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    Substrate inspection device and substrate inspection method
    1.
    发明授权
    Substrate inspection device and substrate inspection method 有权
    基板检查装置和基板检查方法

    公开(公告)号：US07830502B2

    公开(公告)日：2010-11-09

    申请号：US12540825

    申请日：2009-08-13

    申请人： Susumu Iwai ,  Noboru Kato

    发明人： Susumu Iwai ,  Noboru Kato

    IPC分类号： G01N21/88

    CPC分类号： G01N21/896

    摘要： A substrate inspection method includes the following steps. Substrates are sequentially moved while an optical system including a light-projecting system and a light-receiving system are moved in a direction orthogonal to the moving direction of each substrate, so as to change the scanned area of each substrate which is scanned with an inspection light having a specific width in the direction orthogonal to the moving direction of the substrate from the light-projecting system; data of the inspected defects of the substrates in the scanned areas are stored for each scanned area; and the stored data of the defects of the substrates in the scanned areas are updated with newly inspected data of the defects of the substrates in the same scanned areas for each substrate, and defect data of one substrate are produced based on the data of the defects of the substrates in a plurality of scanned areas.

    摘要翻译： 基板检查方法包括以下步骤。 基板依次移动，同时包括投光系统和光接收系统的光学系统在与每个基板的移动方向正交的方向上移动，以便通过检查来改变扫描的每个基板的扫描区域 光从与投影系统的基板的移动方向正交的方向上具有特定宽度的光; 对于每个扫描区域存储扫描区域中的基板的检查缺陷的数据; 并且利用对每个基板的相同扫描区域中的基板的缺陷的新检查数据更新存储的扫描区域中的基板的缺陷数据，并且基于缺陷的数据产生一个基板的缺陷数据 的多个扫描区域中的基板。

    SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD
    2.
    发明申请
    SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD 有权
    基板检查装置和基板检查方法

    公开(公告)号：US20100060889A1

    公开(公告)日：2010-03-11

    申请号：US12540825

    申请日：2009-08-13

    申请人： Susumu Iwai ,  Noboru Kato

    发明人： Susumu Iwai ,  Noboru Kato

    IPC分类号： G01N21/88

    CPC分类号： G01N21/896

    摘要： A substrate inspection method includes the following steps. Substrates are sequentially moved while an optical system including a light-projecting system and a light-receiving system are moved in a direction orthogonal to the moving direction of each substrate, so as to change the scanned area of each substrate which is scanned with an inspection light having a specific width in the direction orthogonal to the moving direction of the substrate from the light-projecting system; data of the inspected defects of the substrates in the scanned areas are stored for each scanned area; and the stored data of the defects of the substrates in the scanned areas are updated with newly inspected data of the defects of the substrates in the same scanned areas for each substrate, and defect data of one substrate are produced based on the data of the defects of the substrates in a plurality of scanned areas.

    摘要翻译： 基板检查方法包括以下步骤。 基板依次移动，同时包括投光系统和光接收系统的光学系统在与每个基板的移动方向正交的方向上移动，以便通过检查来改变扫描的每个基板的扫描区域 光从与投影系统的基板的移动方向正交的方向上具有特定宽度的光; 对于每个扫描区域存储扫描区域中的基板的检查缺陷的数据; 并且利用对每个基板的相同扫描区域中的基板的缺陷的新检查数据更新存储的扫描区域中的基板的缺陷数据，并且基于缺陷的数据产生一个基板的缺陷数据 的多个扫描区域中的基板。

    Antenna module
    3.
    发明授权
    Antenna module 有权

    公开(公告)号：US09705194B2

    公开(公告)日：2017-07-11

    申请号：US13368358

    申请日：2012-02-08

    申请人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino ,  Katsumi Taniguchi

    发明人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino ,  Katsumi Taniguchi

    IPC分类号： H01Q9/04

    CPC分类号： H01Q9/0407

    摘要： In an antenna module, a main portion includes a plurality of insulating sheets made of a flexible material and laminated on each other. An antenna configured to transmit/receive a high-frequency signal is disposed in the main portion. A connection portion is disposed in the main portion and is connected to an electronic device that inputs/outputs the high-frequency signal. A signal transmission line is disposed in the main portion and has a strip line structure or a microstrip line structure to transmit the high-frequency signal. An impedance matching circuit is disposed in the main portion and between the antenna and end of a signal transmission line facing in a negative x direction. An impedance matching circuit is disposed in the main portion and between the connection portion and an end of the signal transmission line facing in a positive x direction.

    Radio frequency IC device and radio communication system
    5.
    发明授权
    Radio frequency IC device and radio communication system 有权
    射频IC设备和无线电通信系统

    公开(公告)号：US08797148B2

    公开(公告)日：2014-08-05

    申请号：US12859340

    申请日：2010-08-19

    申请人： Noboru Kato ,  Nobuo Ikemoto

    发明人： Noboru Kato ,  Nobuo Ikemoto

    IPC分类号： G08C17/02 ,  G06K19/077

    CPC分类号： G06K19/07749 ,  G06K19/07767 ,  G06K19/07777 ,  G06K19/07786 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01Q1/2208 ,  H01Q1/2216 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q9/16 ,  H01Q9/24 ,  H01Q23/00 ,  H01L2224/0401

    摘要： A radio frequency IC device achieves impedance matching between a radio IC chip and a radiation plate in a wide frequency band, and achieves desired radiation characteristics over a wide range of frequencies. A radio frequency IC device and a radio communication system allow both long-distance and short-distance communication and, in particular, allow short-distance communication using a small amount of energy. The radio frequency IC device includes an electromagnetic coupling module including a radio IC chip and a feed circuit board, and a radiation plate. An annular electrode is arranged to be coupled to both a feed circuit of the electromagnetic coupling module and the radiation plate. The radiation plate defines an electric-field radiation plate for long-distance communication, while the annular electrode defines a magnetic-field radiation plate for short-distance communication. The feed circuit board may be removed, so that the radio IC chip is coupled to the annular electrode directly or with an interposer disposed therebetween.

