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公开(公告)号:US11845887B2
公开(公告)日:2023-12-19
申请号:US17380432
申请日:2021-07-20
Applicant: TESA SE
Inventor: Katja Meyer , Tim Baumann , Christoph Nagel
IPC: C09J7/29 , C09J7/38 , B32B5/02 , B32B5/18 , B32B5/24 , B32B7/12 , B32B15/14 , B32B27/12 , B32B27/40 , B32B37/12 , C09J5/00 , B32B5/32
CPC classification number: C09J7/29 , B32B5/024 , B32B5/18 , B32B5/245 , B32B7/12 , B32B15/14 , B32B27/12 , B32B27/40 , B32B37/12 , C09J5/00 , C09J7/385 , B32B5/32 , B32B2262/101 , B32B2266/0242 , B32B2266/0278 , B32B2307/3065 , B32B2307/718 , B32B2307/732 , B32B2405/00 , C09J2203/354 , C09J2301/122 , C09J2301/16 , C09J2301/302 , C09J2400/143 , C09J2400/163 , C09J2400/243 , C09J2433/00 , C09J2475/006
Abstract: The present invention relates to a diecut especially for the permanent closing of holes especially in metal sheets or in plastics parts, having a carrier composed of an assembly, more particularly laminate in the specified layer sequence, of optionally at least one first layer, which is formed by a metallic layer having a thickness of 10 to 40 μm, optionally at least one second layer, which is formed by a woven glass fabric or laid glass fabric having a basis weight of 30 to 200 g/m2, optionally at least one third layer, which is formed by a first pressure-sensitive adhesive having a basis weight of 70 to 200 g/m2, at least one fourth layer, which is formed by a flame-retardant foam having a thickness of at least 0.5 to 2.5 mm, and at least one fifth layer, which is formed by a second, acrylate-based pressure-sensitive adhesive having a basis weight of 300 to 1800 g/m2, preferably 360 to 1500 g/m2 and/or a thickness of 400 to 1800 μm, preferably 800 to 1500 μm.
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公开(公告)号:US11939500B2
公开(公告)日:2024-03-26
申请号:US17449177
申请日:2021-09-28
Applicant: tesa SE
Inventor: Katja Meyer , Tim Baumann , Christoph Nagel
CPC classification number: C09J7/29 , B32B5/022 , B32B5/024 , B32B7/12 , B32B9/04 , B32B15/14 , B32B15/20 , C09J7/385 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/718 , B32B2307/732
Abstract: Diecuts and methods for closing of holes in metal sheets or in plastics parts are disclosed. The diecuts have a carrier composed of an assembly that comprises a metallic first layer having a thickness of 10 to 40 μm, a second layer of a woven or laid glass fabric having a basis weight of 30 to 200 g/m2, an optional first adhesive third layer, an unexpanded expandable graphite fourth layer having a thickness of at least 0.2 to 3.0 mm, and a second adhesive fifth layer. The expandable graphite being present in the fourth layer to an extent of at least 80 wt % and fifth layer being formed by an adhesive having a basis weight of 300 to 1800 g/m2 and/or a thickness of 400 to 1800 μm.
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公开(公告)号:US11208581B2
公开(公告)日:2021-12-28
申请号:US16336376
申请日:2017-09-12
Applicant: TESA SE
Inventor: Sebastian Dietze , Kim Elsenbach , Frank Hannemann , Björn Zeysing , Uwe Schümann , Matthias Seibert , Katja Meyer , Bernd Dietz , Jasmin Flucke , Amy Kaus
IPC: C09J175/14 , C09J7/35 , C09J7/38 , B29C48/67 , B29C48/02 , B29C48/15 , B29C48/40 , B29B7/48 , B29B7/60 , B29B7/72 , B29B7/84 , B29B7/86 , B29B7/90 , C08G18/22 , C08G18/32 , C08G18/65 , C08G18/69 , C08G18/75 , C08G18/87 , C09J11/04 , C09J11/06 , B29C48/00 , C08K3/011 , C08K3/013 , C08K3/06 , C08K5/40 , C08K5/47 , C08L63/00
Abstract: Thermally vulcanisable, meltable adhesives and processes have a meltable polybutadiene-polyurethane, ground sulphur and optionally at least one vulcanisation accelerator, at least one filling material, at least one epoxide resin, at least one tackifier resin, bitumen, at least one softener and further auxiliary and additive materials, wherein said adhesives and processes can be thermally vulcanised within a temperature range of 130° C. to 230° C., such that same, as well as an adhesive strip produced from same, can be used for adhesion and/or sealing in the automotive industry, as well as in structural work on oiled sheet metal, and in the painting line on e-coated or otherwise painted sheet metal, for example, for crimp fold adhesion, for crimp fold sealing, for seam sealing, for lining adhesion, for hole closure and much more.
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公开(公告)号:US10946629B2
公开(公告)日:2021-03-16
申请号:US16414171
申请日:2019-05-16
Applicant: tesa SE
Inventor: Katja Meyer , Matthias Seibert
IPC: C09J7/24 , C09J7/25 , C09J7/29 , C09J133/08 , B32B7/02 , B32B27/08 , B32B27/20 , B32B27/30 , B32B27/32 , B32B27/34 , C09J7/38 , B32B3/26 , B32B11/04 , C09J7/35 , B32B7/12 , B29C73/10 , B32B7/027
Abstract: Diecuts are configured for permanent closing of holes and have a carrier comprising an assembly of at least two polymeric films. An upper film of the at least two polymeric films has a basis weight of at least 1.0 kg/m2 and a lower film of the at least two polymeric films consisting of at least two layers, wherein a first layer is in the form of a polymeric film and faces the upper film, and a second layer is in the form of a functional layer with a side of the lower film, facing away from the upper film, bears an applied adhesive composition.
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