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公开(公告)号:US20080173919A1
公开(公告)日:2008-07-24
申请号:US11655583
申请日:2007-01-19
申请人: Stephan Kudelka , Lars Oberbeck , Uwe Schroeder , Tim Boescke , Johannes Heitmann , Annette Saenger , Joerg Schumann , Elke Erben
发明人: Stephan Kudelka , Lars Oberbeck , Uwe Schroeder , Tim Boescke , Johannes Heitmann , Annette Saenger , Joerg Schumann , Elke Erben
CPC分类号: H01L21/02181 , H01G4/10 , H01G4/33 , H01L21/02189 , H01L21/3141 , H01L21/31641 , H01L21/31645 , H01L27/10852 , H01L28/65
摘要: The present invention relates to a method for depositing a dielectric material comprising a transition metal compound. After providing a substrate, a first pre-cursor comprising a transition metal compound and a second pre-cursor predominantly comprising at least one of water vapour, ammonia and hydrazine are successively applied on the substrate for forming a first layer of transition metal containing material. In a next step the first pre-cursor and a third pre-cursor comprising at least one of ozone and oxygen are successively applied on the first layer for forming a second layer of the transition metal containing material.
摘要翻译: 本发明涉及沉积包含过渡金属化合物的电介质材料的方法。 在提供衬底之后,在衬底上依次施加包含过渡金属化合物的第一前体和主要包含水蒸汽,氨和肼中的至少一种的第二前体,形成含第一层含过渡金属的材料。 在下一步骤中,在第一层上依次施加包含臭氧和氧气中的至少一种的第一前视标和第三前标,以形成含过渡金属的材料的第二层。
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公开(公告)号:US07666752B2
公开(公告)日:2010-02-23
申请号:US11655583
申请日:2007-01-19
申请人: Stephan Kudelka , Lars Oberbeck , Uwe Schroeder , Tim Boescke , Johannes Heitmann , Annette Saenger , Joerg Schumann , Elke Erben
发明人: Stephan Kudelka , Lars Oberbeck , Uwe Schroeder , Tim Boescke , Johannes Heitmann , Annette Saenger , Joerg Schumann , Elke Erben
IPC分类号: H01L21/20
CPC分类号: H01L21/02181 , H01G4/10 , H01G4/33 , H01L21/02189 , H01L21/3141 , H01L21/31641 , H01L21/31645 , H01L27/10852 , H01L28/65
摘要: The present invention relates to a method for depositing a dielectric material comprising a transition metal compound. After providing a substrate, a first pre-cursor comprising a transition metal compound and a second pre-cursor predominantly comprising at least one of water vapour, ammonia and hydrazine are successively applied on the substrate for forming a first layer of transition metal containing material. In a next step the first pre-cursor and a third pre-cursor comprising at least one of ozone and oxygen are successively applied on the first layer for forming a second layer of the transition metal containing material.
摘要翻译: 本发明涉及沉积包含过渡金属化合物的电介质材料的方法。 在提供衬底之后,在衬底上依次施加包含过渡金属化合物的第一前体和主要包含水蒸汽,氨和肼中的至少一种的第二前体,形成含第一层含过渡金属的材料。 在下一步骤中,在第一层上依次施加包含臭氧和氧气中的至少一种的第一前视标和第三前标,以形成含过渡金属的材料的第二层。
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3.
公开(公告)号:US20080182427A1
公开(公告)日:2008-07-31
申请号:US11698337
申请日:2007-01-26
申请人: Lars Oberbeck , Uwe Schroeder , Johannes Heitmann , Stephan Kudelka , Tim Boescke , Jonas Sundqvist
发明人: Lars Oberbeck , Uwe Schroeder , Johannes Heitmann , Stephan Kudelka , Tim Boescke , Jonas Sundqvist
CPC分类号: H01L21/02337 , H01L21/02175 , H01L21/28194 , H01L21/3142 , H01L21/31641 , H01L27/10805 , H01L27/1085 , H01L28/40 , H01L29/513 , H01L29/517
摘要: The present invention relates to a method for depositing a dielectric material comprising a transition metal oxide. In an initial step, a substrate is provided. In a further step, a first precursor comprising a transition metal containing compound, and a second precursor predominantly comprising at least one of water vapor, ozone, oxygen, or oxygen plasma are sequentially applied for depositing above the substrate a layer of a transition metal containing material. In another step, a third precursor comprising a dopant containing compound, and a fourth precursor predominantly comprising at least one of water vapor, ozone, oxygen, or oxygen plasma are sequentially applied for depositing above the substrate a layer of a dopant containing material. The transition metal comprises at least one of zirconium and hafnium. The dopant comprises at least one of barium, strontium, calcium, niobium, bismuth, magnesium, and cerium.
