公开(公告)号：US06424040B1

公开(公告)日：2002-07-23

申请号：US09244586

申请日：1999-02-04

申请人： Somnath S. Nag ,  Changming Jin ,  Wei-Yung Hsu ,  Guoqiang Xing

发明人： Somnath S. Nag ,  Changming Jin ,  Wei-Yung Hsu ,  Guoqiang Xing

IPC分类号： H01L2348

CPC分类号： H01L23/3192 ,  H01L2924/0002 ,  H01L2924/00

摘要： Deposition of titanium over fluoride-containing dielectrics requires the use of a method of passivation to prevent the formation of TiF4, which causes delamination of the metallization structure. Disclosed methods include the formation of layers of Al203, TiN, or Si3N4.

摘要翻译： 在含氟化物的电介质上沉积钛需要使用钝化方法来防止形成TiF 4，这导致金属化结构的分层。 公开的方法包括形成Al 2 O 3，TiN或Si 3 N 4的层。

公开(公告)号：US06573167B2

公开(公告)日：2003-06-03

申请号：US09921119

申请日：2001-08-02

申请人： Guoqiang Xing ,  Wei-Yung Hsu ,  Changming Jin

发明人： Guoqiang Xing ,  Wei-Yung Hsu ,  Changming Jin

IPC分类号： H01L2122

CPC分类号： H01L21/0332 ,  H01L21/31116 ,  H01L21/3146 ,  H01L21/32139 ,  H01L27/1085 ,  H01L27/11502 ,  H01L27/11507 ,  H01L28/65

摘要： A carbon hardmask (122) for etching hard-to-etch materials (110/112/114) such as Pt, Ir, Ru, IrO2, RuO2, BST, PZT, SBT, FeNi, and FeNiCo and other used in DRAMs, FeRAMs, and magnetic storage devices. Chemically assisted physical sputter etching using argon and limited or no oxygen may be used to etch the hard-to-etch materials (110/112/114) with high selectivity to the carbon hardmask (122).

公开(公告)号：US06194313B1

公开(公告)日：2001-02-27

申请号：US09060971

申请日：1998-04-15

申请人： Abha R. Singh ,  Girish Anant Dixit ,  Wei-Yung Hsu ,  Guoqiang Xing

发明人： Abha R. Singh ,  Girish Anant Dixit ,  Wei-Yung Hsu ,  Guoqiang Xing

IPC分类号： H01L2144

CPC分类号： H01L21/76819 ,  H01L21/7684 ,  H01L21/76895

摘要： A method to reduce the effective recess in conductive plugs 220 by performing an oxide etch or oxide CMP, selective to the conductive material in question. This method can be used for any conductive plug 220 (e.g. aluminum, tungsten, copper, titanium nitride, etc.). In addition, this method is also applicable in contact, via, and trench (damascene) applications. Furthermore, this process can advantageously be used in logic, SRAM, and DRAM applications.

摘要翻译： 通过对所讨论的导电材料进行选择性的氧化物蚀刻或氧化物CMP来减小导电插塞220中的有效凹部的方法。 该方法可用于任何导电插头220（例如铝，钨，铜，氮化钛等）。 此外，该方法也适用于接触，通孔和沟槽（镶嵌）应用。 此外，该过程可以有利地用于逻辑，SRAM和DRAM应用中。

公开(公告)号：US20120234238A1

公开(公告)日：2012-09-20

申请号：US13419121

申请日：2012-03-13

申请人： Wei-Yung Hsu ,  Hua Chung ,  Ting-Ruei Shiu ,  Jie Cui

发明人： Wei-Yung Hsu ,  Hua Chung ,  Ting-Ruei Shiu ,  Jie Cui

IPC分类号： C23C16/52 ,  G01N3/00

CPC分类号： G01N3/20 ,  G01N3/068 ,  G01N3/12 ,  G01N2203/0282 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67207 ,  H01L21/67288 ,  H01L21/67754 ,  H01L21/68764 ,  H01L21/68771

摘要： Integrated wafer or substrate bow measurement modules are described. For example, a multi-chamber system includes a chamber housing a bow measurement module. In another example, a method of pre-screening a wafer includes inserting a wafer or a substrate into a multi-chamber system. A bow parameter of the wafer or the substrate is measured in a bow measurement module housed in a chamber of the multi-chamber system.

