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27 条记录 (耗时 0.026 秒)

    Method of producing thermally expansive microcapsule
    2.
    发明授权
    Method of producing thermally expansive microcapsule 有权

    公开(公告)号：US06617363B2

    公开(公告)日：2003-09-09

    申请号：US10052701

    申请日：2002-01-17

    申请人： Takahiro Ohmura ,  Yasushi Nakata ,  Yasuhiro Kawaguchi

    发明人： Takahiro Ohmura ,  Yasushi Nakata ,  Yasuhiro Kawaguchi

    IPC分类号： C08J920

    CPC分类号： B01F17/0085 ,  B01J13/14

    摘要： A method of producing a thermally expansive microcapsule that is excellent in heat resistance and solvent resistance, narrow in breadth of the distribution of particle size, and extremely low in secondary cohesion of the particles when heated, wherein a polymer obtained from the component comprising not less than 80 weight % of monomer of nitrile series, less than weight % of monomer of non-nitrile series, and 0.05-1 weight % of at least tetrafunctional cross-linking agent and/or of long side chain of cross-linking agent is used to micro-encapsulate a volatile expanding agent that comes into its gaseous state at a temperature equal to or less than a softening point of the polymer.

    MASTERBATCH FOR FOAM MOLDING AND MOLDED FOAM
    3.
    发明申请
    MASTERBATCH FOR FOAM MOLDING AND MOLDED FOAM 有权
    用于泡沫成型和模制泡沫的主板

    公开(公告)号：US20110166242A1

    公开(公告)日：2011-07-07

    申请号：US13056203

    申请日：2009-09-16

    申请人： Yasuhiro Kawaguchi ,  Yoshiyuki Kosaka ,  Kenichi Matsumura

    发明人： Yasuhiro Kawaguchi ,  Yoshiyuki Kosaka ,  Kenichi Matsumura

    IPC分类号： C08L23/06 ,  C08L23/12 ,  C08L25/06

    CPC分类号： C08J9/32 ,  C08J3/226 ,  C08J2201/024 ,  C08J2203/22 ,  C08J2323/06 ,  C08J2323/12 ,  C08J2325/06

    摘要： The present invention has its object to provide a masterbatch for foam molding, which can be suitably used for molding processes involving high shearing force, such as kneading molding, calender molding, extrusion molding, and injection molding, which shows a high expansion ratio, and which yields a foamed product with a good appearance. The present invention also has its object to provide a foamed product using the masterbatch for foam molding.A masterbatch for foam molding comprises a base resin and a thermally expandable microcapsule, the base resin being a thermoplastic resin having a melting point of 100° C. or higher, the masterbatch containing 10 to 230 parts by weight of the thermally expandable microcapsule to 100 parts by weight of the base resin, and the masterbatch having a true density of 0.80 g/cm3 or more, a bulk density of 0.35 g/cm3 or more, and a masterbatch size of 450 mg/30 pieces or more.

    摘要翻译： 本发明的目的是提供一种发泡成型用母料，其可以适用于显示高发泡倍率的涉及高剪切力的捏合成型，压延成型，挤出成型，注射成型等成型工艺，以及 其产生具有良好外观的发泡产品。 本发明的目的还在于提供使用发泡成型用母料的发泡体。 用于发泡成型的母料包括基础树脂和热膨胀性微胶囊，所述基础树脂是熔点为100℃以上的热塑性树脂，所述母料含有10〜230重量份的所述热膨胀性微囊至100 基础树脂重量份，真空密度为0.80g / cm 3以上，母体密度为0.35g / cm 3以上，母料粒径为450mg / 30个以上的母料。

    ELECTRONIC CIRCUIT AND HEAT SINK
    4.
    发明申请
    ELECTRONIC CIRCUIT AND HEAT SINK 审中-公开
    电子电路和散热器

    公开(公告)号：US20130220676A1

    公开(公告)日：2013-08-29

    申请号：US13884672

    申请日：2011-11-11

    申请人： Yasuhiro Kawaguchi ,  Masataka Kubo

    发明人： Yasuhiro Kawaguchi ,  Masataka Kubo

    IPC分类号： F28F13/00 ,  F28F21/04

    CPC分类号： H05K1/0203 ,  F28F13/003 ,  F28F21/04 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 1010 Ohm·cm or more and a porosity of 15-50 vol %.

    摘要翻译： 本发明的电子电路包括：安装有电子部件的电路基板; 堆叠在所述电子部件上的导热片; 以及堆叠在导热片上的散热器。 散热器包括体积电阻率为10OΩ·cm以上且孔隙率为15〜50体积％的多孔陶瓷。

    THERMALLY EXPANDABLE MICROCAPSULE AND FOAM-MOLDED ARTICLE
    5.
    发明申请
    THERMALLY EXPANDABLE MICROCAPSULE AND FOAM-MOLDED ARTICLE 审中-公开
    热膨胀微孔和泡沫塑料制品

    公开(公告)号：US20110263746A1

    公开(公告)日：2011-10-27

    申请号：US13127552

    申请日：2009-09-16

    申请人： Yasuhiro Kawaguchi ,  Yoshiyuki Kosaka

    发明人： Yasuhiro Kawaguchi ,  Yoshiyuki Kosaka

    IPC分类号： C08L33/20 ,  C08J9/16 ,  C08J9/22 ,  C08L33/14

    CPC分类号： C08J9/228 ,  B01J13/14 ,  B29C67/247 ,  B29C70/66 ,  C08F220/44 ,  C08F220/50 ,  C08J9/32 ,  C08J2203/22 ,  C08J2333/22 ,  C08L51/10

