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1.发明申请公开(公告)号：US20170108212A1
公开(公告)日：2017-04-20
申请号：US15127259
申请日：2015-03-23
申请人： TANAKA KIKINZOKU KOGYO K.K. , NATIONAL INSTITUTES FOR QUANTUM AND RADIOLOGICAL SCIENCE AND TECHNOLOGY
发明人： Yuusuke OHSHIMA , Hitoshi KUBO , Hirosi NOGUCHI , Junichi TANIUCHI , Yasunori IWAI , Katsumi SATO
CPC分类号： F23C13/08 , B01D53/86 , B01J23/44 , B01J27/13 , B01J29/0354 , B01J35/1019 , B01J35/1038 , B01J35/1042 , B01J35/1061 , B01J35/1066 , B01J37/0203 , B01J37/0207 , B01J37/0209 , B01J37/0236 , B01J37/08 , B01J37/18 , G21C9/06 , Y02E30/40
摘要： The hydrogen combustion catalyst includes a catalyst metal supported on a carrier made of an inorganic oxide, wherein: a functional group having at least one alkyl group with three or less carbon atoms is bonded to a terminal of a hydroxyl group on the carrier surface by substitution; platinum and palladium are supported as the catalyst metal; and a chlorine content is 300 ppm to 2,000 ppm per 1 mass % of the total supported amount of a supported amount of platinum and a supported amount of palladium. The total supported amount of platinum and palladium is preferably 0.1 to 5.0 mass % based on mass of a whole catalyst. In the hydrogen combustion catalyst according to the present invention, when treating a gas that contains iodine and hydrogen, catalyst poisoning by iodine is suppressed.
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公开(公告)号：US20160121404A1
公开(公告)日：2016-05-05
申请号：US14891725
申请日：2014-05-20
发明人： Yuichi MAKITA , Yuusuke OHSHIMA , Hidekazu MATSUDA , Noriaki NAKAMURA , Junichi TANIUCHI , Hitoshi KUBO
CPC分类号： B22F9/30 , B22F1/0018 , B22F2301/255 , B22F2304/054 , B22F2304/056 , B22F2999/00
摘要： The present invention provides a method for producing silver particles, the method capable of adjusting the particle diameter to be within the range of several tens of nanometers to several hundreds of nanometers and also producing silver particles with a uniform particle diameter. The present invention relates to a method for producing silver particles by heating of a reaction system containing a thermally-decomposable silver-amine complex precursor, including a process of producing a silver-amine complex, a process of adding an organic compound having an amide (carboxylic amide) as a skeleton to a reaction system, and a process of heating the reaction system, in which a water content in the reaction system before the heating is 20 to 100 parts by weight relative to 100 parts by weight of the silver compound. The present invention can produce uniform silver particles while the particle diameter is controlled.
摘要翻译： 本发明提供一种银颗粒的制造方法，该方法能够将粒径调整在数十纳米至数百纳米的范围内，并且还可以制造具有均匀粒径的银粒子。 本发明涉及通过加热含有热分解性银 - 胺络合物前体的反应体系来制造银颗粒的方法，包括制备银 - 胺络合物的方法，加入具有酰胺的有机化合物的方法（ 羧酸酰胺）作为反应体系的骨架，以及加热反应体系的方法，其中相对于100重量份的银化合物，加热前的反应体系中的水含量为20〜100重量份。 本发明可以在控制粒径的同时产生均匀的银颗粒。
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公开(公告)号：US20170256332A1
公开(公告)日：2017-09-07
申请号：US15506586
申请日：2015-08-19
IPC分类号： H01B5/14 , B05D1/32 , B05D3/06 , H05K3/10 , B05D7/24 , B05D3/00 , H01B1/22 , H05K1/09 , B05D1/42 , B05D7/04
CPC分类号： H01B5/14 , B05D1/32 , B05D1/42 , B05D3/007 , B05D3/063 , B05D5/12 , B05D7/04 , B05D7/24 , B32B15/082 , H01B1/00 , H01B1/22 , H01B13/00 , H05K1/09 , H05K3/10
摘要： The present invention provides a method for forming a metal pattern on a pattern formation section set in a part or the whole of a region on a base material, the base material including a fluorine-containing resin layer on a surface including at least the pattern formation section, the method including the step of: forming a functional group on a pattern formation section of the fluorine-containing resin layer by a treatment such as ultraviolet-ray irradiation, then applying to the surface of the base material a metal fine particle dispersion liquid in which metal fine particles protected by an amine compound as a first protective agent and a fatty acid as a second protective agent are dispersed in a solvent, and fixing the metal fine particles on the pattern formation section.
