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1.发明授权Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure 有权使用非金属基底结构制造具有低成本引线框架的半导体部件的方法公开(公告)号：US07939380B2
公开(公告)日：2011-05-10
申请号：US12049909
申请日：2008-03-17
申请人： Shutesh Krishnan , Soon Wei Wang , Jatinder Kumar
发明人： Shutesh Krishnan , Soon Wei Wang , Jatinder Kumar
IPC分类号： H01L21/60 , H01L21/56 , H01L23/495
CPC分类号： H01L23/49582 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/49541 , H01L24/28 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2221/68345 , H01L2224/05554 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4911 , H01L2224/49171 , H01L2224/73265 , H01L2224/83001 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/83856 , H01L2224/8388 , H01L2224/85001 , H01L2224/85439 , H01L2224/85455 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10162 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/18301 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2224/85 , H01L2924/07025 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A method for manufacturing a semiconductor component that includes a leadframe having a non-metallic base structure and an intermediate leadframe structure. The non-metallic base structure may be, among other things, paper, cellulose, or plastic. A layer of electrically conductive material is formed over the non-metallic base structure. A circuit element attach structure and a plurality of leadframe leads are formed from the layer of electrically conductive material. A circuit element is coupled to the circuit element attach structure and electrically coupled to the plurality of leadframe leads. The circuit element is encapsulated and at least the non-metallic base structure is removed. Alternatively, a plurality of leadframe leads may be formed on the electrically conductive layer and a circuit element is placed over the electrically conductive layer. The circuit element is electrically coupled to the plurality of leadframe leads and encapsulated. The non-metallic base structure and the electrically conductive layer are removed.
摘要翻译： 一种半导体元件的制造方法，其包括具有非金属基底结构的引线框架和中间引线框架结构。 非金属基底结构可以是纸，纤维素或塑料等。 在非金属基底结构上形成一层导电材料。 电路元件连接结构和多个引线框引线由导电材料层形成。 电路元件耦合到电路元件连接结构并电耦合到多个引线框引线。 电路元件被封装，并且至少去除非金属基底结构。 或者，可以在导电层上形成多个引线框引线，并且将电路元件放置在导电层上。 电路元件电耦合到多个引线框引线并被封装。 去除非金属基底结构和导电层。
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公开(公告)号：US20120064781A1
公开(公告)日：2012-03-15
申请号：US12948977
申请日：2010-11-18
申请人： Shutesh Krishnan , Soon Wei Wang
发明人： Shutesh Krishnan , Soon Wei Wang
CPC分类号： H05K7/00 , H01L23/3121 , H01L23/3677 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/074 , H01L2224/05554 , H01L2224/291 , H01L2224/32225 , H01L2224/32235 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37624 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/4007 , H01L2224/40095 , H01L2224/40106 , H01L2224/40225 , H01L2224/40227 , H01L2224/4103 , H01L2224/41052 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/83851 , H01L2224/85423 , H01L2224/85447 , H01L2924/00014 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/84
摘要： A connector assembly and a method for manufacturing the connector assembly. In accordance with embodiments, the connector assembly includes an electrical connector having first and second surfaces and first and second ends. A layer of electrically insulating material is formed from or on a portion of the first surface at the first end. Optionally, a layer of electrically insulating material can be formed from or on the second surface.
摘要翻译： 连接器组件和用于制造连接器组件的方法。 根据实施例，连接器组件包括具有第一和第二表面以及第一和第二端的电连接器。 电绝缘材料层由第一端部的第一表面的一部分上形成，或者在第一端的一部分上形成。 任选地，电绝缘材料层可以从第二表面上或在第二表面上形成。
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公开(公告)号：US20120063107A1
公开(公告)日：2012-03-15
申请号：US12948970
申请日：2010-11-18
申请人： Shutesh Krishnan , Soon Wei Wang
发明人： Shutesh Krishnan , Soon Wei Wang
CPC分类号： H05K7/00 , H01L23/3121 , H01L23/3677 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/074 , H01L2224/05554 , H01L2224/291 , H01L2224/32225 , H01L2224/32235 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37624 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/4007 , H01L2224/40095 , H01L2224/40106 , H01L2224/40225 , H01L2224/40227 , H01L2224/4103 , H01L2224/41052 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/83851 , H01L2224/85423 , H01L2224/85447 , H01L2924/00014 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/84
摘要： A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes stacked semiconductor die. In accordance with embodiments, the semiconductor component includes a substrate having a component receiving area and a plurality of bond pads. A semiconductor chip is attached to the component receiving area. An electrical connector is coupled to the semiconductor chip and the substrate. A second semiconductor chip is mounted or attached to one of the ends of the electrical connector such that this end is positioned between the semiconductor chips. A second electrical connector is coupled between the second semiconductor chip and the substrate. A third semiconductor chip is mounted over or attached to the second electrical connector such that a portion is between the second and third semiconductor chips.
