Methods for fabricating a stressed MOS device
    4.
    发明授权
    Methods for fabricating a stressed MOS device 有权
    制造应力MOS器件的方法

    公开(公告)号:US07462524B1

    公开(公告)日:2008-12-09

    申请号:US11205797

    申请日:2005-08-16

    IPC分类号: H01L21/336

    摘要: Methods are provided for fabricating a stressed MOS device. One method comprises the steps of providing a substrate of a monocrystalline semiconductor material having a first lattice constant, and forming a conductive gate electrode overlying the substrate, the gate electrode having opposing sides and having a thickness. Sidewall spacers are formed on the opposing sides of the gate electrode and trenches are etched in the semiconductor substrate in alignment with the sidewall spacers. A portion of the thickness of the conductive gate electrode is also etched to leave a remaining portion of the conductive gate electrode. A stress inducing layer of material is grown on the remaining portion of the conductive gate electrode and filling the trenches, the stress inducing layer of material having a second lattice constant different than the first lattice constant.

    摘要翻译: 提供了制造应力MOS器件的方法。 一种方法包括以下步骤:提供具有第一晶格常数的单晶半导体材料的衬底,以及形成覆盖衬底的导电栅电极,栅电极具有相对的侧面并具有厚度。 侧壁间隔物形成在栅电极的相对侧上,并且沟槽在半导体衬底中被蚀刻以与侧壁间隔物对齐。 还蚀刻导电栅电极的厚度的一部分以留下导电栅电极的剩余部分。 在导电栅电极的剩余部分上生长材料的应力诱导层,并填充沟槽,具有不同于第一晶格常数的第二晶格常数的材料的应力诱导层。

    METHOD OF ENHANCING LITHOGRAPHY CAPABILITIES DURING GATE FORMATION IN SEMICONDUCTORS HAVING A PRONOUNCED SURFACE TOPOGRAPHY
    5.
    发明申请
    METHOD OF ENHANCING LITHOGRAPHY CAPABILITIES DURING GATE FORMATION IN SEMICONDUCTORS HAVING A PRONOUNCED SURFACE TOPOGRAPHY 有权
    在具有预定表面形貌的半导体中增加栅格形成过程中的刻蚀能力的方法

    公开(公告)号:US20080026552A1

    公开(公告)日:2008-01-31

    申请号:US11773631

    申请日:2007-07-05

    IPC分类号: H01L21/4763

    CPC分类号: H01L21/28123 H01L29/66772

    摘要: In a mesa isolation configuration for forming a transistor on a semiconductor island, an additional planarization step is performed to enhance the uniformity of the gate patterning process. In some illustrative embodiments, the gate electrode material may be planarized, for instance, on the basis of CMP, to compensate for the highly non-uniform surface topography, when the gate electrode material is formed above the non-filled isolation trenches. Consequently, significant advantages of the mesa isolation strategy may be combined with a high degree of scalability due to the enhancement of the critical gate patterning process.

    摘要翻译: 在用于在半导体岛上形成晶体管的台面隔离结构中,执行附加的平面化步骤以增强栅极图案化工艺的均匀性。 在一些说明性实施例中,当栅电极材料形成在未填充的隔离沟槽上方时,栅电极材料可以例如基于CMP平坦化,以补偿高度不均匀的表面形貌。 因此,由于关键栅极图案化工艺的增强,台面隔离策略的显着优点可能与高度的可扩展性相结合。

    Process and system for automatic, computer-system-supported optimisation
    10.
    发明授权
    Process and system for automatic, computer-system-supported optimisation 失效
    自动,计算机系统支持优化的过程和系统

    公开(公告)号:US5913199A

    公开(公告)日:1999-06-15

    申请号:US765478

    申请日:1996-12-20

    IPC分类号: G01C21/34 G06Q10/00 G06F17/60

    摘要: In a process and a system for automatic, computer-system-supported optimization and the search for a state x dependent on at least one parameter P, for which f(x) as a measure of the quality of x assumes an extremum, an initial solution, i.e. a state x, is found as an initial state and a further state y different from x is found by means of an elementary change in an individual parameter P from x. If the result of a comparison of the target function values f(x) and f(y) is that f(y) is poorer than f(x) by more than a threshold value T, y is rejected, x is retained and a fresh adjacent state of x is found. If f(y) is at least as great as f(x)-T, there is a transition to state y. The threshold T is successively reduced to zero.

    摘要翻译: PCT No.PCT / EP95 / 01961 Sec。 371日期1996年12月20日第 102(e)日期1996年12月20日PCT提交1995年5月23日PCT公布。 出版物WO96 / 02040 日期1996年1月25日在自动,计算机系统支持的优化和根据至少一个参数P的状态x的搜索的过程和系统中,其中f(x)作为x的质量的度量 发现极值,即初始解,即状态x,作为初始状态,并且通过来自x的单个参数P的基本变化,找到与x不同的另外状态y。 如果目标函数值f(x)和f(y)的比较的结果是f(y)比f(x)更差超过阈值T,则y被拒绝,x被保留 找到新的相邻状态的x。 如果f(y)至少与f(x)-T一样大,则转移到状态y。 阈值T依次减小到零。