-
公开(公告)号：US20080029476A1
公开(公告)日：2008-02-07
申请号：US10594599
申请日：2005-02-24
IPC分类号： H01B13/00
CPC分类号： H05K1/024 , H05K1/0216 , H05K1/0242 , H05K3/389
摘要： A circuit board having high adhessiveness contact between electrically insulating layers and having a low interlayer electric resistance is provided. A circuit board is provided with a first conductive layer formed on a core (1) and a first electrically insulating layer formed thereon. In the circuit board, a first conductor layer has a surface roughness Ra of 0.1 nm or more but less than 100 nm, and a first primer layer having a thiol compound as a main material is provided between the first conductive layer and the first electrically insulating layer. Thus, the circuit board which has excellent adhesiveness between the first conductor layer and the first electrically insulating layer and is also applicable to high frequency signal is provided.
摘要翻译： 提供一种电绝缘层之间具有高粘合性接触并具有低层间电阻的电路板。 电路板设置有形成在芯部（1）上的第一导电层和形成在其上的第一电绝缘层。 在电路板中，第一导体层的表面粗糙度Ra为0.1nm以上且小于100nm，在第一导电层和第一电绝缘层之间设置具有硫醇化合物作为主要材料的第一底漆层 层。 因此，提供了在第一导体层和第一电绝缘层之间具有优异的粘合性并且也适用于高频信号的电路板。
-
2.发明申请Circuit board, electronic device employing circuit board, and mehtod of producing circuit board 审中-公开电路板，采用电路板的电子设备，以及电路板生产线公开(公告)号：US20060158865A1
公开(公告)日：2006-07-20
申请号：US10525329
申请日：2003-08-25
CPC分类号： H05K1/024 , H05K3/4676 , H05K3/4688
摘要： A circuit board (100) having an insulator layer and a conductor (104) buried in the insulator layer, wherein the insulator layer has a first insulator (101) satisfying a relation μr≧εr, assuming εr is the dielectric constant and μr is the relative permeability, and the conductor is substantially surrounded by the first insulator.
摘要翻译： 一种电路板（100），具有绝缘体层和埋在所述绝缘体层中的导体（104），其中所述绝缘体层具有第一绝缘体（101），所述第一绝缘体（101）满足关系式，其中，ε=介电常数， 相对导磁率和导体基本上被第一绝缘体包围。
-
3.发明申请Apparatus for Producing Electronic Device Such as Display Device, Method of Producing Electronic Device Such as Display Device, and Electronic Device Such as Display Device 审中-公开用于制造诸如显示装置的电子装置的装置，诸如显示装置的电子装置的制造方法以及诸如显示装置的电子装置公开(公告)号：US20080315201A1
公开(公告)日：2008-12-25
申请号：US11992046
申请日：2005-09-16
申请人： Tadahiro Ohmi , Akihiro Morimoto , Takeyoshi Kato
发明人： Tadahiro Ohmi , Akihiro Morimoto , Takeyoshi Kato
IPC分类号： H01L29/04 , C23C16/513 , H01L21/263
CPC分类号： H01L27/1288 , H01L27/1292 , H01L29/66765
摘要： An object of the present invention is to reduce an adverse effect of an atmosphere in a heat treatment device used in production of an electronic device, imparted on characteristics of the produced electronic device. To attain the object, an inner surface of the heat treatment device is covered with an oxide passive-state film and bringing the surface roughness of the inner surface to 1 μm or less in terms of a central mean roughness Ra. According to this type of heat treatment device, in curing a heat curable resin, deterioration in the heat curable resin caused by decomposition or dissociation of the heat curable resin, can be reduced.