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公开(公告)号：US20220248538A1
公开(公告)日：2022-08-04
申请号：US17613569
申请日：2020-06-18
发明人： Kenjiro KOSHIJI , Yuichi MAKITA , Noriaki NAKAMURA , Masato KASUGA , Yuusuke OHSHIMA , Hiroki SATO , Shigeyuki OOTAKE , Hitoshi KUBO
摘要： The present invention relates to a method for forming a metal pattern on a pattern formation section set on a base material. In the present invention, a substrate provided with a fluorine-containing resin layer on a surface of the base material including the pattern formation section is used. The present inventive method for forming a metal pattern includes steps of: forming a functional group on the pattern formation section; and applying a metal ink including an amine compound and a fatty acid as protective agents to the base material surface to fix the metal particles on the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy measured by the Owens-Wendt method of 13 mN/m or more and 20 mN/m or less is applied as the fluorine-containing resin layer. Further, a metal ink including ethyl cellulose as an additive is applied as the metal ink.
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公开(公告)号：US20220015232A1
公开(公告)日：2022-01-13
申请号：US17294260
申请日：2019-11-13
发明人： Kenjiro KOSHIJI , Yuichi MAKITA , Noriaki NAKAMURA , Masato KASUGA , Yuusuke OHSHIMA , Hiroki SATO , Hitoshi KUBO
IPC分类号： H05K1/09 , C09D11/037 , H05K3/12 , H01B1/02
摘要： An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.
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6.发明申请METHOD FOR PRODUCING SILVER PARTICLES, AND SILVER PARTICLES PRODUCED BY SAID METHOD 审中-公开生产银颗粒的方法，以及通过方法生产的银颗粒公开(公告)号：US20160303659A1
公开(公告)日：2016-10-20
申请号：US15101859
申请日：2014-12-11
发明人： Yuichi MAKITA , Yuusuke OHSHIMA , Hidekazu MATSUDA , Junichi TANIUCHI , Noriaki NAKAMURA , Hitoshi KUBO
CPC分类号： B22F9/30 , B22F1/0003 , B22F1/0018 , B22F1/0062 , B22F2301/255 , B22F2304/054 , B22F2304/056 , B22F2998/10 , B82Y30/00 , B82Y40/00 , H01B1/02
摘要： The present invention provides a method for producing silver particles, including the steps of: mixing a thermally decomposable silver compound and an amine compound to prepare a silver-amine complex as a precursor; and heating the silver-amine complex at a heating temperature equal to or higher than the decomposition temperature of the silver-amine complex to precipitate silver particles, the silver compound being silver carbonate, the amine compound being terminated with a primary amino group on at least one end and containing a predetermined hydrocarbon group R with a carbon number of 4 to 10. In the method of the present invention, silver particles with the particle size controlled to fall within the range of 20 nm to 200 nm in terms of an average particle size can be produced.
