公开(公告)号：US3427709A

公开(公告)日：1969-02-18

申请号：US3427709D

申请日：1965-10-24

Applicant: TELEFUNKEN PATENT

Inventor： SCHUTZE HANS-JURGEN ,  HENNINGS KLAUS

IPC: H01L21/74 ,  H01L23/48 ,  H01L27/00 ,  H01L27/06 ,  H01L29/08 ,  H01L5/00 ,  H01L7/36

CPC classification number: H01L29/0821 ,  H01L21/74 ,  H01L23/481 ,  H01L27/00 ,  H01L27/0652 ,  H01L2924/0002 ,  Y10S148/049 ,  Y10S148/085 ,  Y10S438/928 ,  H01L2924/00

公开(公告)号：US3462650A

公开(公告)日：1969-08-19

申请号：US3462650D

申请日：1966-05-06

Applicant: TELEFUNKEN PATENT

Inventor： HENNINGS KLAUS ,  SCHUTZE HANS-JURGEN ,  ULBRICHT GERHARD

IPC: H01L21/00 ,  H01L21/762 ,  H01L21/764 ,  H01L21/768 ,  H01L21/822 ,  H01L21/8222 ,  H01L23/48 ,  H01L23/64 ,  H01L27/00 ,  H01L27/06 ,  H01L29/06 ,  H01L49/02 ,  H01L19/00 ,  H01L11/00

CPC classification number: H01L29/0657 ,  H01L21/00 ,  H01L21/76297 ,  H01L21/764 ,  H01L21/76898 ,  H01L21/8221 ,  H01L21/8222 ,  H01L23/481 ,  H01L23/647 ,  H01L24/24 ,  H01L27/00 ,  H01L27/0688 ,  H01L49/02 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10S148/085 ,  Y10S148/122 ,  H01L2924/00

公开(公告)号：US3461548A

公开(公告)日：1969-08-19

申请号：US3461548D

申请日：1965-07-29

Applicant: TELEFUNKEN PATENT

Inventor： SCHUTZE HANS-JURGEN ,  HENNINGS KLAUS

IPC: H01L21/00 ,  H01L21/60 ,  H01L25/16 ,  H01L27/00 ,  H01L49/02 ,  B01J17/00 ,  H05K3/00

CPC classification number: H01L27/00 ,  H01L21/00 ,  H01L24/81 ,  H01L25/16 ,  H01L49/02 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00

公开(公告)号：US3456335A

公开(公告)日：1969-07-22

申请号：US3456335D

申请日：1966-07-07

Applicant: TELEFUNKEN PATENT

Inventor： HENNINGS KLAUS ,  SCHUTZE HANS-JURGEN

IPC: H01L21/60 ,  H01L21/762 ,  H01L21/764 ,  H01L23/48 ,  B01J17/00 ,  H01L1/00

CPC classification number: H01L24/80 ,  H01L21/76297 ,  H01L21/764 ,  H01L23/481 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  Y10S148/085 ,  Y10T29/4913 ,  H01L2924/00

公开(公告)号：US3427708A

公开(公告)日：1969-02-18

申请号：US3427708D

申请日：1965-04-21

Applicant: TELEFUNKEN PATENT

Inventor： SCHUTZE HANS-JURGEN ,  HENNINGS KLAUS

IPC: H01L21/78 ,  H01L23/485 ,  H01L5/00 ,  H01L7/02

CPC classification number: H01L21/78 ,  H01L23/485 ,  H01L2924/0002 ,  Y10S148/028 ,  Y10S148/051 ,  Y10S148/085 ,  Y10S148/135 ,  Y10S438/977 ,  H01L2924/00

公开(公告)号：US3689992A

公开(公告)日：1972-09-12

申请号：US3689992D

申请日：1965-08-02

Applicant: TELEFUNKEN PATENT

Inventor： SCHUTZE HANS-JURGEN ,  KLAUS HENNINGS

IPC: H01L21/60 ,  H01L21/74 ,  H01L21/762 ,  H01L25/16 ,  H01L27/00 ,  B01J17/00 ,  H01L1/16

CPC classification number: H01L24/80 ,  H01L21/74 ,  H01L21/76264 ,  H01L21/76289 ,  H01L21/76297 ,  H01L25/165 ,  H01L27/00 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30105 ,  Y10S148/051 ,  Y10S148/085 ,  Y10S148/145 ,  Y10S438/928 ,  H01L2924/00

Abstract: A solid state circuit arrangement having a semiconductor member and presenting reduced shunt capacitances as the result of the isolation of various regions of the member from each other and a method for fabricating such arrangement by forming a subassembly of two members, constituted by a first insulating layer and the semiconductor member, by depositing one of the members on the surface of the other thereof, depositing a second insulating layer on the side of the semiconductor member which is opposite from the surface upon which the first layer bears, forming apertures in at least one of the insulating layers to expose surface portions of the semiconductor member, and etching out the portions of the semiconductor member in the region of each aperture to create cavities which extend from one of the insulating layers to the other.

Abstract translation: 一种固态电路装置，其具有半导体部件，并且由于将部件的各个区域彼此隔离而呈现出减小的分流电容，以及通过形成由第一绝缘层构成的两个部件的子组件来制造这种布置的方法 和所述半导体部件，通过在所述半导体部件的另一面的表面上沉积其中一个部件，在所述半导体部件的与所述第一层承载的表面相反的一侧上沉积第二绝缘层， 的绝缘层以暴露半导体部件的表面部分，并且在每个孔的区域中蚀刻半导体部件的部分以产生从绝缘层之一延伸到另一个的空腔。

公开(公告)号：US3462322A

公开(公告)日：1969-08-19

申请号：US3462322D

申请日：1965-11-30

Applicant: TELEFUNKEN PATENT

Inventor： HENNINGS KLAUS ,  SCHUTZE HANS-JURGEN

IPC: C30B25/00 ,  H01L21/00 ,  H01L21/20 ,  H01L29/73 ,  H01L7/36

CPC classification number: H01L29/73 ,  C30B25/00 ,  H01L21/00 ,  Y10S148/007 ,  Y10S148/085 ,  Y10S148/135 ,  Y10S438/977 ,  Y10T29/4981 ,  Y10T29/49812