Abstract:
Methods and devices configured to operate at high temperatures using semi-polar oriented gallium and nitrogen containing substrates for optical applications are disclosed.
Abstract:
Gallium and nitrogen containing optical devices operable as laser diodes are disclosed. The devices include a gallium and nitrogen containing substrate member, which may be semipolar or non-polar. The devices include a chip formed from the gallium and nitrogen substrate member. The chip has a width and a length. The devices have a cavity oriented substantially parallel to the length of the chip, a dimension of less than 120 microns characterizing the width of the chip, and a pair of etched facets configured on the cavity of the chip. The pair of etched facets includes a first facet configured at a first end of the cavity and a second facet configured at a second end of the cavity.
Abstract:
Nonpolar or semipolar laser diode technology incorporating etched facet mirror formation and conventional optical coating layer techniques for reflectivity modification to enable a method for ultra-high catastrophic optical mirror damage thresholds for high power laser diodes are disclosed.
Abstract:
Laser devices formed on a semipolar surface region of a gallium and nitrogen containing material are disclosed. The laser devices have a laser stripe configured to emit a laser beam having a cross-polarized emission state.
Abstract:
A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.