LIGHT-CURING REACTIVE ADHESIVE FILM

    公开(公告)号:US20230117532A1

    公开(公告)日:2023-04-20

    申请号:US17955755

    申请日:2022-09-29

    Applicant: tesa SE

    Abstract: The present invention relates to a light-curing, reactive, pressure-sensitive adhesive film of adhesive. With the film of adhesive of the invention, structural bond strengths can be achieved. The film of adhesive comprises (a) at least one reactive monomer or reactive resin, (b) an initiator, (c) a photoredox catalyst, (d) a polymer of monomers comprising N-vinyl compounds and (e) a film-forming polymer.

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