Power switch structure with low RDSon and low current limit
    1.
    发明授权
    Power switch structure with low RDSon and low current limit 有权
    电源开关结构具有低RDSon和低电流限制

    公开(公告)号:US06949961B2

    公开(公告)日:2005-09-27

    申请号:US10678769

    申请日:2003-10-06

    摘要: In one embodiment, a power switch device (33) includes a first MOSFET device 41 and a second MOSFET device (42). A split gate structure (84) including a first gate electrode (48,87) controls the first MOSFET device (41). A second gate electrode (49,92) controls the second MOSFET device (42). A current limit device (38) is coupled to the first gate electrode (48,97) to turn on the first MOSFET device during a current limit mode. A comparator device (36) is coupled to the second gate electrode (49,92) to turn on the second MOSFET device (42) when the power switch device (33) is no longer in current limit mode.

    摘要翻译: 在一个实施例中,功率开关器件(33)包括第一MOSFET器件41和第二MOSFET器件(42)。 包括第一栅极(48,87)的分离栅极结构(84)控制第一MOSFET器件(41)。 第二栅电极(49,92)控制第二MOSFET器件(42)。 电流限制装置(38)耦合到第一栅电极(48,97),以在电流限制模式期间导通第一MOSFET器件。 当电源开关装置(33)不再处于限流模式时,比较器装置(36)耦合到第二栅电极(49,92)以接通第二MOSFET装置(42)。

    Power switch structure with low RDSon and low current limit and method
    2.
    发明授权
    Power switch structure with low RDSon and low current limit and method 有权
    电源开关结构具有低RDSon和低电流限制和方法

    公开(公告)号:US07230299B2

    公开(公告)日:2007-06-12

    申请号:US11105222

    申请日:2005-04-14

    IPC分类号: H01L29/76 H01L29/94 H01L31/00

    摘要: In one embodiment, a power switch device (33) includes a first MOSFET device 41 and a second MOSFET device (42). A split gate structure (84) including a first gate electrode (48,87) controls the first MOSFET device (41). A second gate electrode (49,92) controls the second MOSFET device (42). A current limit device (38) is coupled to the first gate electrode (48,97) to turn on the first MOSFET device during a current limit mode. A comparator device (36) is coupled to the second gate electrode (49,92) to turn on the second MOSFET device (42) when the power switch device (33) is no longer in current limit mode.

    摘要翻译: 在一个实施例中,功率开关器件(33)包括第一MOSFET器件41和第二MOSFET器件(42)。 包括第一栅极(48,87)的分离栅极结构(84)控制第一MOSFET器件(41)。 第二栅电极(49,92)控制第二MOSFET器件(42)。 电流限制装置(38)耦合到第一栅电极(48,97),以在电流限制模式期间导通第一MOSFET器件。 当电源开关装置(33)不再处于限流模式时,比较器装置(36)耦合到第二栅电极(49,92)以接通第二MOSFET装置(42)。

    Method of forming a vertical power semiconductor device and structure therefor
    5.
    发明授权
    Method of forming a vertical power semiconductor device and structure therefor 有权
    形成垂直功率半导体器件的方法及其结构

    公开(公告)号:US06841437B1

    公开(公告)日:2005-01-11

    申请号:US10464971

    申请日:2003-06-20

    申请人: Stephen P. Robb

    发明人: Stephen P. Robb

    摘要: A method of forming medium breakdown voltage vertical transistors (11) and lateral transistors (12, 13) on the same substrate (14) provides for optimizing the epitaxial layer (16) for the lateral transistors (12, 13). The vertical transistor (11) is formed in a well (18) that has a lower resistivity than the epitaxial layer (16) to provide the required low on-resistance for the vertical power transistor (11).

    摘要翻译: 在同一衬底(14)上形成介质击穿电压垂直晶体管(11)和横向晶体管(12,13)的方法提供了优化用于横向晶体管(12,13)的外延层(16)。 垂直晶体管(11)形成在具有比外延层(16)更低的电阻率的阱(18)中,以为垂直功率晶体管(11)提供所需的低导通电阻。

    Semiconductor device having high voltage protection capability
    6.
    发明授权
    Semiconductor device having high voltage protection capability 失效
    具有高电压保护能力的半导体器件

    公开(公告)号:US5536958A

    公开(公告)日:1996-07-16

    申请号:US433883

    申请日:1995-05-02

    摘要: A semiconductor device is presented having an improved high voltage protection scheme that comprises an integrated Schottky diode (28) in conjunction with a plurality of back to back diodes (29) to limit a voltage potential that may arise between the gate (26) and drain terminals (27) of a semiconductor device. A second embodiment comprises a contact region (43) connected to a plurality of back to back diodes (46) configured so that some of the voltage is supported by the back to back diodes (46) and the remainder is supported by the substrate (39). These structures will support any excess voltage in the conduction mode, rather than the avalanche mode and may employ the use of a depletion region (51) to support a blocking voltage.

