Manufacturing method of light emitting diode including current spreading layer
    2.
    发明授权
    Manufacturing method of light emitting diode including current spreading layer 有权
    包括电流扩展层的发光二极管的制造方法

    公开(公告)号:US07998771B2

    公开(公告)日:2011-08-16

    申请号:US12446635

    申请日:2007-11-26

    申请人: Sung Bum Bae

    发明人: Sung Bum Bae

    IPC分类号: H01L21/00

    摘要: Provided is a method of manufacturing a light emitting diode using a nitride semiconductor, which including the steps of: forming n- and p-type current spreading layers using a hetero-junction structure; forming trenches by dry-etching the n- and p-type current spreading layers; forming an n-type metal electrode layer in the trench of the n-type current spreading layer; forming a p-type metal electrode layer in the trench of the p-type current spreading layer; and forming a transparent electrode layer on the p-type metal electrode layer, thereby improving current spreading characteristics as compared with the conventional method of manufacturing the light emitting diode, and enhancing operating characteristics of the light emitting diode.

    摘要翻译: 提供一种使用氮化物半导体制造发光二极管的方法,其包括以下步骤:使用异质结结构形成n型和p型电流扩散层; 通过干蚀刻n型和p型电流扩展层形成沟槽; 在n型电流扩展层的沟槽中形成n型金属电极层; 在p型电流扩散层的沟槽中形成p型金属电极层; 在p型金属电极层上形成透明电极层,与传统的发光二极管的制造方法相比,提高了电流扩散特性,提高了发光二极管的工作特性。

    Power semiconductor device and fabrication method thereof
    3.
    发明授权
    Power semiconductor device and fabrication method thereof 失效
    功率半导体器件及其制造方法

    公开(公告)号:US08772833B2

    公开(公告)日:2014-07-08

    申请号:US13592560

    申请日:2012-08-23

    IPC分类号: H01L29/15

    摘要: Disclosed are a power semiconductor device and a method of fabricating the same which can increase a breakdown voltage of the device through a field plate formed between a gate electrode and a drain electrode and achieve an easier manufacturing process at the same time. The power semiconductor device according to an exemplary embodiment of the present disclosure includes a source electrode and a drain electrode formed on a substrate; a dielectric layer formed between the source electrode and the drain electrode to have a lower height than heights of the two electrodes and including an etched part exposing the substrate; a gate electrode formed on the etched part; a field plate formed on the dielectric layer between the gate electrode and the drain electrode; and a metal configured to connect the field plate and the source electrode.

    摘要翻译: 公开了功率半导体器件及其制造方法,其可以通过形成在栅电极和漏电极之间的场板来增加器件的击穿电压,并且同时实现更容易的制造工艺。 根据本公开的示例性实施例的功率半导体器件包括形成在衬底上的源电极和漏电极; 形成在所述源电极和所述漏电极之间的电介质层具有比所述两个电极的高度低的高度,并且包括暴露所述衬底的蚀刻部分; 形成在蚀刻部分上的栅电极; 形成在栅电极和漏电极之间的电介质层上的场板; 以及配置成连接场板和源电极的金属。

    FIELD EFFECT TRANSISTOR AND FABRICATION METHOD THEREOF
    4.
    发明申请
    FIELD EFFECT TRANSISTOR AND FABRICATION METHOD THEREOF 审中-公开
    场效应晶体管及其制造方法

    公开(公告)号:US20130069127A1

    公开(公告)日:2013-03-21

    申请号:US13556377

    申请日:2012-07-24

    IPC分类号: H01L29/78 H01L21/20

    摘要: A method for fabricating a field effect transistor according to an exemplary embodiment of the present disclosure includes: forming an active layer, a cap layer, an ohmic metal layer and an insulating layer on a substrate; forming multilayered photoresists on the insulating layer; patterning the multilayered photoresists to form a photoresist pattern including a first opening for gate electrode and a second opening for field electrode; etching the insulating layer by using the photoresist pattern as an etching mask so that the insulating layer in the first opening is etched more deeply and the cap layer is exposed through the first opening; etching the cap layer exposed by etching the insulating layer through the first opening to form a gate recess region; and depositing a metal on the gate recess region and the etched insulating layer to form a gate-field electrode layer.

