-
公开(公告)号：US10354796B2
公开(公告)日：2019-07-16
申请号：US15840243
申请日：2017-12-13
Applicant: TDK Corporation
Inventor： Yuhei Horikawa , Makoto Orikasa , Yoshihiro Kanbayashi , Hisayuki Abe , Hirohumi Asou , Kosuke Kunitsuka
IPC: H01F41/04 , H01F41/10 , C25D13/22 , C23C18/16 , C25D13/12 , G06K19/077 , H01Q1/38 , H01Q1/36 , H01Q9/27 , H05K3/24 , H05K3/18 , C25D5/48 , H01Q1/48 , H01Q7/00
Abstract: Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.
-
2.发明授权公开(公告)号：US10968519B2
公开(公告)日：2021-04-06
申请号：US16046359
申请日：2018-07-26
Applicant: TDK CORPORATION
Inventor： Makoto Orikasa , Yuhei Horikawa , Yoshihiro Kanbayashi , Hisayuki Abe
IPC: C23C18/16 , C23C18/32 , C23C18/38 , B32B27/08 , B32B27/36 , B32B15/09 , B32B15/20 , B32B3/30 , H01L23/52 , H01L27/15 , B32B27/18 , C23C18/30 , H01L23/498 , C23F1/02 , H01L33/62 , H01L23/14 , H01L25/075
Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.
-
公开(公告)号：US10374301B2
公开(公告)日：2019-08-06
申请号：US15840192
申请日：2017-12-13
Applicant: TDK Corporation
Inventor： Yuhei Horikawa , Makoto Orikasa , Yoshihiro Kanbayashi , Hisayuki Abe , Hirohumi Asou , Kosuke Kunitsuka
Abstract: Disclosed herein is a wiring component that includes a base material and a planar coil pattern formed on the base material. The planar coil pattern includes a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion connected to the first connecting position; and a connection wiring portion that short-circuits the second connecting position and the third connecting position. A cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.
-
Patent Agency Ranking
4.发明授权公开(公告)号：US11668008B2
公开(公告)日：2023-06-06
申请号：US17111040
申请日：2020-12-03
Applicant: TDK CORPORATION
Inventor： Makoto Orikasa , Yuhei Horikawa , Yoshihiro Kanbayashi , Hisayuki Abe
IPC: B32B27/08 , B32B27/36 , B32B15/09 , B32B15/20 , B32B3/30 , H01L23/52 , H01L27/15 , B32B27/18 , H01L23/498 , H01L33/62 , H01L23/14 , H01L25/075 , C23C18/16 , C23C18/32 , C23C18/38 , C23C18/30 , C23F1/02
CPC classification number: C23C18/1641 , B32B3/30 , B32B15/09 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/36 , C23C18/161 , C23C18/1608 , C23C18/1651 , C23C18/30 , C23C18/32 , C23C18/38 , H01L23/52 , H01L27/156 , B32B2307/412 , B32B2457/20 , C23F1/02 , H01L23/145 , H01L23/498 , H01L25/0753 , H01L33/62
Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.
-
公开(公告)号：US20180175494A1
公开(公告)日：2018-06-21
申请号：US15840192
申请日：2017-12-13
Applicant: TDK Corporation
Inventor： Yuhei Horikawa , Makoto Orikasa , Yoshihiro Kanbayashi , Hisayuki Abe , Hirohumi Asou , Kosuke Kunitsuka
CPC classification number: H01Q1/38 , H01Q1/2208 , H01Q1/2225 , H01Q7/00 , H04B5/0031 , H04B5/0081
Abstract: Disclosed herein is a wiring component that includes a base material and a planar coil pattern formed on the base material. The planar coil pattern includes a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion connected to the first connecting position; and a connection wiring portion that short-circuits the second connecting position and the third connecting position. A cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.
-
公开(公告)号：US11466368B2
公开(公告)日：2022-10-11
申请号：US16046422
申请日：2018-07-26
Applicant: TDK CORPORATION
Inventor： Makoto Orikasa , Yuhei Horikawa , Yoshihiro Kanbayashi , Hisayuki Abe , Hiroki Ashizawa , Miho Mori , Misaki Tamura
IPC: C23C18/16 , C23C18/31 , H05K1/03 , H05K3/06 , H05K3/18 , B32B15/00 , C23C18/38 , C23C18/30 , C23C18/32
Abstract: A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.
-
公开(公告)号：US10304779B2
公开(公告)日：2019-05-28
申请号：US15791888
申请日：2017-10-24
Applicant: TDK Corporation
Inventor： Makoto Orikasa , Yuhei Horikawa , Hisayuki Abe , Yoshihiro Kanbayashi
IPC: H01L23/552 , H01L21/3205 , H01L21/56 , H01L21/288 , H01L23/31 , H01L23/00
Abstract: Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.
-
公开(公告)号：US20180174748A1
公开(公告)日：2018-06-21
申请号：US15840243
申请日：2017-12-13
Applicant: TDK Corporation
Inventor： Yuhei Horikawa , Makoto Orikasa , Yoshihiro Kanbayashi , Hisayuki Abe , Hirohumi Asou , Kosuke Kunitsuka
CPC classification number: H01F41/043 , C23C18/1607 , C23C18/1641 , C23C18/1653 , C25D5/48 , C25D13/12 , C25D13/22 , G06K19/07783 , H01F41/04 , H01F41/041 , H01F41/045 , H01F41/10 , H01Q1/36 , H01Q1/38 , H01Q1/48 , H01Q7/00 , H01Q9/27 , H05K3/181 , H05K3/188 , H05K3/241 , H05K3/242 , H05K3/246
Abstract: Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.
-
-
-
-
-
-
-
Search Results
8
records
(took 0.013 seconds)