    摘要翻译: 提出了具有改进的高电压保护方案的半导体器件,其包括与多个背对背二极管(29)结合的集成肖特基二极管(28),以限制可能在栅极(26)和漏极(26)之间产生的电压电位 端子(27)。 第二实施例包括连接到多个背对背二极管(46)的接触区域(43),其被配置成使得一些电压由背对背二极管(46)支撑,其余部分由衬底(39)支撑 )。 这些结构将支持导通模式中的任何过电压而不是雪崩模式,并且可以使用耗尽区(51)来支持阻断电压。

    Semiconductor device having high energy sustaining capability and a
temperature compensated sustaining voltage
    7.
    发明授权
    Semiconductor device having high energy sustaining capability and a temperature compensated sustaining voltage 失效
    具有高能量维持能力和温度补偿维持电压的半导体器件

    公开(公告)号:US5365099A

    公开(公告)日:1994-11-15

    申请号:US202856

    申请日:1994-02-25

    摘要: A semiconductor device having an improved protection scheme and a temperature compensated sustaining voltage is provided by integrating a plurality of temperature compensated voltage reference diodes between the drain and the gate of the semiconductor device. The diodes protect the device by clamping the device's sustaining voltage to the total avalanche voltage of the diode. The device will dissipate any excessive energy in the conduction mode rather than in the more stressful avalanche mode. In addition, the plurality of diodes will provide for a temperature compensated sustaining voltage of the semiconductor device. The plurality of diodes are formed back-to-back in polysilicon. The positive temperature coefficient of the avalanching junction of each diode pair is compensated for by the negative temperature coefficient of the forward biased junction.

    摘要翻译: 通过在半导体器件的漏极和栅极之间集成多个温度补偿电压参考二极管来提供具有改进的保护方案和温度补偿维持电压的半导体器件。 二极管通过将器件的维持电压钳位到二极管的总雪崩电压来保护器件。 该装置将在导通模式中消耗任何过多的能量,而不是在更紧张的雪崩模式下消耗。 此外,多个二极管将提供半导体器件的温度补偿维持电压。 在多晶硅中背对背地形成多个二极管。 每个二极管对的雪崩结的正温度系数由正向偏置结的负温度系数补偿。

    Method of making high voltage vertical field effect transistor with
improved safe operating area
    8.
    发明授权
    Method of making high voltage vertical field effect transistor with improved safe operating area 失效
    制造高电压垂直场效应晶体管的方法,改善安全工作面积

    公开(公告)号:US4970173A

    公开(公告)日:1990-11-13

    申请号:US489853

    申请日:1990-03-02

    申请人: Stephen P. Robb

    发明人: Stephen P. Robb

    摘要: A vertical field effect transistor having a first low resistivity region which determines breakdown voltage and a second low resistively region which is formed underneath a portion of a source is provided. The second low resistivity region lowers the gain of a parasitic bipolar transistor, and lowers resistance of a base region under the source of the field effect transistor, improving the commutating safe operating area of the vertical field effect transistor.

    摘要翻译: 提供了具有确定击穿电压的第一低电阻率区域和形成在源的一部分下方的第二低电阻区域的垂直场效应晶体管。 第二低电阻率区域降低寄生双极晶体管的增益,并降低场效应晶体管源极下的基极区域的电阻,从而改善垂直场效应晶体管的整流安全工作面积。

    Microprocessor layout minimizing temperature and current effects
    9.
    发明授权
    Microprocessor layout minimizing temperature and current effects 失效
    微处理器布局使温度和电流效果最小化

    公开(公告)号:US4924111A

    公开(公告)日:1990-05-08

    申请号:US263746

    申请日:1988-10-31

    IPC分类号: H01L27/02 H03K17/14

    摘要: An integrated circuit having a microprocessor core interfaced to large power transistors is described. This integrated circuit provides the capability to intelligently control and drive loads requiring currents exceeding 250 milli amps. The large power transistors are built in a technology compatible with the microprocessor core technology resulting in a more readily manufacturable circuit. The microprocessor core is layed out in a manner which provides the greatest distance between the most heat sensitive microprocessor core circuits and the power devices. On chip temperature sensing and feedback is provided for junction temperature monitoring and control.

    摘要翻译: 描述了具有与大功率晶体管连接的微处理器核心的集成电路。 该集成电路提供智能控制和驱动需要电流超过250毫安的负载的能力。 大功率晶体管内置于与微处理器核心技术相兼容的技术,从而形成更容易制造的电路。 微处理器内核以最热敏微处理器核心电路和功率器件之间提供最大距离的方式布置。 提供片上温度检测和反馈,用于结温监测和控制。

    FET structure arrangement having low on resistance
    10.
    发明授权
    FET structure arrangement having low on resistance 失效
    具有低导通电阻的FET结构布置

    公开(公告)号:US4775879A

    公开(公告)日:1988-10-04

    申请号:US027366

    申请日:1987-03-18

    IPC分类号: H01L29/06 H01L29/78 H01L27/02

    CPC分类号: H01L29/7802 H01L29/0696

    摘要: A vertical field effect transistor is provided which has its sources arranged in a pattern to essentially eliminate inactive common drain area between the sources. The preferred arrangement is to use rectangular source areas to form columns and rows in the arrangement. Every other row is shifted so that a source in a shifted row is positioned between sources in an adjacent row. The rows are then spaced closer together thereby achieving the substantial elimination of inactive drain area. The elimination of inactive drain area results in low on resistance during the conductive state of the vertical field effect transistor.