    摘要翻译: 根据本公开的示例性实施例的制造场效应晶体管的方法包括:在衬底上形成有源层,覆盖层,欧姆金属层和绝缘层; 在所述绝缘层上形成多层光致抗蚀剂; 图案化多层光致抗蚀剂以形成包括用于栅电极的第一开口和场电极的第二开口的光致抗蚀剂图案; 通过使用光致抗蚀剂图案作为蚀刻掩模来蚀刻绝缘层,使得第一开口中的绝缘层被更深地蚀刻并且盖层通过第一开口暴露; 通过蚀刻绝缘层通过第一开口蚀刻暴露的盖层,以形成栅极凹陷区域; 以及在所述栅极凹部区域和所述蚀刻绝缘层上沉积金属以形成栅极电极层。

    Nitride semiconductor-based light emitting devices
    5.
    发明授权
    Nitride semiconductor-based light emitting devices 失效
    氮化物半导体基发光器件

    公开(公告)号:US07964882B2

    公开(公告)日:2011-06-21

    申请号:US12446513

    申请日:2007-10-02

    IPC分类号: H01L33/00

    CPC分类号: H01L33/06 H01L33/18 H01L33/32

    摘要: A nitride semiconductor-based light emitting device is provided. The nitride semiconductor-based light emitting device is formed of a nitride semiconductor having a wurtzite lattice structure with the Ga face. The device has a substrate, a buffer layer, a first p-type contact layer, a second p-type contact layer, a first hole diffusion layer, a second hole diffusion layer, a light emitting active region, a second electron diffusion layer, a first electron diffusion layer, a second n-type contact layer and a first n-type contact layer, which are sequentially stacked. Such a structure may effectively employ quasi-two-dimensional free electron and free hole gases formed at heterojunction interfaces due to the spontaneous polarization and the piezoelectric polarization in the wurtzite lattice structure with the Ga face, and thus enhances the emission uniformity and emission efficiency of the light emitting device.

    摘要翻译: 提供了一种基于氮化物半导体的发光器件。 基于氮化物半导体的发光器件由具有Ga面的纤锌矿晶格结构的氮化物半导体形成。 该器件具有衬底,缓冲层,第一p型接触层,第二p型接触层,第一孔扩散层,第二孔扩散层,发光有源区,第二电子扩散层, 第一电子扩散层,第二n型接触层和第一n型接触层。 这种结构可以由于自发极化和在具有Ga面的纤锌矿晶格结构中的压电极化而在异质界面处形成的准二维自由电子和自由空穴气体,从而提高了发射均匀性和发射效率 发光装置。

    MANUFACTURING METHOD OF LIGHT EMITTING DIODE INCLUDING CURRENT SPREADING LAYER
    6.
    发明申请
    MANUFACTURING METHOD OF LIGHT EMITTING DIODE INCLUDING CURRENT SPREADING LAYER 有权
    发光二极管包括电流传播层的制造方法

    公开(公告)号:US20100240162A1

    公开(公告)日:2010-09-23

    申请号:US12446635

    申请日:2007-11-26

    申请人: Sung Bum Bae

    发明人: Sung Bum Bae

    IPC分类号: H01L33/00

    摘要: Provided is a method of manufacturing a light emitting diode using a nitride semiconductor, which including the steps of: forming n- and p-type current spreading layers using a hetero-junction structure; forming trenches by dry-etching the n- and p-type current spreading layers; forming an n-type metal electrode layer in the trench of the n-type current spreading layer; forming a p-type metal electrode layer in the trench of the p-type current spreading layer; and forming a transparent electrode layer on the p-type metal electrode layer, thereby improving current spreading characteristics as compared with the conventional method of manufacturing the light emitting diode, and enhancing operating characteristics of the light emitting diode.