摘要翻译： 本发明的一个目的是减少赋予所生产的电子设备的特性的用于生产电子设备的热处理装置中的气氛的不良影响。 为了实现该目的，热处理装置的内表面被氧化物被动状态膜覆盖，并且以中心平均粗糙度Ra为基准使内表面的表面粗糙度为1μm以下。 根据这种类型的热处理装置，在固化热固性树脂时，可以降低由热固性树脂的分解或解离引起的热固性树脂的劣化。
-
公开(公告)号：US20070024800A1
公开(公告)日：2007-02-01
申请号：US10558934
申请日：2004-06-01
IPC分类号： G02F1/1333
CPC分类号： H05K3/107 , H05K3/0023 , H05K3/143 , H05K2201/0108
摘要： A photosensitive transparent resin film, provided selectively with a groove reaching a transparent substrate is formed on the transparent substrate, and a wiring portion is provided in the groove substantially in flush with the photosensitive transparent resin film. The wiring portion can be formed quickly while controlling the thickness easily by preprocessing the surface of the photosensitive transparent resin film or the bottom face of the groove before the wiring portion is set in the groove.
摘要翻译： 选择性地设置到达透明基板的槽的光敏透明树脂膜形成在透明基板上，并且布线部分设置在基本上与感光透明树脂膜齐平的槽中。 在将布线部分设置在槽中之前，可以通过预处理感光性透明树脂膜的表面或槽的底面来容易地控制厚度，同时可以快速形成布线部分。
-
5.发明授权Thin film transistor integrated circuit device, active matrix display device, and manufacturing methods of the same 失效薄膜晶体管集成电路器件，有源矩阵显示器件及其制造方法公开(公告)号：US08064003B2
公开(公告)日：2011-11-22
申请号：US10581035
申请日：2004-11-26
IPC分类号： G02F1/136
CPC分类号： G02F1/1368 , G02F2001/133357 , H01L27/12 , H01L27/124 , H01L27/1248 , H01L27/1285 , H01L27/1292 , H01L29/41733 , H01L29/66742 , H01L29/78636
摘要： There is provided an active matrix display device including a flattening layer formed so as to surround a source electrode wiring, a drain electrode wiring, and a signal line, so that the source electrode wiring, the drain electrode wiring, and the signal line form substantially the same surface with the flattening layer.
摘要翻译： 提供了一种有源矩阵显示装置，包括形成为围绕源电极布线，漏电极布线和信号线形成的平坦化层，使得源极电极布线，漏电极布线和信号线基本上形成 与平整层相同的表面。
-
6.发明申请Circuit Board, Method Of Manufacturing Circuit Board, And Display Device Having Circuit Board 审中-公开电路板，制造电路板的方法和具有电路板的显示装置公开(公告)号：US20070209200A1
公开(公告)日：2007-09-13
申请号：US10594596
申请日：2005-03-30
申请人： Tadahiro Ohmi , Keiichi Nii , Teruhiko Suzuki , Takeyoshi Kato
发明人： Tadahiro Ohmi , Keiichi Nii , Teruhiko Suzuki , Takeyoshi Kato
IPC分类号： H05K3/10
CPC分类号： H05K3/1258 , G02F2001/136295 , G03F7/40 , H01L21/481 , H05K3/0023 , H05K3/0073 , H05K3/1241 , H05K3/184 , H05K2203/0568 , H05K2203/087 , H05K2203/095 , Y10T29/49155
摘要： A circuit board manufacturing method includes formation of a thermosetting photosensitive resin film on an insulating board by a spin coat method and the like, exposure of the photosensitive resin film to radiation rays such as ultraviolet rays, development with a developer or by etching, heat-hardening of the photosensitive resin film, oxygen plasma treatment or ultraviolet treatment if required, adjustment of a water quantity in the photosensitive resin film by drying the resin film, exposure in a fluorine gas atmosphere, anneal treatment, and then immersion of the resin film in a fluorinated acid chemical.
