公开(公告)号：US07939380B2

公开(公告)日：2011-05-10

申请号：US12049909

申请日：2008-03-17

申请人： Shutesh Krishnan ,  Soon Wei Wang ,  Jatinder Kumar

发明人： Shutesh Krishnan ,  Soon Wei Wang ,  Jatinder Kumar

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L23/49582 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/8388 ,  H01L2224/85001 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/07025 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for manufacturing a semiconductor component that includes a leadframe having a non-metallic base structure and an intermediate leadframe structure. The non-metallic base structure may be, among other things, paper, cellulose, or plastic. A layer of electrically conductive material is formed over the non-metallic base structure. A circuit element attach structure and a plurality of leadframe leads are formed from the layer of electrically conductive material. A circuit element is coupled to the circuit element attach structure and electrically coupled to the plurality of leadframe leads. The circuit element is encapsulated and at least the non-metallic base structure is removed. Alternatively, a plurality of leadframe leads may be formed on the electrically conductive layer and a circuit element is placed over the electrically conductive layer. The circuit element is electrically coupled to the plurality of leadframe leads and encapsulated. The non-metallic base structure and the electrically conductive layer are removed.

摘要翻译： 一种半导体元件的制造方法，其包括具有非金属基底结构的引线框架和中间引线框架结构。 非金属基底结构可以是纸，纤维素或塑料等。 在非金属基底结构上形成一层导电材料。 电路元件连接结构和多个引线框引线由导电材料层形成。 电路元件耦合到电路元件连接结构并电耦合到多个引线框引线。 电路元件被封装，并且至少去除非金属基底结构。 或者，可以在导电层上形成多个引线框引线，并且将电路元件放置在导电层上。 电路元件电耦合到多个引线框引线并被封装。 去除非金属基底结构和导电层。

公开(公告)号：US08449339B2

公开(公告)日：2013-05-28

申请号：US12948977

申请日：2010-11-18

申请人： Shutesh Krishnan ,  Soon Wei Wang

发明人： Shutesh Krishnan ,  Soon Wei Wang

IPC分类号： H01R9/24

CPC分类号： H05K7/00 ,  H01L23/3121 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/074 ,  H01L2224/05554 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32235 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/37624 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/37647 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/4103 ,  H01L2224/41052 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49112 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85423 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T29/49117 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/84

摘要： A connector assembly and a method for manufacturing the connector assembly. In accordance with embodiments, the connector assembly includes an electrical connector having first and second surfaces and first and second ends. A layer of electrically insulating material is formed from or on a portion of the first surface at the first end. Optionally, a layer of electrically insulating material can be formed from or on the second surface.

摘要翻译： 连接器组件和用于制造连接器组件的方法。 根据实施例，连接器组件包括具有第一和第二表面以及第一和第二端的电连接器。 电绝缘材料层由第一端部的第一表面的一部分上形成，或者在第一端的一部分上形成。 可选地，电绝缘材料层可以从第二表面上或在第二表面上形成。

公开(公告)号：US07402895B2

公开(公告)日：2008-07-22

申请号：US11403978

申请日：2006-04-14

申请人： Shutesh Krishnan ,  Jatinder Kumar

发明人： Shutesh Krishnan ,  Jatinder Kumar

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： In one embodiment, a semiconductor package includes a conductive slug and columnar leads in spaced relationship thereto. The columnar leads are coupled to an electronic device attached to the slug, and are exposed at least on one side of the package opposite the die attach slug. The die attach slug is further exposed to provide a package configured in a slug up orientation.

摘要翻译： 在一个实施例中，半导体封装包括与其间隔开的导电块和柱形引线。 柱状引线耦合到附接到芯块的电子器件，并且至少在封装的与管芯附接块相对的一侧上暴露。 芯片附接芯片被进一步暴露以提供以小插头方向配置的封装。

公开(公告)号：US08519521B2

公开(公告)日：2013-08-27

申请号：US13589337

申请日：2012-08-20

申请人： Shutesh Krishnan ,  Chee Hiong Chew ,  Jatinder Kumar

发明人： Shutesh Krishnan ,  Chee Hiong Chew ,  Jatinder Kumar

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device can include a packaging material having a first surface and a second surface opposite the first surface, and leads including die connection surfaces and external connection surfaces. The electronic device can further include a trench extending from an upper surface of the packaging substrate towards a lower surface of the packaging substrate, wherein a set of leads lie immediately adjacent to the trench, and the packaging material is exposed at the bottom of the trench. In an embodiment, an encapsulant is formed over the upper surface of the packaging substrate and within the trench. In a particular embodiment, the trenches may be formed before or after placing a die over the packaging substrate, or before or after forming electrical connections between the die and leads of the packaging substrate.

