Abstract:
Semiconductor structures are provided. The semiconductor structure includes a plurality of gate structures extending in a first direction formed over a substrate and a contact formed adjacent to the gate structures over the substrate. The semiconductor structure further includes a plurality of metal layers formed over the gate structures. In addition, some of the metal layers include metal lines extending in the first direction, and some of the metal layers include metal lines extending in a second direction substantially perpendicular to the first direction. Furthermore, the gate structures follow the following equation: 0.2 P gate min + 0.35 L gate min + 0.3 H gate min - 20 0.2 L gate min + 0.8 H gate min - 5 × 0.3 L gate min + 0.3 H gate min + 5 38 ≤ 0.32 Pgate min is the minimum value among gate pitches of the gate structures. Lgate min is the minimum value among gate lengths of the gate structures. Hgate min is the minimum value among gate heights of the gate structures.
Abstract:
A method includes patterning a layer over a substrate with a first metal pattern; using a cut mask in a first position relative to the substrate to perform a first cut patterning for removing material from a first region within the first pattern; and using the same cut mask to perform a second cut patterning while in a second position relative to the same layer over the substrate, for removing material from a second region in a second metal pattern of the same layer over the substrate.
Abstract:
Semiconductor structures are provided. The semiconductor structure includes a plurality of gate structures extending in a first direction formed over a substrate. The gate structures follow the following equation: 0.2 P gate min + 0.35 L gate min + 0.3 H gate min - 20 0.2 L gate min + 0.8 H gate min - 5 × 0.3 L gate min + 0.3 H gate min + 5 38 ≤ 0.32 Pgate min is the minimum value among gate pitches of the gate structures, and Lgate min is the minimum value among gate lengths of the gate structures. Hgate min is the minimum value among gate heights of the gate structures.
Abstract:
A method includes patterning a layer over a substrate with a first metal pattern; using a cut mask in a first position relative to the substrate to perform a first cut patterning for removing material from a first region within the first pattern; and using the same cut mask to perform a second cut patterning while in a second position relative to the same layer over the substrate, for removing material from a second region in a second metal pattern of the same layer over the substrate.
Abstract:
A method identifies, as an independent node, any node representing a circuit pattern in any odd loop of a layout of a region of a layer of an IC that is not included in any other odd loop of the layout. The layer is to have a plurality of circuit patterns to be patterned using at least three photomasks. The method identifies, as a safe independent node, any independent node not closer than a threshold distance from any other independent nodes in another odd loop of the layout. The layout is modified, if the circuit patterns in the layout include any odd loop without any safe independent node, so that that after the modifying, each odd loop has at least one safe independent node.