    摘要翻译: 提供一种使用氮化物半导体制造发光二极管的方法,其包括以下步骤:使用异质结结构形成n型和p型电流扩散层; 通过干蚀刻n型和p型电流扩展层形成沟槽; 在n型电流扩展层的沟槽中形成n型金属电极层; 在p型电流扩散层的沟槽中形成p型金属电极层; 在p型金属电极层上形成透明电极层,与传统的发光二极管的制造方法相比,提高了电流扩散特性,提高了发光二极管的工作特性。

    Galium-nitride light emitting device having a microarray-type structure
    7.
    发明授权
    Galium-nitride light emitting device having a microarray-type structure 有权
    具有微阵列型结构的氮化镓发光器件

    公开(公告)号:US09041012B2

    公开(公告)日:2015-05-26

    申请号:US13473561

    申请日:2012-05-16

    申请人: Sung Bum Bae

    发明人: Sung Bum Bae

    IPC分类号: H01L33/40 H01L33/38 H01L33/42

    CPC分类号: H01L33/387 H01L33/42

    摘要: A microarray-type nitride light emitting device includes a light emitting semiconductor layer; and a multilayered transparent contact layer to divide a plane of the light emitting semiconductor layer into a plurality of microarray-type light emitting regions and a plurality of connect-divided light emitting regions. The multilayered transparent contact layer includes a first transparent contact layer that is composed of a material having a resistance value which is heat determinable, and that divides the plane of the light emitting semiconductor layer into the plurality of microarray-type light emitting regions; a transparent resistor layer that is defined within the first transparent contact layer, that is composed of the material having a resistance value which is heat determinable and has a resistance that is higher than that of the first transparent contact layer; and a second transparent contact layer to connect the plurality of microarray-type light emitting regions.

    摘要翻译: 微阵列型氮化物发光器件包括发光半导体层; 以及将发光半导体层的平面分割为多个微阵列型发光区域和多个连接分割发光区域的多层透明接触层。 多层透明接触层包括第一透明接触层,其由具有热可确定性的电阻值的材料构成,并且将发光半导体层的平面划分成多个微阵列型发光区域; 限定在第一透明接触层内的透明电阻层,其由具有热可确定性并具有比第一透明接触层的电阻高的电阻值的材料构成; 以及第二透明接触层,以连接所述多个微阵列型发光区域。

    NITRIDE SEMICONDUCTOR-BASED LIGHT EMITTING DEVICES
    8.
    发明申请
    NITRIDE SEMICONDUCTOR-BASED LIGHT EMITTING DEVICES 失效
    基于氮化物半导体的发光器件

    公开(公告)号:US20100187494A1

    公开(公告)日:2010-07-29

    申请号:US12446513

    申请日:2007-10-02

    IPC分类号: H01L33/00

    CPC分类号: H01L33/06 H01L33/18 H01L33/32

    摘要: A nitride semiconductor-based light emitting device is provided. The nitride semiconductor-based light emitting device is formed of a nitride semiconductor having a wurtzite lattice structure with the Ga face. The device has a substrate, a buffer layer, a first p-type contact layer, a second p-type contact layer, a first hole diffusion layer, a second hole diffusion layer, a light emitting active region, a second electron diffusion layer, a first electron a first n-type contact layer, which are sequentially stacked. Such a structure may effectively employ quasi-two-dimensional free electron and free hole gases formed at heterojunction interfaces due to the spontaneous polarization and the piezoelectric polarization in the wurtzite lattice structure with the Ga face, and thus enhances the emission uniformity and emission efficiency of the light emitting device.

    摘要翻译: 提供了一种基于氮化物半导体的发光器件。 基于氮化物半导体的发光器件由具有Ga面的纤锌矿晶格结构的氮化物半导体形成。 该器件具有衬底,缓冲层,第一p型接触层,第二p型接触层,第一孔扩散层,第二孔扩散层,发光有源区,第二电子扩散层, 第一电子,第一n型接触层,其顺序堆叠。 这种结构可以由于自发极化和在具有Ga面的纤锌矿晶格结构中的压电极化而在异质界面处形成的准二维自由电子和自由空穴气体,从而提高了发射均匀性和发射效率 发光装置。