摘要:
A semiconductor package includes a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern, The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region.
摘要:
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.
摘要:
A method and a 3D display apparatus for processing a stereoscopic image signal in high rate by software while using a least number of hardware components in a portable 3D display apparatus based on a mobile Android platform are provided. This method is suitable for a portable terminal apparatus equipped with a kernel layer directly controlling hardware means including a display panel, and an application/middleware layer controlling the kernel layer to display a motion picture through the hardware means. One or more plane image surfaces are first generated from the application/middleware layer and stored in a first frame buffer. An encoded image signal is decoded under the application/middleware layer to restore a YUV image signal representing a stereoscopic image pair. Subsequently, the YUV image signal is converted into an RGB image signal, and left and right images of the RGB image signal are mixed at the kernel layer.
摘要:
A semiconductor chip has one or more peripheral bond pads. The semiconductor chip comprises a semiconductor substrate having a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on at least a part of the peripheral region of the semiconductor substrate. A passivation layer is formed on the bond pad-wiring pattern and exposed portions of the semiconductor substrate; a pad-rearrangement pattern disposed over the passivation layer and electrically connected to the bond pad-wiring pattern; and an insulating layer formed over the pad-rearrangement pattern. The insulating layer has an opening therein that exposes a portion of the pad-rearrangement pattern to define a bond pad. The bond pad is disposed over at least a part of the cell region.
摘要:
A method for searching patent documents by applying degree of similarity and a system thereof are disclosed. The method for searching patent documents by applying degree of similarity comprises receiving at least one search keyword from a user of the service; searching a document previously stored in a database, by the search keyword; and evaluating a degree of similarity to the search keyword on the document that is searched by the search keyword, wherein the degree of similarity is evaluated by measuring at least one degree among a degree of appearance frequency of the search keyword in the document, a degree of proximity between the search keywords, and a degree of word order between the search keywords. Therefore, patent documents may be searched by arranging the documents according to a degree of similarity to a search keyword, and not according to whether the keyword is included in the patent documents.
摘要:
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.
摘要:
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.
摘要:
The multi functional cleaning module comprises a plurality of air curtain, an eximer ultraviolet light irradiating device, a brush, a high-speed shower device, and an air knife, where they are arranged continually on a plan and the glass substrates are inserted continually into them. The cleaning apparatus using the multi functional cleaning module comprises a driving part having a loading and an unloading portions as well as the multi functional cleaning module.
摘要:
A method for fabricating a field effect transistor according to an exemplary embodiment of the present disclosure includes: forming an active layer, a cap layer, an ohmic metal layer and an insulating layer on a substrate; forming multilayered photoresists on the insulating layer; patterning the multilayered photoresists to form a photoresist pattern including a first opening for gate electrode and a second opening for field electrode; etching the insulating layer by using the photoresist pattern as an etching mask so that the insulating layer in the first opening is etched more deeply and the cap layer is exposed through the first opening; etching the cap layer exposed by etching the insulating layer through the first opening to form a gate recess region; and depositing a metal on the gate recess region and the etched insulating layer to form a gate-field electrode layer.
摘要:
A method of etching and cleaning objects contained in a vessel, includes etching the objects by providing etching solution into the vessel, forcing out the etching solution from the vessel by providing pressurized gas into the vessel; cleaning the objects by providing cleaning solution into the vessel; and draining the cleaning solution from the vessel. By forcing out the etching solution with a pressurized gas such as nitrogen gas, there is no density difference of the etching solution in contact with the objects, leading to uniform etching of the objects.