摘要翻译： 电子设备可以包括具有第一表面和与第一表面相对的第二表面的包装材料，并且包括裸片连接表面和外部连接表面的引线。 电子设备还可以包括从包装衬底的上表面朝向包装衬底的下表面延伸的沟槽，其中一组引线紧邻沟槽，并且包装材料暴露在沟槽的底部 。 在一个实施例中，密封剂形成在包装衬底的上表面之上并且在沟槽内。 在特定实施例中，沟槽可以在将芯片放置在封装衬底上之前或之后形成，或者在形成封装衬底的管芯和引线之间的电连接之前或之后形成沟槽。

公开(公告)号：US08451621B2

公开(公告)日：2013-05-28

申请号：US12948970

申请日：2010-11-18

申请人： Shutesh Krishnan ,  Soon Wei Wang

发明人： Shutesh Krishnan ,  Soon Wei Wang

IPC分类号： H05K7/00

CPC分类号： H05K7/00 ,  H01L23/3121 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/074 ,  H01L2224/05554 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32235 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/37624 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/37647 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/4103 ,  H01L2224/41052 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49112 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85423 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T29/49117 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/84

摘要： A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes stacked semiconductor die. In accordance with embodiments, the semiconductor component includes a substrate having a component receiving area and a plurality of bond pads. A semiconductor chip is attached to the component receiving area. An electrical connector is coupled to the semiconductor chip and the substrate. A second semiconductor chip is mounted or attached to one of the ends of the electrical connector such that this end is positioned between the semiconductor chips. A second electrical connector is coupled between the second semiconductor chip and the substrate. A third semiconductor chip is mounted over or attached to the second electrical connector such that a portion is between the second and third semiconductor chips.

摘要翻译： 半导体部件及半导体部件的制造方法，其特征在于，所述半导体部件具有堆叠的半导体管芯。 根据实施例，半导体部件包括具有部件接收区域和多个接合焊盘的基板。 半导体芯片附接到部件接收区域。 电连接器耦合到半导体芯片和基板。 第二个半导体芯片被安装或连接到电连接器的一个端部，使得该端部位于半导体芯片之间。 第二电连接器耦合在第二半导体芯片和基板之间。 第三半导体芯片安装在第二电连接器上或附着到第二电连接器，使得一部分在第二和第三半导体芯片之间。

公开(公告)号：US20090102028A1

公开(公告)日：2009-04-23

申请号：US12049909

申请日：2008-03-17

申请人： Shutesh Krishnan ,  Soon Wei Wang ,  Jatinder Kumar

发明人： Shutesh Krishnan ,  Soon Wei Wang ,  Jatinder Kumar

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L23/49582 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/8388 ,  H01L2224/85001 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/07025 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for manufacturing a semiconductor component that includes a leadframe having a non-metallic base structure and an intermediate leadframe structure. The non-metallic base structure may be, among other things, paper, cellulose, or plastic. A layer of electrically conductive material is formed over the non-metallic base structure. A circuit element attach structure and a plurality of leadframe leads are formed from the layer of electrically conductive material. A circuit element is coupled to the circuit element attach structure and electrically coupled to the plurality of leadframe leads. The circuit element is encapsulated and at least the non-metallic base structure is removed. Alternatively, a plurality of leadframe leads may be formed on the electrically conductive layer and a circuit element is placed over the electrically conductive layer. The circuit element is electrically coupled to the plurality of leadframe leads and encapsulated. The non-metallic base structure and the electrically conductive layer are removed.

摘要翻译： 一种半导体元件的制造方法，其包括具有非金属基底结构的引线框架和中间引线框架结构。 非金属基底结构可以是纸，纤维素或塑料等。 在非金属基底结构上形成一层导电材料。 电路元件连接结构和多个引线框引线由导电材料层形成。 电路元件耦合到电路元件连接结构并电耦合到多个引线框引线。 电路元件被封装，并且至少去除非金属基底结构。 或者，可以在导电层上形成多个引线框引线，并且将电路元件放置在导电层上。 电路元件电耦合到多个引线框引线并被封装。 去除非金属基底结构和导电层。

公开(公告)号：US08268676B2

公开(公告)日：2012-09-18

申请号：US12697002

申请日：2010-01-29

申请人： Shutesh Krishnan ,  Chee Hiong Chew ,  Jatinder Kumar

发明人： Shutesh Krishnan ,  Chee Hiong Chew ,  Jatinder Kumar

IPC分类号： H01L21/60

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device can include a packaging material having a first surface and a second surface opposite the first surface, and leads including die connection surfaces and external connection surfaces. The electronic device can further include a trench extending from an upper surface of the packaging substrate towards a lower surface of the packaging substrate, wherein a set of leads lie immediately adjacent to the trench, and the packaging material is exposed at the bottom of the trench. In an embodiment, an encapsulant is formed over the upper surface of the packaging substrate and within the trench. In a particular embodiment, the trenches may be formed before or after placing a die over the packaging substrate, or before or after forming electrical connections between the die and leads of the packaging substrate.