    摘要： The present invention has its object to provide a thermally expandable microcapsule, which shows excellent heat resistance and a high expansion ratio and thereby can be suitably used for molding processes involving high shearing force, such as kneading molding, calender molding, extrusion molding, and injection molding. The present invention also has its object to provide a foamed product using the thermally expandable microcapsule. The present invention relates to a thermally expandable microcapsule, which comprises: a shell made of a polymer; and a volatile expansion agent as a core agent encapsulated in the shell, the storage elastic modulus (E′) of the shell at a temperature of 200° C. and a frequency of 10 Hz being 1×105 N/m2 or more, the storage elastic modulus (E′) of the shell at a temperature of 250° C. and a frequency of 10 Hz being 1×105 N/m2 or more, and a maximum displacement amount measured by thermomechanical analysis being 300 μm or more.

    摘要翻译： 本发明的目的是提供一种热膨胀性微胶囊，其显示出优异的耐热性和高膨胀率，因此可以适用于包括高剪切力在内的成型工艺，例如捏合成型，压延成型，挤压成型和注射 成型。 本发明的目的还在于提供一种使用该热膨胀性微胶囊的泡沫制品。 本发明涉及一种热可膨胀微胶囊，其包括：由聚合物制成的壳; 作为封装在外壳中的核心试剂的挥发性膨胀剂，壳的温度为200℃，频率为10Hz的储能弹性模量（E'）为1×10 5 N / m 2以上， 在250℃的温度和10Hz的频率为1×10 5 N / m 2以上的壳体的储能弹性模量（E'）为300μm以上，通过热机械分析测定的最大位移量为300μm以上。

    Molded Foam Article and Method of Producing Molded Foam Article
    6.
    发明申请
    Molded Foam Article and Method of Producing Molded Foam Article 审中-公开
    成型泡沫制品及其制造方法

    公开(公告)号：US20090148698A1

    公开(公告)日：2009-06-11

    申请号：US12087051

    申请日：2006-12-25

    申请人： Yasuhiro Kawaguchi ,  Takashi Sawa

    发明人： Yasuhiro Kawaguchi ,  Takashi Sawa

    IPC分类号： B32B5/20 ,  B29C44/02

    CPC分类号： B29C44/586 ,  C08J9/32 ,  C08J2203/22 ,  Y10T428/268

    摘要： It is an object of the present invention to provide: a foaming mold having a high expansion ratio and a light weight and having an excellent appearance with no surface roughness; and a method for producing a foaming mold, whereby even in the case of using thermally expandable microcapsules for injection molding, the thermally expandable microcapsules can expand uniformly to give a foaming mold having a high expansion ratio and an excellent appearance.The invention is a foaming mold having uniform and closed cells, which has a cell diameter of 60 to 120 μm, a specific gravity of 0.6 g/ml or less, and a surface roughness of 4 μm or less.

    摘要翻译： 本发明的目的是提供一种发泡模具，其发泡倍率高，重量轻，外观美观，无表面粗糙度; 以及发泡模具的制造方法，即使在使用用于注射成型的热膨胀性微胶囊的情况下，热膨胀性微胶囊也能够均匀地膨胀，得到发泡模具的发泡倍率高，外观美观。 本发明是具有均匀且闭孔的发泡模具，其单元直径为60〜120μm，比重为0.6g / ml以下，表面粗糙度为4μm以下。

    Apparatus for processing photosensitive material
    8.
    发明授权
    Apparatus for processing photosensitive material 失效
    感光材料处理设备

    公开(公告)号：US5839011A

    公开(公告)日：1998-11-17

    申请号：US910220

    申请日：1997-08-13

    申请人： Jun Urasaki ,  Yoshikazu Takano ,  Akira Kunihiro ,  Eiji Miyasaka ,  Masaharu Kimura ,  Yasuhiro Kawaguchi

    发明人： Jun Urasaki ,  Yoshikazu Takano ,  Akira Kunihiro ,  Eiji Miyasaka ,  Masaharu Kimura ,  Yasuhiro Kawaguchi

    IPC分类号： G03F7/30 ,  G03D5/06

    CPC分类号： G03F7/3042

    摘要： The apparatus for coating a lithographic printing plate or a photosensitive material (M) with a processing liquid comprises first and second pairs of feed rollers (41,42: 44,45) for feeding the photosensitive arterial along a predetermined path. A coating roller (125) is provided therebetween. Guide members (48, 49) contact the bottom surface of the photosensitive material and to guide the photosensitive material. The contacts of the guide members and the photosensitive material are at the levels higher than the coating level at which the processing liquid is applied to the photosensitive material to prevent uneven coating of the photosensitive material with the processing liquid after the trailing edge of the photosensitive material has passed the first pairs of the feed rollers (41,42).

    摘要翻译： 用处理液涂布平版印刷版或感光材料（M）的装置包括用于沿预定路径馈送光敏动脉的第一和第二对进给辊（41,42：44,45）。 在其间设置有涂布辊（125）。 引导构件（48,49）接触感光材料的底表面并引导感光材料。 引导构件和感光材料的触点的高度高于将处理液体施加到感光材料上的涂层水平，以防止感光材料与感光材料的后缘之后的处理液体的不均匀涂覆 已经通过了第一对进给辊（41,42）。