摘要翻译: 本发明涉及沉积包含过渡金属氧化物的电介质材料的方法。 在初始步骤中,提供衬底。 在另一步骤中,依次施加包含含过渡金属的化合物的第一前体和主要包含水蒸气,臭氧,氧或氧等离子体中的至少一种的第二前体,以在基底上沉积含有过渡金属的层 材料。 在另一步骤中,顺序地施加包含掺杂剂的化合物的第三前体和主要包含水蒸汽,臭氧,氧或氧等离子体中的至少一种的第四前体,以在衬底上沉积含掺杂剂材料的层。 过渡金属包括锆和铪中的至少一种。 掺杂剂包括钡,锶,钙,铌,铋,镁和铈中的至少一种。
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公开(公告)号:US20080283973A1
公开(公告)日:2008-11-20
申请号:US12104814
申请日:2008-04-17
IPC分类号: H01L23/58 , H01L21/469 , H05K3/00
CPC分类号: H01L21/02181 , C23C16/45529 , C23C30/00 , H01L21/02271 , H01L21/02274 , H01L21/0228 , H01L21/0234 , H01L21/3141 , H01L21/31604 , H01L21/318 , H01L27/1085 , H01L28/40
摘要: An integrated circuit including a dielectric layer and a method for producing an integrated circuit. In one embodiment, a dielectric layer is deposited in a process atmosphere. The process atmosphere includes a first starting component at a first point in time, a second starting component at a second point in time and a third starting component at a third point in time. The third starting component includes a halogen.
摘要翻译: 包括电介质层的集成电路和用于制造集成电路的方法。 在一个实施例中,在工艺气氛中沉积电介质层。 处理气氛包括在第一时间点的第一启动组件,在第二时间点的第二启动组件和在第三时间点的第三启动组件。 第三起始组分包括卤素。
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公开(公告)号:US20120108003A1
公开(公告)日:2012-05-03
申请号:US13287212
申请日:2011-11-02
申请人: Bernd Bitnar , Lars Oberbeck , Ralf Luedemann
发明人: Bernd Bitnar , Lars Oberbeck , Ralf Luedemann
IPC分类号: H01L31/18
CPC分类号: H01L31/1804 , H01L31/02245 , H01L31/068 , Y02E10/547 , Y02P70/521
摘要: In various embodiments, a method for producing a solar cell is provided. In accordance with the method, through-holes may be formed in a solar cell substrate having the basic doping of a first conduction type. Furthermore, predetermined surface regions of a first surface of the solar cell substrate which include at least one portion of the through-holes may be highly doped with a second, opposite conduction type; and simultaneously or subsequently other surface regions of the first surface are lightly doped with the second conduction type. Furthermore, first and second metallic contacts may subsequently be formed in such a way that the second metallic contacts are electrically isolated from the first metallic contacts.
摘要翻译: 在各种实施例中,提供了一种太阳能电池的制造方法。 根据该方法,可以在具有第一导电类型的基本掺杂的太阳能电池基板中形成通孔。 此外,包括至少一部分通孔的太阳能电池基板的第一表面的预定表面区域可以被高度掺杂第二相反的导电类型; 并且第一表面的同时或随后的其它表面区域被轻掺杂第二导电类型。 此外,第一和第二金属触点可以随后形成为使得第二金属触点与第一金属触点电隔离。
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公开(公告)号:US07547648B2
公开(公告)日:2009-06-16
申请号:US10568559
申请日:2004-08-20
申请人: Frank J. Ruess , Lars Oberbeck , Michelle Yvonne Simmons , K. E. Johnson Goh , Alexander Rudolf Hamilton , Mladen Mitic , Rolf Brenner , Neil Jonathan Curson , Toby Hallam
发明人: Frank J. Ruess , Lars Oberbeck , Michelle Yvonne Simmons , K. E. Johnson Goh , Alexander Rudolf Hamilton , Mladen Mitic , Rolf Brenner , Neil Jonathan Curson , Toby Hallam
IPC分类号: H01L21/00
CPC分类号: H01L23/544 , B82Y10/00 , B82Y30/00 , G01Q80/00 , H01L29/66439 , H01L2223/54426 , H01L2223/54453 , H01L2924/0002 , Y10S438/975 , H01L2924/00
摘要: This invention concerns the fabrication of nanoscale and atomic scale devices. The method involves creating one or more registration markers. Using a SEM or optical microscope to form an image of the registration markers and the tip of a scanning tunnelling microscope (STM). Using the image to position and reposition the STM tip to pattern the device structure. Forming the active region of the device and then encapsulating it such that one or more of the registration markers are still visible to allow correct positioning of surface electrodes. The method can be used to form any number of device structures including quantum wires, single electron transistors, arrays or gate regions. The method can also be used to produce 3D devices by patterning subsequent layers with the STM and encapsulating in between.