摘要翻译： 描述了集成的晶片或衬底弓测量模块。 例如，多室系统包括容纳弓测量模块的腔室。 在另一示例中，预筛选晶片的方法包括将晶片或基板插入多室系统中。 在容纳在多室系统的室中的弓测量模块中测量晶片或基板的弓形参数。

公开(公告)号：US20110253685A1

公开(公告)日：2011-10-20

申请号：US13076422

申请日：2011-03-30

申请人： Wei-Yung Hsu ,  Antoine P. Manens

发明人： Wei-Yung Hsu ,  Antoine P. Manens

IPC分类号： B23K26/00

CPC分类号： B23K26/046 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50

摘要： Systems for scribing a workpiece incorporate a motorized beam expander to change a laser beam spot size incident on a workpiece. A system includes a frame, a laser coupled with the frame and generating an output to remove material from at least a portion of a workpiece, a beam expander positioned along a path of the laser output and having a motorized mechanism operable to vary a beam expansion ratio applied to the laser output, and at least one scanning device coupled with the frame and operable to control a position of the laser output, after expansion, on the workpiece. The motorized beam expander can be used to selectively vary the width of a laser beam supplied to a scanning device so as to selectively vary the size of the laser beam incident on the workpiece. Alternatively, a variable aperture can be used instead of a beam expander.

摘要翻译： 用于对工件进行划线的系统包括电动束扩张器以改变入射在工件上的激光束斑点尺寸。 一种系统包括框架，激光器与框架耦合并且产生输出以从工件的至少一部分移除材料;沿着激光输出路径定位的光束扩展器，并具有可操作以改变光束膨胀的电动机构 以及至少一个与框架耦合的扫描装置，并可操作以控制激光输出在膨胀之后在工件上的位置。 电动光束扩展器可以用于选择性地改变提供给扫描装置的激光束的宽度，以便选择性地改变入射在工件上的激光束的尺寸。 或者，可以使用可变光圈来代替光束扩展器。

公开(公告)号：US20110198322A1

公开(公告)日：2011-08-18

申请号：US12851471

申请日：2010-08-05

申请人： Antoine P. Manens ,  Ting-Ruei Shiu ,  Bassam Shamoun ,  Wei-Yung Hsu ,  Manivannan Thothadri

发明人： Antoine P. Manens ,  Ting-Ruei Shiu ,  Bassam Shamoun ,  Wei-Yung Hsu ,  Manivannan Thothadri

IPC分类号： B23K26/00 ,  G01J1/42 ,  H04N7/18

CPC分类号： B23K26/048 ,  B23K26/032 ,  B23K26/0673 ,  B23K26/082 ,  B23K26/083 ,  B23K26/364 ,  B23K26/40 ,  B23K26/705 ,  B23K2103/172 ,  H01L31/046 ,  H01L31/0463 ,  Y02E10/50

摘要： In-line metrology methods and systems for use with laser-scribing systems used in solar-cell fabrication are disclosed. Such methods and systems can involve a variety of components, for example, a device for measuring the amount of power input to a laser, a power meter for measuring laser output power, a beam viewer for measuring aspects of a laser beam, a height sensor for measuring a workpiece height, a microscope for measuring workpiece features formed by the laser-scribing system, and a system for monitoring a laser-scribing system and annunciating a warning(s) and/or an error message(s) when operational limits are exceeded. In-line metrology methods can also include the processing of output beam reflections so as to track beam drift over time and/or provide for focusing of an imaging device.

摘要翻译： 公开了用于太阳能电池制造中使用的激光划线系统的在线测量方法和系统。 这样的方法和系统可以涉及各种部件，例如，用于测量激光输入功率的装置，用于测量激光输出功率的功率计，用于测量激光束的方面的光束观察器，高度传感器 用于测量工件高度的显微镜，用于测量由激光划线系统形成的工件特征的显微镜，以及用于监视激光划线系统的系统，并且当操作限度为...时，发出警告和/或错误消息 超过了 在线测量方法还可以包括输出光束反射的处理，以便随时间跟踪光束漂移和/或提供成像装置的聚焦。

公开(公告)号：US20100252543A1

公开(公告)日：2010-10-07

申请号：US12621316

申请日：2009-11-18

申请人： Antoine P. Manens ,  Wei-Yung Hsu

发明人： Antoine P. Manens ,  Wei-Yung Hsu

IPC分类号： B23K26/00

CPC分类号： B23K26/082 ,  B23K26/702

摘要： The present disclosure relates to apparatuses and systems for laser scribing a vertically-oriented workpiece. In many embodiments, a laser-scribing apparatus includes a frame, a first fixture coupled with the frame, a second fixture coupled with the frame, a laser operable to generate output able to remove material from at least a portion of the workpiece, and a scanning device coupled with the laser and the frame. The first fixture is configured for engagement with a first portion of the workpiece. The second fixture is configured for engagement with a second portion of the workpiece. When the workpiece is engaged by the first and second fixtures the workpiece is substantially vertically oriented. The scanning device is operable to control a position of the output from the laser relative to the workpiece.