摘要翻译： 电路板的制造方法包括通过旋涂法等在绝缘基板上形成热固性感光性树脂膜，将感光性树脂膜照射到紫外线等照射线，用显影剂显影或通过蚀刻， 感光性树脂膜的硬化，如果需要，进行氧等离子体处理或紫外线处理，通过干燥树脂膜来调整感光性树脂膜中的水分量，在氟气氛中曝光，退火处理，然后将树脂膜浸渍在 氟化酸化学品。
-
7.发明申请Gas production facility, gas supply container, and gas for manufacture of electronic devices 审中-公开天然气生产设备，气体供应容器和用于制造电子设备的气体公开(公告)号：US20110124928A1
公开(公告)日：2011-05-26
申请号：US12929271
申请日：2011-01-12
申请人： Tadahiro Ohmi , Yasuyuki Shirai , Takeyoshi Kato , Kimiaki Tanaka , Masahiro Nakamura , Katsutomo Tanaka
发明人： Tadahiro Ohmi , Yasuyuki Shirai , Takeyoshi Kato , Kimiaki Tanaka , Masahiro Nakamura , Katsutomo Tanaka
摘要： An apparatus for producing a gas using a raw material gas having high reactivity, in particular, a fluorinated hydrocarbon, or a vessel for supplying the gas, characterized in that the surface of a portion thereof contacting with the gas has an average roughness of 1 μm or less in terms of a center line average roughness Ra. It is preferred that an oxide-based passivated film such as a film based on chromium oxide, aluminum oxide, yttrium oxide, magnesium oxide or the like is formed on the surface having a roughness controlled as above. The above apparatus and vessel can be suitably used for preventing the contamination of a raw material gas originated from a gas production apparatus or a vessel for supplying the gas.
摘要翻译： 使用反应性高的原料气体，特别是氟化烃或用于供给气体的容器来制造气体的装置，其特征在于，与气体接触的部分的表面的平均粗糙度为1μm 或更小的中心线平均粗糙度Ra。 优选在具有如上控制的粗糙度的表面上形成氧化物基钝化膜，例如基于氧化铬，氧化铝，氧化钇，氧化镁等的膜。 上述设备和容器可适用于防止源自气体生产设备或用于供应气体的容器的原料气体的污染。
-
8.发明申请Gas Production Facility, Gas Supply Container, And Gas For Manufacture Of Electronic Devices 审中-公开气体生产设备，气体供应集装箱和气体制造电子设备公开(公告)号：US20070282142A1
公开(公告)日：2007-12-06
申请号：US10592278
申请日：2005-02-16
申请人： Tadahiro Ohmi , Yasuyuki Shirai , Takeyoshi Kato , Kimiaki Tanaka , Masahiro Nakamura , Katsutomo Tanaka
发明人： Tadahiro Ohmi , Yasuyuki Shirai , Takeyoshi Kato , Kimiaki Tanaka , Masahiro Nakamura , Katsutomo Tanaka
摘要： An apparatus for producing a gas using a raw material gas having high reactivity, in particular, a fluorinated hydrocarbon, or a vessel for supplying the gas, characterized in that the surface of a portion thereof contacting with the gas has an average roughness of 1 μm or less in terms of a center line average roughness Ra. It is preferred that an oxide-based passivated film such as a film based on chromium oxide, aluminum oxide, yttrium oxide, magnesium oxide or the like is formed on the surface having a roughness controlled as above. The above apparatus and vessel can be suitably used for preventing the contamination of a raw material gas originated from a gas production apparatus or a vessel for supplying the gas.
