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11 条记录 (耗时 0.029 秒)

    Apparatus and method for dielectric deposition
    6.
    发明授权
    Apparatus and method for dielectric deposition 有权
    电介质沉积的设备和方法

    公开(公告)号：US08765232B2

    公开(公告)日：2014-07-01

    申请号：US13347598

    申请日：2012-01-10

    申请人： Stephen Edward Savas ,  Sai Mantripragada ,  Sooyun Joh ,  Allan B. Wiesnoski ,  Carl Galewski

    发明人： Stephen Edward Savas ,  Sai Mantripragada ,  Sooyun Joh ,  Allan B. Wiesnoski ,  Carl Galewski

    IPC分类号： C23F1/00 ,  H05H1/24

    CPC分类号： C23C16/503 ,  C23C16/45574 ,  C23C16/45578 ,  C23C16/509 ,  C23C16/54 ,  C23C16/545 ,  H01J37/32036 ,  H01J37/32532

    摘要： The disclosed invention includes apparatus and methods that may be used for plasma-based deposition of thin layers of material on separate or continuous web substrates at very low temperatures with very low defect density. It achieves superior control of gas phase chemistry by controlling the sequence of introduction of gaseous components. It also has substantially independent control over the rate of chemical processes in the gas and of the amount of power and energy of ion bombardment. Such control enables high quality single and multi-layer films to be deposited cost effectively and uniformly over larger areas under very low temperature conditions.

    摘要翻译： 所公开的发明包括可以用于在非常低的缺陷密度的非常低的温度下在分离的或连续的纸幅基材上等离子体沉积薄层材料的装置和方法。 通过控制气体组分的引入顺序，可以实现气相化学的优异控制。 它还对气体中的化学过程速率和离子轰击的功率和能量的量具有实质上独立的控制。 这种控制使得高质量的单层和多层薄膜能够在非常低的温度条件下成本有效且均匀地沉积在较大的区域上。

    Integrated wafer transfer mechanism
    9.
    发明申请
    Integrated wafer transfer mechanism 有权
    集成晶片传输机制

    公开(公告)号：US20090082895A1

    公开(公告)日：2009-03-26

    申请号：US11859752

    申请日：2007-09-22

    申请人： David Barker ,  Robert Thomas LoBianco ,  Sai Mantripragada ,  Farzad Tabrizi

    发明人： David Barker ,  Robert Thomas LoBianco ,  Sai Mantripragada ,  Farzad Tabrizi

    IPC分类号： H01L21/677 ,  B25J13/00 ,  B25J15/00 ,  G06F19/00

    CPC分类号： H01L21/67742 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/681

    摘要： An integrated high speed robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly typically comprises an end effector for moving the object in and out of a chamber, a rotation chuck incorporated on the robot body to provide centering and theta alignment capability, and an optional identification subsystem for identifying the object during transport. The present invention also discloses a transfer robot system, employing a plurality of integrated robot assemblies; a transfer system where a transfer robot system can service a plurality of connected chambers such as FOUP or FOSB; a front end module (FEM); or a sorter system. Through the use of these incorporated capabilities into the moving robot, single object transfer operations can exceed 500 parts per hour.

    摘要翻译： 公开了一种集成的高速机器人机构，用于改善运输设备，将物体运动与诸如对准或识别的其它功能相结合。 所公开的集成机器人组件通常包括用于将物体移入和移出室的端部执行器，结合在机器人主体上以提供定心和θ对准能力的旋转卡盘，以及用于在运输期间识别物体的可选标识子系统。 本发明还公开了一种采用多个集成的机器人组件的传送机器人系统; 传送系统，其中传送机器人系统可以服务于诸如FOUP或FOSB的多个连接的室; 前端模块（FEM）; 或分拣机系统。 通过将这些结合的能力应用于移动机器人，单个物体传送操作可以超过500个小时。

    Integrated wafer transfer mechanism
    10.
    发明授权
    Integrated wafer transfer mechanism 有权
    集成晶片传输机制

    公开(公告)号：US07976263B2

    公开(公告)日：2011-07-12

    申请号：US11859752

    申请日：2007-09-22

    申请人： David Barker ,  Robert T. LoBianco ,  Sai Mantripragada ,  Farzad Tabrizi

    发明人： David Barker ,  Robert T. LoBianco ,  Sai Mantripragada ,  Farzad Tabrizi

    IPC分类号： B25J15/10 ,  F26B3/08

    CPC分类号： H01L21/67742 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/681

    摘要： An integrated high speed robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly typically comprises an end effector for moving the object in and out of a chamber, a rotation chuck incorporated on the robot body to provide centering and theta alignment capability, and an optional identification subsystem for identifying the object during transport. The present invention also discloses a transfer robot system, employing a plurality of integrated robot assemblies; a transfer system where a transfer robot system can service a plurality of connected chambers such as FOUP or FOSB; a front end module (FEM); or a sorter system. Through the use of these incorporated capabilities into the moving robot, single object transfer operations can exceed 500 parts per hour.

    摘要翻译： 公开了一种集成的高速机器人机构，用于改善运输设备，将物体运动与诸如对准或识别的其他功能相结合。 所公开的集成机器人组件通常包括用于将物体移入和移出室的端部执行器，结合在机器人主体上以提供定心和θ对准能力的旋转卡盘，以及用于在运输期间识别物体的可选标识子系统。 本发明还公开了一种采用多个集成的机器人组件的传送机器人系统; 传送系统，其中传送机器人系统可以服务于诸如FOUP或FOSB的多个连接的室; 前端模块（FEM）; 或分拣机系统。 通过将这些结合的能力应用于移动机器人，单个物体传送操作可以超过500个小时。