摘要翻译： 半导体部件及半导体部件的制造方法，其特征在于，所述半导体部件具有堆叠的半导体管芯。 根据实施例，半导体部件包括具有部件接收区域和多个接合焊盘的基板。 半导体芯片附接到部件接收区域。 电连接器耦合到半导体芯片和基板。 第二个半导体芯片被安装或连接到电连接器的一个端部，使得该端部位于半导体芯片之间。 第二电连接器耦合在第二半导体芯片和基板之间。 第三半导体芯片安装在第二电连接器上或附着到第二电连接器，使得一部分在第二和第三半导体芯片之间。
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公开(公告)号：US08451621B2
公开(公告)日：2013-05-28
申请号：US12948970
申请日：2010-11-18
申请人： Shutesh Krishnan , Soon Wei Wang
发明人： Shutesh Krishnan , Soon Wei Wang
IPC分类号： H05K7/00
CPC分类号： H05K7/00 , H01L23/3121 , H01L23/3677 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/074 , H01L2224/05554 , H01L2224/291 , H01L2224/32225 , H01L2224/32235 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37624 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/4007 , H01L2224/40095 , H01L2224/40106 , H01L2224/40225 , H01L2224/40227 , H01L2224/4103 , H01L2224/41052 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/83851 , H01L2224/85423 , H01L2224/85447 , H01L2924/00014 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/84
摘要： A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes stacked semiconductor die. In accordance with embodiments, the semiconductor component includes a substrate having a component receiving area and a plurality of bond pads. A semiconductor chip is attached to the component receiving area. An electrical connector is coupled to the semiconductor chip and the substrate. A second semiconductor chip is mounted or attached to one of the ends of the electrical connector such that this end is positioned between the semiconductor chips. A second electrical connector is coupled between the second semiconductor chip and the substrate. A third semiconductor chip is mounted over or attached to the second electrical connector such that a portion is between the second and third semiconductor chips.
摘要翻译： 半导体部件及半导体部件的制造方法，其特征在于，所述半导体部件具有堆叠的半导体管芯。 根据实施例，半导体部件包括具有部件接收区域和多个接合焊盘的基板。 半导体芯片附接到部件接收区域。 电连接器耦合到半导体芯片和基板。 第二个半导体芯片被安装或连接到电连接器的一个端部，使得该端部位于半导体芯片之间。 第二电连接器耦合在第二半导体芯片和基板之间。 第三半导体芯片安装在第二电连接器上或附着到第二电连接器，使得一部分在第二和第三半导体芯片之间。
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公开(公告)号：US20090102028A1
公开(公告)日：2009-04-23
申请号：US12049909
申请日：2008-03-17
申请人： Shutesh Krishnan , Soon Wei Wang , Jatinder Kumar
发明人： Shutesh Krishnan , Soon Wei Wang , Jatinder Kumar
IPC分类号： H01L21/60 , H01L21/56 , H01L23/495
CPC分类号： H01L23/49582 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/49541 , H01L24/28 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2221/68345 , H01L2224/05554 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4911 , H01L2224/49171 , H01L2224/73265 , H01L2224/83001 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/83856 , H01L2224/8388 , H01L2224/85001 , H01L2224/85439 , H01L2224/85455 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10162 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/18301 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2224/85 , H01L2924/07025 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A method for manufacturing a semiconductor component that includes a leadframe having a non-metallic base structure and an intermediate leadframe structure. The non-metallic base structure may be, among other things, paper, cellulose, or plastic. A layer of electrically conductive material is formed over the non-metallic base structure. A circuit element attach structure and a plurality of leadframe leads are formed from the layer of electrically conductive material. A circuit element is coupled to the circuit element attach structure and electrically coupled to the plurality of leadframe leads. The circuit element is encapsulated and at least the non-metallic base structure is removed. Alternatively, a plurality of leadframe leads may be formed on the electrically conductive layer and a circuit element is placed over the electrically conductive layer. The circuit element is electrically coupled to the plurality of leadframe leads and encapsulated. The non-metallic base structure and the electrically conductive layer are removed.
摘要翻译： 一种半导体元件的制造方法，其包括具有非金属基底结构的引线框架和中间引线框架结构。 非金属基底结构可以是纸，纤维素或塑料等。 在非金属基底结构上形成一层导电材料。 电路元件连接结构和多个引线框引线由导电材料层形成。 电路元件耦合到电路元件连接结构并电耦合到多个引线框引线。 电路元件被封装，并且至少去除非金属基底结构。 或者，可以在导电层上形成多个引线框引线，并且将电路元件放置在导电层上。 电路元件电耦合到多个引线框引线并被封装。 去除非金属基底结构和导电层。
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公开(公告)号：US08449339B2
公开(公告)日：2013-05-28
申请号：US12948977
申请日：2010-11-18
申请人： Shutesh Krishnan , Soon Wei Wang
发明人： Shutesh Krishnan , Soon Wei Wang
IPC分类号： H01R9/24
CPC分类号： H05K7/00 , H01L23/3121 , H01L23/3677 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/074 , H01L2224/05554 , H01L2224/291 , H01L2224/32225 , H01L2224/32235 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37624 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/4007 , H01L2224/40095 , H01L2224/40106 , H01L2224/40225 , H01L2224/40227 , H01L2224/4103 , H01L2224/41052 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/83851 , H01L2224/85423 , H01L2224/85447 , H01L2924/00014 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/84
摘要： A connector assembly and a method for manufacturing the connector assembly. In accordance with embodiments, the connector assembly includes an electrical connector having first and second surfaces and first and second ends. A layer of electrically insulating material is formed from or on a portion of the first surface at the first end. Optionally, a layer of electrically insulating material can be formed from or on the second surface.
摘要翻译： 连接器组件和用于制造连接器组件的方法。 根据实施例，连接器组件包括具有第一和第二表面以及第一和第二端的电连接器。 电绝缘材料层由第一端部的第一表面的一部分上形成，或者在第一端的一部分上形成。 可选地，电绝缘材料层可以从第二表面上或在第二表面上形成。
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