摘要翻译： 电子设备可以包括具有第一表面和与第一表面相对的第二表面的包装材料，并且包括裸片连接表面和外部连接表面的引线。 电子设备还可以包括从包装衬底的上表面朝向包装衬底的下表面延伸的沟槽，其中一组引线紧邻沟槽，并且包装材料暴露在沟槽的底部 。 在一个实施例中，密封剂形成在包装衬底的上表面之上并且在沟槽内。 在特定实施例中，沟槽可以在将芯片放置在封装衬底上之前或之后形成，或者在形成封装衬底的管芯和引线之间的电连接之前或之后形成沟槽。

公开(公告)号：US20120018864A1

公开(公告)日：2012-01-26

申请号：US12901684

申请日：2010-10-11

申请人： Shutesh Krishnan ,  Yun Sung Won

发明人： Shutesh Krishnan ,  Yun Sung Won

IPC分类号： H01L23/495 ,  B32B37/14 ,  H05K1/11 ,  B29C43/00 ,  B29C67/00 ,  B82Y30/00 ,  B82Y40/00

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L23/49524 ,  H01L24/29 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/27318 ,  H01L2224/27334 ,  H01L2224/29 ,  H01L2224/29006 ,  H01L2224/29101 ,  H01L2224/29199 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83048 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2224/8384 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/37099

摘要： A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a substrate and a workpiece is placed on the nanoparticle preform.

摘要翻译： 接合结构和用于接合部件的方法，其中所述接合结构包括纳米颗粒预制件。 根据实施例，将纳米颗粒预制件放置在基底上，并将工件放置在纳米颗粒预制件上。

公开(公告)号：US20070138610A1

公开(公告)日：2007-06-21

申请号：US11403978

申请日：2006-04-14

申请人： Shutesh Krishnan ,  Jatinder Kumar

发明人： Shutesh Krishnan ,  Jatinder Kumar

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： In one embodiment, a semiconductor package includes a conductive slug and columnar leads in spaced relationship thereto. The columnar leads are coupled to an electronic device attached to the slug, and are exposed at least on one side of the package opposite the die attach slug. The die attach slug is further exposed to provide a package configured in a slug up orientation.

摘要翻译： 在一个实施例中，半导体封装包括与其间隔开的导电块和柱形引线。 柱状引线耦合到附接到芯块的电子器件，并且至少在封装的与管芯附接块相对的一侧上暴露。 芯片附接芯片被进一步暴露以提供以小插头方向配置的封装。

公开(公告)号：US20120306066A1

公开(公告)日：2012-12-06

申请号：US13589337

申请日：2012-08-20

申请人： Shutesh Krishnan ,  Chee Hiong Chew ,  Jatinder Kumar

发明人： Shutesh Krishnan ,  Chee Hiong Chew ,  Jatinder Kumar

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device can include a packaging material having a first surface and a second surface opposite the first surface, and leads including die connection surfaces and external connection surfaces. The electronic device can further include a trench extending from an upper surface of the packaging substrate towards a lower surface of the packaging substrate, wherein a set of leads lie immediately adjacent to the trench, and the packaging material is exposed at the bottom of the trench. In an embodiment, an encapsulant is formed over the upper surface of the packaging substrate and within the trench. In a particular embodiment, the trenches may be formed before or after placing a die over the packaging substrate, or before or after forming electrical connections between the die and leads of the packaging substrate.

摘要翻译： 电子设备可以包括具有第一表面和与第一表面相对的第二表面的包装材料，并且包括裸片连接表面和外部连接表面的引线。 电子设备还可以包括从包装衬底的上表面朝向包装衬底的下表面延伸的沟槽，其中一组引线紧邻沟槽，并且包装材料暴露在沟槽的底部 。 在一个实施例中，密封剂形成在包装衬底的上表面之上并且在沟槽内。 在特定实施例中，沟槽可以在将芯片放置在封装衬底上之前或之后形成，或者在形成封装衬底的管芯和引线之间的电连接之前或之后形成沟槽。