Capacitor having a dielectric layer that reduces leakage current and a method of manufacturing the same
    1.
    发明授权
    Capacitor having a dielectric layer that reduces leakage current and a method of manufacturing the same 有权
    具有减小漏电流的电介质层的电容器及其制造方法

    公开(公告)号:US07352022B2

    公开(公告)日:2008-04-01

    申请号:US11207740

    申请日:2005-08-22

    IPC分类号: H01L27/108

    CPC分类号: H01L28/65 H01L28/40

    摘要: A capacitor having a dielectric layer including a composite oxide, the composite oxide including a transition metal and including a lanthanide group element, a memory device including the same and a method of manufacturing the capacitor are provided. The transition metal may be titanium and the composite oxide may be nitrided. The method may include providing a precursor of a transition metal, providing a precursor of a lanthanide group element, and forming a composite oxide on the lower electrode by oxidizing both the precursor of the transition metal and the precursor of the lanthanide group element, the composite oxide containing the transition metal and the lanthanide group element.

    摘要翻译: 提供具有包括复合氧化物的电介质层的电容器,包含过渡金属并且包括镧系元素元素的复合氧化物,包括其的存储装置和制造电容器的方法。 过渡金属可以是钛,并且复合氧化物可以被氮化。 该方法可以包括提供过渡金属的前体,提供镧系元素元素的前体,以及通过氧化过渡金属的前体和镧系元素前体的复合氧化物,形成复合氧化物,复合材料 含有过渡金属和镧系元素的氧化物。

    Ti precursor, method of preparing the same, method of preparing Ti-containing thin layer by employing the Ti precursor and Ti-containing thin layer
    9.
    发明授权
    Ti precursor, method of preparing the same, method of preparing Ti-containing thin layer by employing the Ti precursor and Ti-containing thin layer 有权
    Ti前体,其制备方法,采用Ti前体和含Ti薄层制备含Ti薄层的方法

    公开(公告)号:US07491347B2

    公开(公告)日:2009-02-17

    申请号:US11282486

    申请日:2005-11-21

    IPC分类号: H01B1/06 H01B1/02 C22C14/00

    摘要: A Ti-precursor for forming a Ti-containing thin layer represented by the formula I below, a method of preparing the same, a method of preparing a Ti-containing thin layer by employing the Ti-precursor and the Ti-containing thin layer are provided: wherein X1 and X2 are independently F, Cl, Br or I; n is 0, 1, 2, 3, 4 or 5; m is 0, 1, 2, 3, 4, 5, 6 or 7; and R1 and R2 are independently a linear or branched C1-10 alkyl group. The Ti precursor for forming the Ti-containing thin layer can be deposited at a deposition temperature of approximately 150° C.˜200° C., and a Ti-containing thin layer with a high performance character can be prepared.

    摘要翻译: 用于形成由下式I表示的含Ti薄层的Ti前体,其制备方法,通过使用Ti前体和含Ti薄层制备含Ti薄层的方法是 其中X1和X2独立地为F,Cl,Br或I; n为0,1,2,3,4或5; m为0,1,2,3,4,5,6或7; 并且R 1和R 2独立地为直链或支链C 1-10烷基。 用于形成含Ti薄层的Ti前体可以在约150℃〜200℃的沉积温度下沉积,并且可以制备具有高性能特征的含钛薄层。

    Ti precursor, method of preparing the same, method of preparing Ti-containing thin layer by employing the Ti precursor and Ti-containing thin layer
    10.
    发明申请
    Ti precursor, method of preparing the same, method of preparing Ti-containing thin layer by employing the Ti precursor and Ti-containing thin layer 有权
    Ti前体,其制备方法,采用Ti前体和含Ti薄层制备含Ti薄层的方法

    公开(公告)号:US20060157861A1

    公开(公告)日:2006-07-20

    申请号:US11282486

    申请日:2005-11-21

    IPC分类号: H01L21/44 H01L23/48

    摘要: A Ti-precursor for forming a Ti-containing thin layer represented by the formula I below, a method of preparing the same, a method of preparing a Ti-containing thin layer by employing the Ti-precursor and the Ti-containing thin layer are provided: wherein X1 and X2 are independently F, Cl, Br or I; n is 0, 1, 2, 3, 4 or 5; m is 0, 1, 2, 3, 4, 5, 6 or 7; and R1 and R2 are independently a linear or branched C1-10 alkyl group. The Ti precursor for forming the Ti-containing thin layer can be deposited at a deposition temperature of approximately 150° C.˜200° C., and a Ti-containing thin layer with a high performance character can be prepared.

    摘要翻译: 用于形成由下式I表示的含Ti薄层的Ti前体,其制备方法,通过使用Ti前体和含Ti薄层制备含Ti薄层的方法是 其中X 1和X 2各自独立地为F,Cl,Br或I; n为0,1,2,3,4或5; m为0,1,2,3,4,5,6或7; R 1和R 2分别独立地为直链或支链C 1-10烷基。 用于形成含Ti薄层的Ti前体可以在约150℃〜200℃的沉积温度下沉积,并且可以制备具有高性能特征的含钛薄层。