储器（20）的预设数据执行设置，从备用摄像机（10）直接提供的视频信号由选择器（54）选择，进行分辨率转换 并提供给LCD面板（16）。 另一方面，在系统控制器（12）启动之后，由系统控制器（12）提供的视频信号由选择器（54）选择并提供给LCD面板（16）。

公开(公告)号：US20120090195A1

公开(公告)日：2012-04-19

申请号：US13232655

申请日：2011-09-14

申请人： Mitsuo TAKEUCHI ,  Tohru Harada ,  Toru Okada

发明人： Mitsuo TAKEUCHI ,  Tohru Harada ,  Toru Okada

IPC分类号： F26B3/02 ,  F26B25/08

CPC分类号： H05K13/0486 ,  H05K3/225 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/176

摘要： An apparatus for heating an electronic component, the apparatus includes a table on which a printed board is placed, a heating head having a contact surface that comes into contact with the upper surface of a rectangular electronic component mounted on the upper surface of the printed board, a discharge portion that jets heated air; and a first passage that guides the air discharged from the discharge portion to the four vertexes of the electronic component.

摘要翻译： 一种用于加热电子部件的装置，该装置包括一个放置有印刷电路板的工作台，具有与安装在印刷电路板的上表面上的矩形电子部件的上表面接触的接触面的加热头 ，喷射热空气的排出部分; 以及将从排出部排出的空气引导到电子部件的四个顶点的第一通路。

公开(公告)号：US20100097080A1

公开(公告)日：2010-04-22

申请号：US12487885

申请日：2009-06-19

申请人： Hiroshi Kobayashi ,  Toru Okada ,  Yasutoshi Furukawa

发明人： Hiroshi Kobayashi ,  Toru Okada ,  Yasutoshi Furukawa

IPC分类号： G01R27/00 ,  B32B37/00

CPC分类号： H03K17/962 ,  G06K9/00053 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A contact sensor unit includes: a flexible substrate having a conductive pattern; a sensor element having a detecting surface for detecting a fingerprint of a test subject, the sensor element having a terminal electrically connected to the conductive pattern, and the sensor element mounted on the flexible substrate to be covered with the flexible substrate; and a reinforcing member fixed on the flexible substrate and surrounding the sensor element.

摘要翻译： 接触传感器单元包括：具有导电图案的柔性基板; 传感器元件，具有用于检测测试对象的指纹的检测表面，所述传感器元件具有电连接到所述导电图案的端子，以及所述传感器元件安装在所述柔性基板上以被所述柔性基板覆盖; 以及固定在柔性基板上并围绕传感器元件的加强构件。

公开(公告)号：US20080101746A1

公开(公告)日：2008-05-01

申请号：US11553743

申请日：2006-10-27

申请人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

发明人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

IPC分类号： G02B6/12

CPC分类号： G03B17/00 ,  H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10121 ,  H05K2201/10727 ,  H05K2203/0182 ,  Y02P70/613

摘要： An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.

摘要翻译： 光学模块具有具有设置有端子焊盘和着陆焊盘的基板表面的基板，以及具有端子的光学元件封装，并且安装在基板表面上，其间形成有间隙。 当光学元件封装安装在基板表面上时，光学元件封装和基板表面之间的间隙由着陆焊盘确定。 端子焊盘和着陆焊盘在光学元件封装安装在基板表面上的状态下露出，并且端子焊盘通过焊料电连接到相应的端子。