摘要翻译: 本发明涉及纳米尺度和原子尺度装置的制造。 该方法涉及创建一个或多个注册标记。 使用SEM或光学显微镜形成对准标记和扫描隧道显微镜(STM)的尖端的图像。 使用图像定位和重新定位STM尖端以对设备结构进行图案化。 形成器件的有源区,然后封装,使得一个或多个配准标记物仍然可见,以允许表面电极的正确定位。 该方法可用于形成任何数量的器件结构,包括量子线,单电子晶体管,阵列或栅极区。 该方法还可以用于通过用STM构图后续层并封装在其间来产生3D器件。
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公开(公告)号:US20060275958A1
公开(公告)日:2006-12-07
申请号:US10568559
申请日:2004-08-20
申请人: Frank Ruess , Lars Oberbeck , Michelle Simmons , K.E. Goh , Alexander Hamilton , Mladen Mitic , Rolf Brenner , Neil Curson , Toby Hallam
发明人: Frank Ruess , Lars Oberbeck , Michelle Simmons , K.E. Goh , Alexander Hamilton , Mladen Mitic , Rolf Brenner , Neil Curson , Toby Hallam
CPC分类号: H01L23/544 , B82Y10/00 , B82Y30/00 , G01Q80/00 , H01L29/66439 , H01L2223/54426 , H01L2223/54453 , H01L2924/0002 , Y10S438/975 , H01L2924/00
摘要: This invention concerns the fabrication of nanoscale and atomic scale devices. The method involves creating one or more registration markers. Using a SEM or optical microscope to form an image of the registration markers and the tip of a scanning tunnelling microscope (STM). Using the image to position and reposition the STM tip to pattern the device structure. Forming the active region of the device and then encapsulating it such that one or more of the registration markers are still visible to allow correct positioning of surface electrodes. The method can be used to form any number of device structures including quantum wires, single electron transistors, arrays or gate regions. The method can also be used to produce 3D devices by patterning subsequent layers with the STM and encapsulating in between.
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8.
公开(公告)号:US07097708B2
公开(公告)日:2006-08-29
申请号:US10484759
申请日:2002-08-20
申请人: Robert Graham Clark , Neil Jonathan Curson , Toby Hallam , Lars Oberbeck , Steven Richard Schofield , Michelle Yvonne Simmons
发明人: Robert Graham Clark , Neil Jonathan Curson , Toby Hallam , Lars Oberbeck , Steven Richard Schofield , Michelle Yvonne Simmons
IPC分类号: C30B25/12
CPC分类号: G06N99/002 , B82Y10/00 , B82Y30/00 , H01L21/18
摘要: This invention concerns nanoscale products, such as electronic devices fabricated to nanometer accuracy. It also concerns atomic scale products. These products may have an array of electrically active dopant atoms in a silicon surface, or an encapsulated layer of electrically active donor atoms. In a further aspect the invention concerns a method of fabricating such products. The methods include forming a preselected array of donor atoms incorporated into silicon. Encapsulation by growing silicon over a doped surface, after desorbing the passivating hydrogen. Also, using an STM to view donor atoms on the silicon surface during fabrication of a nanoscale device, and measuring the electrical activity of the donor atoms during fabrication of a nanoscale device. Such products and processes are useful in the fabrication of a quantum computer, but could have many other uses.
摘要翻译: 本发明涉及纳米级产品,例如以纳米精度制造的电子器件。 它也涉及原子级产品。 这些产品可以在硅表面或电活性供体原子的封装层中具有阵列的电活性掺杂剂原子。 在另一方面,本发明涉及一种制造这种产品的方法。 所述方法包括形成掺入硅中的供体原子的预选阵列。 在解吸钝化氢后,通过在掺杂表面上生长硅来封装。 此外,在制造纳米级器件期间使用STM来观察硅表面上的供体原子,并且在制造纳米尺度器件期间测量施主原子的电活性。 这样的产品和方法在量子计算机的制造中是有用的,但是可以具有许多其它用途。
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