摘要翻译： 本发明提供一种银粒子的制造方法，包括以下步骤：将可热分解的银化合物和胺化合物混合，制备作为前体的银 - 胺络合物; 并在银 - 胺络合物的分解温度以上的加热温度下加热银 - 胺络合物，沉淀银粒子，银化合物为碳酸银，至少在伯胺基上封端的胺化合物 一端并含有碳原子数为4〜10的规定的烃基R。在本发明的方法中，将粒径控制在20nm〜200nm范围内的银粒子平均粒子 尺寸可以生产。
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公开(公告)号：US20210324218A1
公开(公告)日：2021-10-21
申请号：US17272070
申请日：2019-08-15
发明人： Yuusuke OHSHIMA , Yuichi MAKITA , Hiroki SATO , Noriaki NAKAMURA , Kenjiro KOSHIJI , Masato KASUGA , Hitoshi KUBO
IPC分类号： C09D11/52 , C09D11/037
摘要： A silver ink including silver particles and a protective agent containing at least one amine compound dispersed in a dispersion medium containing, as a main solvent, a solvent having a vapor pressure at 20° C. of 40 mmHg or less and a vapor pressure at 70° C. of 0.09 mmHg or more, in an amount of 80% or more on a mass basis relative to the total dispersion medium. The amine compound has a mass average molecular weight of 115 or less, and the total amount of the amine compound is 1 part by weight or more and 14 parts by weight or less per 100 parts by weight of the silver particles. The silver ink has a moisture content of 500 ppm or more and 50,000 ppm or less and enables a practical metal film to be formed even through calcination at a low temperature of 70° C. or less.
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8.发明申请公开(公告)号：US20180193913A1
公开(公告)日：2018-07-12
申请号：US15741980
申请日：2016-08-23
发明人： Teruhisa IWAI , Yuichi MAKITA , Hidekazu MATSUDA , Hitoshi KUBO
IPC分类号： B22F1/00 , B22F9/30 , B23K35/30 , B23K35/02 , C08K3/08 , C08K5/17 , C08J3/20 , H01C7/00 , H01C17/065
CPC分类号： B22F1/0062 , B22F1/0018 , B22F1/0022 , B22F5/00 , B22F9/30 , B22F2301/255 , B23K35/025 , B23K35/3006 , C08J3/20 , C08J7/06 , C08J2301/28 , C08J2367/02 , C08K3/08 , C08K5/17 , C08K9/04 , C08K2003/0806 , C08K2201/005 , H01B1/22 , H01C7/003 , H01C17/06526 , H01C17/06586 , H05K1/092 , H05K3/1283
摘要： A metal paste formed by kneading a solid content including silver particles and a solvent, in which the solid content includes silver particles containing silver particles having a particle size of 100 to 200 nm by 30% or more based on the number of particles, the silver particles have an average particle size of 60 to 800 nm as a whole, the silver particles constituting the solid content are bound with an amine compound having 4 to 8 carbon atoms in total as a protective agent, and the metal paste contains as an additive a high-molecular-weight ethyl cellulose having a number average molecular weight of 40000 to 90000. Since the metal paste contains a high-molecular-weight ethyl cellulose, a sintered body having a low resistance can be maintained while printability is improved. The metal paste has favorable printability, and can form a sintered body having a low resistance even in a low temperature region of 150° C. or lower.
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公开(公告)号：US20160049350A1
公开(公告)日：2016-02-18
申请号：US14778684
申请日：2014-03-03
发明人： Kenji MATSUDA , Dai SHINOZAKI , Yuichi MAKITA , Hitoshi KUBO , Yusuke OHSHIMA , Hidekazu MATSUDA , Junichi TANIUCHI
IPC分类号： H01L23/367 , H05K7/20
CPC分类号： H01L23/367 , H01L23/34 , H01L23/36 , H01L23/373 , H01L23/3736 , H01L24/01 , H01L2924/0002 , H05K7/20409 , H01L2924/00
摘要： A semiconductor device includes a semiconductor chip which can be a heat-generating semiconductor chip or a semiconductor relay substrate in which an integrated circuit or wiring is built in. A sintered-silver-coated film is adhered on a surface layer part of the semiconductor substrate, interposed by a silicon oxide film. A heat-dissipating fin (heat sink), which may be copper or aluminum, is bonded on the sintered-silver-coated film, interposed by an adhesive layer.
摘要翻译： 半导体器件包括可以是其中内置集成电路或布线的发热半导体芯片或半导体继电器基板的半导体芯片。烧结银涂覆膜粘附在半导体衬底的表层部分上 ，由氧化硅膜插入。 可以由铜或铝构成的散热片（散热片）通过粘合剂层粘合在烧结银涂覆膜上。
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