    摘要翻译： 射频IC器件在宽频带中实现无线IC芯片与辐射板之间的阻抗匹配，并且在宽的频率范围内实现期望的辐射特性。 无线电频率IC设备和无线电通信系统允许远程和短距离通信，并且特别地允许使用少量能量的短距离通信。 射频IC器件包括具有无线IC芯片和馈电电路基板的电磁耦合模块和辐射板。 环形电极被布置成耦合到电磁耦合模块的馈电电路和辐射板。 辐射板限定了用于长距离通信的电场辐射板，而环形电极限定了用于短距离通信的磁场辐射板。 馈电电路板可以被去除，使得无线电IC芯片直接耦合到环形电极或者设置在它们之间的插入器。

    Antenna and wireless IC device
    6.
    发明授权
    Antenna and wireless IC device 有权
    天线和无线IC器件

    公开(公告)号：US08692718B2

    公开(公告)日：2014-04-08

    申请号：US13083626

    申请日：2011-04-11

    申请人： Noboru Kato ,  Yuya Dokai

    发明人： Noboru Kato ,  Yuya Dokai

    IPC分类号： H01Q1/38

    CPC分类号： H01Q9/045 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01Q1/2283 ,  H01Q1/36 ,  H01Q1/40 ,  H01Q7/00

    摘要： An antenna and a wireless IC device that includes the antenna are provided for which the manufacturing process is simple and for which there is a low probability of a poor connection occurring between a feeder portion and a radiation electrode. An antenna includes a radiation electrode that is provided on a main surface of an insulator board, a ground electrode and/or a counter electrode that is arranged so as to oppose the radiation electrode, and a magnetic field electrode that is connected to the radiation electrode through a connection portion. The magnetic field electrode is defined by line-shaped electrodes and feeds a signal to the radiation electrode from a feeder portion defined by ends of the line-shaped electrodes through the magnetic field electrode.

    摘要翻译： 提供了包括天线的天线和无线IC器件，其制造过程简单，并且在馈电部分和辐射电极之间出现差的连接的可能性很低。 天线包括设置在绝缘体板的主表面上的辐射电极，与辐射电极相对配置的接地电极和/或对电极，以及连接到辐射电极的磁场电极 通过连接部分。 磁场电极由线状电极限定，并且通过磁场电极从由线状电极的端部限定的馈电部分向辐射电极馈送信号。

    Wireless IC device
    8.
    发明授权
    Wireless IC device 有权
    无线IC设备

    公开(公告)号：US08668151B2

    公开(公告)日：2014-03-11

    申请号：US12859880

    申请日：2010-08-20

    申请人： Noboru Kato ,  Satoshi Ishino

    发明人： Noboru Kato ,  Satoshi Ishino

    IPC分类号： G06K19/06

    CPC分类号： H01Q1/2225 ,  H01F17/0013 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/181 ,  H01Q1/2283 ,  H01Q1/50 ,  H01Q7/00 ,  H01Q21/29 ,  H05K1/0239 ,  H05K1/0243 ,  H05K3/305 ,  H05K2201/10098 ,  H05K2201/10727 ,  H01L2924/00012 ,  H01L2224/0401

    摘要： A wireless IC device improves radiation characteristics or directivity of signals and reliably communicates with a reader/writer. The wireless IC device includes an electromagnetically coupled module includes a wireless IC device and a feed circuit substrate, a protective layer, a first radiation plate, and a second radiation plate. The feed circuit substrate includes a feed circuit including inductance elements. The feed circuit is electrically connected to the wireless IC chip and coupled to the radiation plates. Signals received by the radiation plates are provided to the wireless IC chip via the feed circuit. Signals from the wireless IC chip are provided to the radiation plates via the feed circuit and then radiated to the outside.

    摘要翻译： 无线IC器件提高信号的辐射特性或方向性，并可靠地与读/写器通信。 无线IC器件包括电磁耦合模块，其包括无线IC器件和馈电电路衬底，保护层，第一辐射板和第二辐射板。 馈电电路基板包括包括电感元件的馈电电路。 馈电电路电连接到无线IC芯片并耦合到辐射板。 由辐射板接收的信号通过馈电电路提供给无线IC芯片。 来自无线IC芯片的信号通过馈电电路提供给辐射板，然后辐射到外部。

    Signal line and circuit substrate
    9.
    发明授权
    Signal line and circuit substrate 有权

    公开(公告)号：US08592687B2

    公开(公告)日：2013-11-26

    申请号：US13343740

    申请日：2012-01-05

    申请人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino

    发明人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0298 ,  H01P3/081 ,  H01P3/088 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/028 ,  H05K2201/0715 ,  H05K2201/09618

    摘要： A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.

    Wireless IC device
    10.
    发明授权
    Wireless IC device 有权

    公开(公告)号：US08590797B2

    公开(公告)日：2013-11-26

    申请号：US13585866

    申请日：2012-08-15

    申请人： Noboru Kato ,  Nobuo Ikemoto

    发明人： Noboru Kato ,  Nobuo Ikemoto

    IPC分类号： G06K19/06

    CPC分类号： G06K19/0775 ,  G06K19/0709 ,  G06K19/0723 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07781 ,  G06K19/07783 ,  G06K19/07784 ,  H01Q1/2225 ,  H01Q1/48 ,  H01Q7/00 ,  H05K1/0243 ,  H05K2201/10098

    摘要： A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.