利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

21 条记录 (耗时 0.029 秒)

    CHLOROTRIFLUOROETHYLENE COPOLYMER CONTAINING LAMINATE AND PROCESS FOR PRODUCTION THEREOF
    1.
    发明申请
    CHLOROTRIFLUOROETHYLENE COPOLYMER CONTAINING LAMINATE AND PROCESS FOR PRODUCTION THEREOF 审中-公开
    包含层压板的氯乙烯共聚物及其生产方法

    公开(公告)号：US20090053443A1

    公开(公告)日：2009-02-26

    申请号：US11908286

    申请日：2006-03-10

    申请人： Takahiro Kitahara ,  Takeshi Shimono ,  Takahisa Aoyama ,  Shingo Sakakibara

    发明人： Takahiro Kitahara ,  Takeshi Shimono ,  Takahisa Aoyama ,  Shingo Sakakibara

    IPC分类号： B32B9/00 ,  B29D23/00 ,  B29C47/06 ,  B32B1/08 ,  B32B27/08

    CPC分类号： C08F214/24 ,  B29C48/022 ,  B29C48/023 ,  B29C48/07 ,  B29C48/08 ,  B29C48/09 ,  B29C48/10 ,  B29C48/21 ,  B29C48/30 ,  B29C48/336 ,  B29K2027/12 ,  B29K2027/18 ,  B29K2105/256 ,  B29L2009/00 ,  B29L2023/00 ,  B32B27/28 ,  Y10T428/1393 ,  Y10T428/31544

    摘要： The present invention provides a CTFE copolymer-containing laminate produced by coextrusion molding of a PFA and/or FEP layer and a CTFE copolymer layer with the thermal degradation of the latter layer being suppressed and the liquid chemical impermeability and gas barrier properties, among others, being improved as well as a method of producing the same. The present invention is a chlorotrifluoroethylene copolymer-containing laminate having a layer (A) comprising a tetrafluoroethylene/perfluoro(vinyl ether) copolymer and/or a tetrafluoroethylene/hexafluoropropylene copolymer and a layer (B) comprising a chlorotrifluoroethylene copolymer, the layer (A) and the layer (B) being formed by coextrusion molding under a condition such that the temperature of a flow path (pa) through which a layer (A)-forming material (a) flows is 300 to 400° C. and the temperature of a flow path (pb) through which a layer (B)-forming material (b) flows is 250 to 350° C. prior to the material (a) and the material (b) coming into contact with each other in a multilayer die.

    摘要翻译： 本发明提供了通过共挤出成型PFA和/或FEP层和CTFE共聚物层制备的含CTFE共聚物的层压板，其后层的热降解被抑制，并且液体化学不透性和气体阻隔性能， 以及其制备方法。 本发明是含有四氟乙烯/全氟（乙烯基醚）共聚物和/或四氟乙烯/六氟丙烯共聚物的层（A）和含有三氟氯乙烯共聚物的层（B）的含氯三氟乙烯共聚物的层压体，层（A） 并且所述层（B）通过共挤出成型在使（A）成形材料（a）流过的流路（pa）的温度为300〜400℃的条件下形成， 在材料（a）和材料（b）在多层模具中彼此接触之前，层（B）形成材料（b）通过其流动的流动路径（pb）为250至350℃ 。

    MULTILAYER BODY
    4.
    发明申请
    MULTILAYER BODY 审中-公开
    多层体

    公开(公告)号：US20090291243A1

    公开(公告)日：2009-11-26

    申请号：US11917416

    申请日：2006-06-19

    申请人： Takahiro Kitahara ,  Shingo Sakakibara ,  Takeshi Shimono ,  Takeshi Inaba

    发明人： Takahiro Kitahara ,  Shingo Sakakibara ,  Takeshi Shimono ,  Takeshi Inaba

    IPC分类号： B32B27/30 ,  B32B27/32 ,  B32B27/00 ,  B32B1/08 ,  F16L11/04

    CPC分类号： B32B27/08 ,  B32B1/08 ,  B32B27/28 ,  B32B27/34 ,  F16L2011/047 ,  Y10T428/1393 ,  Y10T428/3154 ,  Y10T428/31544

    摘要： The present invention provides a laminate which is highly impermeable to fuels and has high fuel crack resistance. The present invention is a laminate having:a layer (A) comprising a fluorinated ethylenic polymer; a layer (B) comprising a chlorotrifluoroethylene copolymer; and a layer (C) comprising a fluorine-free organic material (P); the fluorinated ethylenic polymer being different from the chlorotrifluoroethylene copolymer forming the layer (B) in one and the same laminate and the layer (A), the layer (B), and the layer (C) being bonded together in that order.

    摘要翻译： 本发明提供一种对燃料高度不可渗透并且具有高燃料龟裂性的层压体。 本发明是一种层压体，其具有：含有氟化乙烯性聚合物的层（A） 包含氯三氟乙烯共聚物的层（B）; 和含有无机有机材料（P）的层（C）。 氟化乙烯类聚合物不同于在同一层压体中形成层（B）的氯三氟乙烯共聚物，层（A），层（B）和层（C）按顺序结合在一起。

    Fluororesin and coated electric wire
    5.
    发明申请
    Fluororesin and coated electric wire 有权
    氟树脂和涂层电线

    公开(公告)号：US20070149734A1

    公开(公告)日：2007-06-28

    申请号：US10580404

    申请日：2004-11-25

    申请人： Shingo Sakakibara ,  Norihiko Miki ,  Takahiro Kitahara

    发明人： Shingo Sakakibara ,  Norihiko Miki ,  Takahiro Kitahara

    IPC分类号： C08F16/24

    CPC分类号： C08F214/18 ,  B29C47/0016 ,  B29C47/025 ,  B29L2031/3462 ,  C08F14/18 ,  C08F214/26 ,  H01B3/445

    摘要： It is an object of the present invention to provide a fluororesin excellent in thin wall forming ability and capable of forming electric wire insulatings having good flame retardancy, thermal stability and electrical characteristics. The present invention relates to a fluororesin which does not cause cone break, when used for insulating a core wire having a diameter of 0.05 to 0.07 mm under the conditions of a resin temperature of 320 to 370° C., a drawdown rate [DDR] of 80 to 120, a draw rate balance [DRB] of 1.0, a wire coating speed of 700 feet/minute and a insulating thickness of 30 to 50 μm.

    摘要翻译： 本发明的目的是提供一种薄壁形成能力优异的氟树脂，并且能够形成具有良好阻燃性，热稳定性和电特性的电线绝缘体。 本发明涉及在树脂温度为320〜370℃的条件下，直径为0.05〜0.07mm的芯线绝缘时，不引起锥形断裂的氟树脂，拉伸速度[DDR] 为80〜120，拉伸速度平衡[DRB]为1.0，线涂速度为700英尺/分钟，绝缘厚度为30〜50μm。

    Semiconductor device
    9.
    发明申请
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US20070210392A1

    公开(公告)日：2007-09-13

    申请号：US11634384

    申请日：2006-12-06

    申请人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    发明人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    IPC分类号： H01L29/82

    CPC分类号： B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00011

    摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

    摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。

    SEMICONDUCTOR DEVICE
    10.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号：US20090096041A1

    公开(公告)日：2009-04-16

    申请号：US12333092

    申请日：2008-12-11

    申请人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    发明人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    IPC分类号： H01L29/84

    CPC分类号： B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/15153 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00011

    摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

    摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。