摘要翻译： 本公开涉及用于激光划线垂直取向的工件的装置和系统。 在许多实施例中，激光划线设备包括框架，与框架连接的第一固定件，与框架连接的第二固定件，可操作以产生能够从工件的至少一部分移除材料的激光器，以及 与激光和框架耦合的扫描装置。 第一夹具构造成与工件的第一部分接合。 第二夹具被构造成与工件的第二部分接合。 当工件被第一和第二固定件接合时，工件基本上垂直定向。 扫描装置可操作以控制来自激光器的输出相对于工件的位置。

公开(公告)号：US20090038642A1

公开(公告)日：2009-02-12

申请号：US12249922

申请日：2008-10-11

申请人： Wei-Yung Hsu ,  Donald J.K. Olgado ,  Ho Seon Shin ,  Liang-Yuh Chen

发明人： Wei-Yung Hsu ,  Donald J.K. Olgado ,  Ho Seon Shin ,  Liang-Yuh Chen

IPC分类号： B08B1/04

CPC分类号： H01L21/67046 ,  B08B1/04 ,  H01L21/67028

摘要： In one aspect, a method for cleaning an edge of a substrate is provided. The method comprises employing one or more rollers of a first diameter to rotate a substrate; contacting an edge of the substrate with one or more rollers of a second diameter that is larger than the first diameter; and cleaning the edge of the substrate using the one or more rollers of the second diameter. Numerous other aspects are provided.

摘要翻译： 一方面，提供一种清洗基板的边缘的方法。 该方法包括采用一个或多个第一直径的辊来旋转衬底; 使所述基板的边缘与大于所述第一直径的第二直径的一个或多个辊接触; 以及使用所述第二直径的所述一个或多个辊清洁所述基板的边缘。 提供了许多其他方面。

公开(公告)号：US20090036033A1

公开(公告)日：2009-02-05

申请号：US12245765

申请日：2008-10-05

申请人： Erik C. Wasinger ,  Gary C. Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

发明人： Erik C. Wasinger ,  Gary C. Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

IPC分类号： B24B1/04 ,  B24B9/00

CPC分类号： C03C19/00 ,  B24B1/04 ,  B24B9/065 ,  B24B21/004 ,  H01L21/02021

摘要： A method of cleaning an edge of a substrate is provided. The method comprises tensioning a first polishing film in a frame; contacting the first polishing film against an edge of a substrate; conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and rotating the substrate while the first polishing film remains in contact with the substrate. Numerous other aspects are provided.

摘要翻译： 提供了清洁基板的边缘的方法。 该方法包括在框架中张紧第一抛光膜; 使所述第一抛光膜与衬底的边缘接触; 使所述第一抛光膜与所述基板的边缘一致，所述边缘包括外边缘和至少一个斜面; 并且在第一研磨膜与基板保持接触的同时旋转基板。 提供了许多其他方面。

公开(公告)号：US20080293331A1

公开(公告)日：2008-11-27

申请号：US12124153

申请日：2008-05-21

申请人： Yufei Chen ,  Zhenhua Zhang ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Makoto Matsuo

发明人： Yufei Chen ,  Zhenhua Zhang ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Makoto Matsuo

IPC分类号： B24B9/06 ,  C08J5/14

CPC分类号： B24B9/065 ,  B24B21/002

摘要： Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device may be formed to include a base, a resin layer adhering to the base, and a plurality of embossed abrasive particles and/or abrasive beads affixed to the base by the resin layer. The plurality of abrasive particles and/or beads may be embossed in the resin layer. The plurality of abrasive beads may include a plurality of abrasive particles suspended in binder material. The plurality of abrasive particles and/or beads and the resin layer combine to form an abrasive side of the polishing device adapted to contact the substrate. Polishing of the substrate preferably includes polishing an edge of the substrate while the substrate is rotated by a holding device such that no apparatus other than the polishing tape contacts the edge while the substrate is rotating.

摘要翻译： 提供的装置和方法涉及使用诸如抛光带的抛光装置来抛光衬底。 抛光装置可以形成为包括基底，粘附到基底的树脂层和由树脂层固定到基底的多个压花磨料颗粒和/或研磨珠。 多个研磨颗粒和/或珠可以在树脂层中压花。 多个研磨珠可以包括悬挂在粘合剂材料中的多个磨料颗粒。 多个研磨颗粒和/或珠粒和树脂层组合形成适于接触基底的抛光装置的研磨侧。 衬底的抛光优选包括在通过保持装置旋转衬底的同时抛光衬底的边缘，使得除了研磨带之外的其它装置在衬底旋转时不接触边缘。