摘要翻译： 使用高反应性的原料气体，特别是氟化烃或用于供给气体的容器来生产气体的装置，其特征在于，与气体接触的部分的表面的平均粗糙度为1μm 或更小的中心线平均粗糙度Ra。 优选在具有如上控制的粗糙度的表面上形成氧化物基钝化膜，例如基于氧化铬，氧化铝，氧化钇，氧化镁等的膜。 上述设备和容器可适用于防止源自气体生产设备或用于供应气体的容器的原料气体的污染。
-
9.发明授权Metal material having formed thereon chromium oxide passive film and method for producing the same, and parts contacting with fluid and system for supplying fluid and exhausting gas 失效在其上形成有氧化铬钝化膜的金属材料及其制造方法，以及与流体接触的部件和用于供应流体和排出气体的系统公开(公告)号：US07935385B2
公开(公告)日：2011-05-03
申请号：US10646855
申请日：2003-08-21
申请人： Tadahiro Ohmi , Yasuyuki Shirai , Nobukazu Ikeda , Eiji Ideta , Akihiro Morimoto , Tetsutaro Ogushi , Takehisa Konishi
发明人： Tadahiro Ohmi , Yasuyuki Shirai , Nobukazu Ikeda , Eiji Ideta , Akihiro Morimoto , Tetsutaro Ogushi , Takehisa Konishi
CPC分类号： C23C8/02 , C23C26/00 , Y10T428/24322 , Y10T428/24355 , Y10T428/31678
摘要： The object of the present invention is to form a chromium-oxide film excellent in corrosion resistance without containing an oxide film of other metal onto the optional metallic material. The chromium-oxide passivation film excellent in corrosion resistance without containing the oxide film of other metal can be formed inexpensively and in a short time, and a fluid supplying system for supplying fluid hard in corrosivity in safety is able to be provided. This invention comprises a step of forming the passivation film consisting of a chromium oxide by giving heat treatment in an oxidizing atmosphere after coating chromium on metallic material of which surface roughness (Ra) of a coat surface is not more than 1.5 μm
摘要翻译： 本发明的目的是在不含任何金属材料的其它金属的氧化物膜的情况下，形成耐腐蚀性优异的氧化铬膜。 能够廉价且短时间地形成不含有其他金属的氧化物膜的耐腐蚀性优异的氧化铬钝化膜，能够提供安全的腐蚀性难以供给流体的流体供给系统。 本发明包括以下步骤：在涂覆表面的粗糙度（Ra）不大于1.5μm的金属材料上涂覆铬后，在氧化气氛中进行热处理，形成由氧化铬组成的钝化膜
-
公开(公告)号：US07673649B2
公开(公告)日：2010-03-09
申请号：US10597303
申请日：2005-01-13
申请人： Tadahiro Ohmi , Yukio Minami , Kenji Tubota , Tsutomu Shinohara , Michio Yamaji , Nobukazu Ikeda , Akihiro Morimoto , Koji Kawada , Toshio Nariai
发明人： Tadahiro Ohmi , Yukio Minami , Kenji Tubota , Tsutomu Shinohara , Michio Yamaji , Nobukazu Ikeda , Akihiro Morimoto , Koji Kawada , Toshio Nariai
IPC分类号： B65D81/20
CPC分类号： F16K51/02 , Y10T137/6606 , Y10T137/7043 , Y10T137/7062
摘要： The present invention provides a vacuum thermal insulating valve that may be used at high temperature in gas supply systems or gas exhaust systems, and also may be made substantially small and compact in size owing to its excellent thermal insulating performance. With a vacuum thermal insulating valve comprising a valve equipped with a valve body and an actuator, and a vacuum thermal insulating box that houses the valve, the afore-mentioned vacuum thermal insulating box S is formed by a square-shaped lower vacuum jacket S5 having a cylinder-shaped vacuum thermal insulating pipe receiving part J on a side and with its upper face made open, and the square-shaped upper vacuum jackets S4, which is hermetically fitted to the lower vacuum jacket S5 and with its lower face made open.
摘要翻译： 本发明提供一种真空绝热阀，其可以在气体供给系统或排气系统中在高温下使用，并且由于其绝热性能优异，也可以制成大小小型的真空绝热阀。 使用包括阀体和致动器的阀的真空隔热阀和容纳阀的真空保温箱，上述真空保温箱S由方形的下部真空夹套S5形成， 圆筒形真空绝热管接收部分J的侧面并且其上表面打开，方形的上部真空夹套S4气密地装配到下部真空套筒S5上并且其下表面打开。
-
-
-
-
-
-
-
-
-
搜索结果
900 条记录 (耗时 0.029 秒)
